Semiconductor die products - Part 7: XML schema for data exchange

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

General Information

Status
Published
Publication Date
22-Aug-2007
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
31-Oct-2007
Completion Date
23-Aug-2007
Ref Project

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IEC TR 62258-7:2007 - Semiconductor die products - Part 7: XML schema for data exchange
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IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT

Semiconductor die products –
Part 7: XML schema for data exchange


IEC/TR 62258-7:2007(E)

---------------------- Page: 1 ----------------------
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IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT

Semiconductor die products –
Part 7: XML schema for data exchange


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.080.99 ISBN 2-8318-9289-9

---------------------- Page: 3 ----------------------
– 2 – TR 62258-7 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.6
3 Definitions .6
4 General .7
5 Data exchange .7

Annex A (normative) XML schema.8
Annex B (informative) XML example.19

Bibliography .26

---------------------- Page: 4 ----------------------
TR 62258-7 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DIE PRODUCTS –

Part 7: XML schema for data exchange


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National
...

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