IEC 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Essais d'environnement - Partie 2-83: Essais - Essai Tf: Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser

La CEI 60068-2-83:2011 fournit des méthodes d'enquêtes comparatives sur la mouillabilité des sorties métalliques ou métallisées des composants pour montage en surface (CMS) avec des pâtes à braser. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acceptions ou de rejets.
NOTE: Différentes méthodes d'essai de brasabilité des composants pour montage en surface (CMS) sont décrites dans la CEI 60068-2-58 et dans la CEI 60068-2-69. La CEI 60068-2-58 prescrit une évaluation visuelle utilisant un bain de brasage et la méthode de refusion, la CEI 60068-2-69 prescrit une évaluation de balance de mouillage utilisant la méthode du bain de brasage et des gouttelettes de brasure.

General Information

• Status: Published
• Publication Date: 06-Sep-2011
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 30-Sep-2011
• Completion Date: 07-Sep-2011

Standards Content (Sample)

IEC 60068-2-83
®

Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste

Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser

IEC 60068-2-83:2011

---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60068-2-83
®

Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste

Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 19.040; 31.190 ISBN 978-2-88912-665-1

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – 60068-2-83  IEC:2011
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Test . 9
4.1 General description . 9
4.2 Test methods . 9
5 Preconditioning . 9
6 Preparation . 10
6.1 Solder paste . 10
6.2 Test jig plate . 10
6.3 Specimen holder . 10
7 Quick heating method . 10
7.1 Equipment . 10
7.2 Test jig plate . 11
7.3 Preparation . 12
7.4 Test condition . 12
7.4.1 Test temperature . 12
7.4.2 Feed of solder paste and immersion condition . 13
7.4.3 Immersion and withdrawal conditions for test specimen . 14
7.5 Test procedure . 14
7.6 Presentation of the result . 15
7.7 Characterisation parameter examples . 15
8 Synchronous method . 16
8.1 Equipment . 16
8.2 Test jig plate . 17
8.3 Synchronous fixture . 17
8.4 Preparation . 17
8.5 Test condition . 17
8.5.1 Test temperature . 17
8.5.2 Feed of solder paste and immersion condition . 17
8.5.3 Immersion and withdrawal conditions for the test specimen . 17
8.6 Test procedure . 17
8.7 Presentation of the results . 18
8.8 Characterisation parameter examples . 19
9 Temperature profile method . 19
9.1 Equipment . 19
9.2 Test jig plate . 19
9.3 Preparation . 20
9.4 Test condition . 20
9.4.1 Test temperature . 20
9.4.2 Feed of solder paste and immersion condition . 21
9.4.3 Immersion and withdrawal conditions for test specimen . 21
9.5 Test procedure . 21

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60068-2-83  IEC:2011 – 3 –
9.6 Presentation of the result . 22
9.7 Characterisation parameter examples . 23
Annex A (normative) Equipment for the quick heating and synchronous method . 24
Annex B (informative) Reading of the output data and correction of the result in the
quick heating test. 25
Annex C (normative) Test equipment for the temperature profile method . 28
Annex D (informative) Reading of the output data and correction of the result in the
temperature profile test . 29
Annex E (informative) Caveats / Notes. 32
Bibliography . 36

Figure 1 – Examples of the quick heating method test equipment . 11
Figure 2 – Example of test jig plate for quick heating and synchronous method . 12
Figure 3 – Example of the temperature profile. 13
Figure 4 – Example of applying solder paste to a test jig plate . 14
Figure 5 – Typical output shape of signal in the quick heating method . 15
Figure 6 – Example of synchronous method test equipment . 16
Figure 7 – Example of synchronous fixture . 17
Figure 8 – Typical output shape of signal in the synchronous method . 18
Figure 9 – Example of the system for temperature profile method test equipment . 19
Figure 10 – Example of the temperature profile . 20
Figure 11 – Example of applying solder paste to a test jig plate . 22
Figure 12 – Typical output shape of signal in the temperature profile method . 23
Figure B.1 – Typical wetting force changes in quick heating method . 26
Figure B.2 – Example of correction of the initial time of wetting (F is larger than
a
0,5F ) . 27
1,max
Figure B.3 – Example of correction of the initial time of wetting (F is 0,5F or
a 1,max
less) . 27
Figure D.1 – Typical output forms for profile temperature test . 30
Figure D.2 – The case when an extruding force (1,1F or larger) is generated
max
immediately after the beginning of wetting . 31
Figure E.1 – Explanation diagram of test procedure for the quick heating method . 33
Figure E.2 – Explanation diagram of test procedure for synchronous method . 34
Figure E.3 – Showing the wetting force (pull) of some solder pastes . 34
Figure E.4 – Explanation diagram of the test procedure for the temperature profile

method . 35


Table 1 – Specification of the test jig plate for quick heating and synchronous method . 11
Table 2 – Recommended test conditions of the quick heating and synchronous method
for rectangular SMD . 14
Table 3 – Specification of the test jig plate of the temperature profile method . 20
Table 4 – Recommended test conditions of the temperature profile method for
rectangular SMD . 21

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– 4 – 60068-2-83  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

ENVIRONMENTAL TESTING –

Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
International Standard IEC 60068-2-83 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/975/FDIS 91/992/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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60068-2-83  IEC:2011 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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– 6 – 60068-2-83  IEC:2011
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents as indicated below.
IEC takes no position concerning the evidence, validity and scope of patent rights.
The holders of the patent rights have assured the IEC that they are willing to negotiate
licences either free of charge or under reasonable and non-discriminatory terms and
conditions with applicants throughout the world. In this respect, the statement of the holders
of these patent rights are registered with IEC. Information may be obtained as indicated below.
1
a) EU patent 0920488.4 “Synchronous test method for assessing soldering pastes”
Gen3 Systems LTD
Unit B2
Armstrong Mall
Farnborough GU14 0NR
United Kingdom
b) JP Patent 2630712 “Testing method of characteristics of solder paste and the
equipment for the test”
Malcom Co., Ltd
4-15-10 Honmachi, Shibuya-ku
Tokyo, 151-0071
Japan
c) Patent JP 3789041 “Solderability measuring apparatus”
Patent JP 3552061 “Solderability tester and solderability test method”
Patent JP 3498100 “Method and device for testing solderability and microcrucible for
testing”
Patent JP 3153884 “Measuring device for soldering performance of cream solder”
Tarutin Kester Co., Ltd.
2-20-11 Yokokawa,
Sumida-ku
Tokyo, 130-0003
Japan
d) Sony Corporation
1-7-1 Konan Minato-ku
Tokyo 108-0075
Japan
Attention is drawn to the possibility that some of the elements of this standard may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
—————————
1
 Status of patent: Pending.

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60068-2-83  IEC:2011 – 7 –
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

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– 8 – 60068-2-83  IEC:2011
ENVIRONMENTAL TESTING –

Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste



1 Scope
This part of IEC 60068 provides methods for comparative investigation of the wettability of the
metallic terminations or metallized terminations of SMDs with solder pastes.
Data obtained by these methods are not intended to be used as absolute quantitative data for
pass – fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69.
IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes
wetting balance evaluation using solder bath and solder globule method.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60068-1,
IEC 60068-2-20:2008, IEC 60068-2-58, IEC 60194, and IEC 61190-1-3 and the following
apply.
3.1
wettability
ease with which a metal or metal alloy can be wetted by molten solder

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60068-2-83  IEC:2011 – 9 –
3.2
wetting balance method
method to measure wetting performance and solderability by measuring vertical force
(difference with surface tension and buoyancy) to the specimen and recording as a function of
time, when the specimen is immersed into molten solder
3.3
starting point of heating
time of the start of temperature rise by heating the solder paste applied to a testing jig
3.4
zero line
line extended to the time axis of the force experienced by the specimen as indicated by the
test equipment (force sensor) when the specimen is taken out from the molten solder after the
end of the measurement
4 Test
4.1 General description
The specimen is held on a holder suitable to the specimen and is suspended from sensitive
balance. The specimen is immersed into solder paste applied onto the test jig plate, then
solder paste is heated to melt. The resultant of the vertical forces of buoyancy and surface
tension (hereafter, referred to as “acting force”) acting upon the immersed specimen by force
sensor and converted into a signal which is continuously recorded or monitored as a function
of time on recorder.
NOTE The wetting force can be evaluated only for components of the same shape and size. The absolute
evaluation is not achieved by this method.
4.2 Test methods
There are three methods as described below. The choice of the method shall be specified in
the relevant specification.
a) Quick heating method: The wettability of electrodes of a component is evaluated while the
solder paste is melted in a rapid temperature rise. The specimen is immersed in the solder
paste before the temperature rise starts.
b) Synchronous method: The wettability of electrodes of a component is evaluated while the
solder paste is melted due to a rapid temperature rise. The specimen is immersed in the
solder paste when the temperature rise starts.
c) Temperature profile method: Solder paste is melted using a similar temperature profile
used in production and the wettability of the electrodes of a component is evaluated.
NOTE 1 This test (Tf) may be applicable to leaded SMD packages. In order to achieve comparable and
repeatable results, test Tf should be done on straight leads.
NOTE 2 Solder paste to be used is not specified in this standard.
5 Preconditioning
Unless otherwise specified in the detailed specification of the component, the test shall be
made on the specimens as received and care shall be taken not to contaminate the
specimens by fingers and other items. The specimen may be immersed in organic solvent at
room temperature to remove possible contamination such as grease attached to the surface if
the preconditioning is specified in the specification. No other method shall be used to clean
the specimen. The specimen thus cleaned may be dried in air.

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– 10 – 60068-2-83  IEC:2011
When accelerated ageing is prescribed by the relevant specification, one of the methods of
4.1.4 (Ageing 1) of IEC 60068-2-20:2008 shall be used. The aging condition shall be specified
in the relevant specification.
6 Preparation
6.1 Solder paste
Use solder paste that has been stored in a sealed container and stored in a dark environment
and below 10 °C, avoiding exposure to direct sunlight. Before conducting this test, it is
important to prepare the solder paste properly.
a) The solder paste shall be allowed to achieve ambient conditions that shall be nominally
25 °C ± 5 °C and 50 % RH ± 10 % for 8 h or in accordance with the manufacturer’s data
sheet.
b) Open the supply container(s); remove any internal cover, scrape off paste adhering to the
lid(s), internal covers, and the container walls; and add this material to the paste in the
supply container(s).
c) Using a spatula, stir the paste gently for 1 min to 2 min to homogenize it; taking care to
avoid the introduction of air.
If necessary, gently transfer the paste to a test container of sufficient volume, taking care
to avoid the introduction of air.
6.2 Test jig plate
Test jig plates shall be stored in a sealed container. Immediately prior to their use, they shall
be cleaned using acid such as dilute hydrochloric acid. A new test jig plate shall be used for
each test. Unused test jig plates shall be discarded and not be returned to the sealed
container.
6.3 Specimen holder
The specimen holder is usually contaminated by creeping of flux used in a test. A specimen
holder shall be cleaned using a neutral organic solvent. It is desirable to use ultrasonic
agitation in cleaning.
7 Quick heating method
7.1 Equipment
The equipment used for the quick heating method consists of a measurement, heating and lift
system, as shown in Figure 1. The detailed requirements to the equipment are specified in
Annex A.
a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of controlling the determined set temperature within
± 3 °C.
c) The lift system shall be capable of carrying out immersion and withdrawal of the specimen,
as spec
...