IEC TR 62258-7:2007

Semiconductor die products - Part 7: XML schema for data exchange

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

General Information

• Status: Published
• Publication Date: 22-Aug-2007
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 3 - TC 47/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 31-Oct-2007
• Completion Date: 23-Aug-2007

Standards Content (Sample)

IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 7: XML schema for data exchange

IEC/TR 62258-7:2007(E)
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IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 7: XML schema for data exchange

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.080.99 ISBN 2-8318-9289-9

– 2 – TR 62258-7 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.6
3 Definitions .6
4 General .7
5 Data exchange .7

Annex A (normative) XML schema.8
Annex B (informative) XML example.19

Bibliography .26

TR 62258-7 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 7: XML schema for data exchange

FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
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The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-7, which is a technical report, has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1887/DTR 47/1897/RVC
Full information on the voting for the approval of this Technical Report can be found in the
report on voting indicated in the above table.

– 4 – TR 62258-7 © IEC:2007(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62258 series, under the general title Semiconductor die products,
can be found on the IEC website. Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

TR 62258-7 © IEC:2007(E) – 5 –
INTRODUCTION
th
This technical report is based on the work carried out in the ESPRIT 4 Framework project
GOODDIE which resulted in the publication of the ES 59008 series of European specifications.
Organizations that helped prepare this report included the ESPRIT ENCAST and IST ENCASIT
projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.

– 6 – TR 62258-7 © IEC:2007(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 7: XML schema for data exchange

1 Scope
IEC/TR 62258-7, which is a technical report, has been developed to facilitate the production,
supply and use of semiconductor die products, including:
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This report contains an XML schema that describes the elements needed for data exchange
and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and
IEC 62258-6, as well as providing an exchange structure that is complementary to those
defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in
IEC/TR 62258-4.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of the
referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 62258-1: Semiconductor die products – Part 1: Requirements for procurement and use
IEC 62258-2: Semiconductor die products – Part 2: Exchange data formats
IEC/TR 62258-4: Semiconductor die products – Part 4: Questionnaire for die users and
suppliers
IEC 62258-5: Semiconductor die products – Part 5 Requirements for information concerning
electrical simulation
IEC 62258-6: Semiconductor die products – Part 6 Requirements for information concerning
thermal simulation
3 Terms and definitions
For the purposes of this document, relevant terms, which are defined in IEC 60050, together
with additional terms and acronyms as given in IEC 62258-1, apply.

TR 62258-7 © IEC:2007(E) – 7 –
4 General
The schema given in this technical report complies with Version 1.0 (Third edition) of the
Extensible Markup Language (XML) as defined by the World Wide Web Consortium (W3C).
Links to the XML standard are given in the bibliography.
To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish
information that is necessary and sufficient for users of die devices at all stages of design,
procurement, manufacture and test of products containing them. The schema in Annex A
defines an exchange mechanism for structuring such information using an XML representation
and as such is intended as an aid to compliance with the standard.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, neither the standard nor the
schema places an obligation on a supplier to make information public. Any information that a
supplier considers to be proprietary or commercially sensitive may be supplied under the terms
of a non-disclosure agreement.
5 Data exchange
The schema in Annex A implements all the entities as defined by IEC 62258-2 for the DDX
format. In addition, it includes additional entities extending the range of that data as follows:
• expansion of data on organisations (manufacturer, supplier etc.) to include addresses and
contacts;
• sub-division of some entities to make their values clearer.
Annex B contains an example of an XML file based on the schema using a fictitious example
similar to that employed in IEC 62258-2, and extended to cover additional data requirements. It
is possible that software may be available for conversion of data produced using the
spreadsheet associated with IEC/TR 62258-4 into this format. In any case, a wide range of
tools is available commercially for handling and processing XML files.
The electronic form of the schema contained in this technical report may be downloaded from
the IEC website. The copyright conditions applying to the use of the electronic file are those
that apply to IEC database standards, which permit the use of such information in electronic
form for bona-fide e-commerce but do not permit its sale to third parties or other commercial
use.
– 8 – TR 62258-7 © IEC:2007(E)
Annex A
(normative)
XML schema
In electronic form, for use by the example file shown in Annex B, the file containing this
schema is assumed to have the name DDXschema.xsd





































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