IEC TR 60068-3-15:2024
(Main)Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.
General Information
Standards Content (Sample)
IEC TR 60068-3-15 ®
Edition 1.0 2024-02
TECHNICAL
REPORT
colour
inside
Environmental testing –
Part 3-15: Supporting documentation and guidance – Vacuum-assisted reflow
soldering
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews, graphical symbols and the glossary.
committee, …). It also gives information on projects, replaced With a subscription you will always have access to up to date
and withdrawn publications. content tailored to your needs.
IEC Just Published - webstore.iec.ch/justpublished
Electropedia - www.electropedia.org
Stay up to date on all new IEC publications. Just Published
The world's leading online dictionary on electrotechnology,
details all new publications released. Available online and once
containing more than 22 500 terminological entries in English
a month by email.
and French, with equivalent terms in 25 additional languages.
Also known as the International Electrotechnical Vocabulary
IEC Customer Service Centre - webstore.iec.ch/csc
(IEV) online.
If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC TR 60068-3-15 ®
Edition 1.0 2024-02
TECHNICAL
REPORT
colour
inside
Environmental testing –
Part 3-15: Supporting documentation and guidance – Vacuum-assisted reflow
soldering
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 19.040; 31.190 ISBN 978-2-8322-8169-7
– 2 – IEC TR 60068-3-15:2024 © IEC 2024
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Voids in solder joints . 7
4.1 Type of voids . 7
4.2 Reasons for voids . 8
4.3 Influence of voiding on solder joint performance . 9
5 Vacuum-assisted soldering processes . 9
5.1 Purpose . 9
5.2 Combination of soldering process with vacuum . 9
5.3 Typical temperature-pressure-time curves . 10
5.3.1 Convection soldering with vacuum . 10
5.3.2 Vapour phase soldering with vacuum . 11
5.3.3 Contact soldering with vacuum . 12
6 Effect of vacuum when reflow soldering . 13
6.1 General . 13
6.1.1 General description . 13
6.1.2 Physical basics . 13
6.1.3 Vacuum parameters . 14
6.1.4 Vapour phase vacuum reflow soldering . 14
6.2 Components in the vacuum reflow soldering process . 15
6.2.1 Influence of pressure differences . 15
6.2.2 Influence of temperature, time, and vacuum . 18
7 Vacuum equipment restrictions . 18
7.1 General . 18
7.2 Chamber size . 18
7.3 Time to reach vacuum level . 19
7.4 Cycle time . 19
7.5 Summary . 19
8 Typical defects after vacuum-assisted reflow soldering . 20
8.1 Typical defect modes occurring at components . 20
8.2 Component defect modes – summary . 24
8.3 Soldering defect modes . 24
8.3.1 Dropping of components . 24
8.3.2 Bridging . 25
8.3.3 Splattering . 25
Bibliography . 27
Figure 1 – X-Ray examples of voids in solder joints in different SMD-Components . 8
Figure 2 – Reduction of voids with low flux soldering & preforms . 8
Figure 3 – Example of a product for vacuum-assisted soldering processes . 10
Figure 4 – Typical profile – vacuum-assisted convection soldering . 11
Figure 5 – Typical profile – vacuum-assisted vapour phase soldering . 12
Figure 6 – Typical profile – vacuum-assisted contact soldering . 13
Figure 7 – Vapour pressure curve of Galden® . 15
Figure 8 – Pressures to be considered . 16
Figure 9 – Vapour pressure curve of water . 17
Figure 10 – Blow Hole Void in/out of metallization . 20
Figure 11 – Gas bubbles at metallization interface . 20
Figure 12 – Gas bubble caused by residues in metallization defect . 21
Figure 13 – Blow out void in solder meniscus . 21
Figure 14 – Aluminium electrolytic capacitors with non-solid electrolyte, bulged . 22
Figure 15 – Composite housing bursts in case of overpressure . 22
Figure 16 – Housing mainly made of plastic bursts in case of overpressure . 23
Figure 17 – Relay lock (polymer dot) blown off. 23
Figure 18 – Housing with adhesive joint bursts in case of overpressure . 24
Figure 19 – An example of bridging on BGA during vacuum assisted soldering . 25
Figure 20 – Optimization with stepwise applying of vacuum to reduce bridging . 25
Figure 21 – Splattering due to explosive outgassing from the solder joint . 26
Table 1 – Combination of soldering processes with vacuum . 10
Table 2 – Molar mass . 17
Table 3 – Combination of soldering processes with vacuum . 19
– 4 – IEC TR 60068-3-15:2024 © IEC 2024
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 3-15: Supporting documentation and guidance –
Vacuum-assisted reflow soldering
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC TR 60068-3-15 has been prepared by technical committee 91: Electronics assembly
technology. It is a Technical Report.
The
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.