IEC TR 61760-3-1:2022
(Main)Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
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IEC TR 61760-3-1 ®
Edition 1.0 2022-06
TECHNICAL
REPORT
colour
inside
Surface mounting technology –
Part 3-1: Standard method for the specification of components for through hole
reflow (THR) soldering – Guidelines for through hole diameter design with solder
paste surface printing method
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IEC TR 61760-3-1 ®
Edition 1.0 2022-06
TECHNICAL
REPORT
colour
inside
Surface mounting technology –
Part 3-1: Standard method for the specification of components for through hole
reflow (THR) soldering – Guidelines for through hole diameter design with solder
paste surface printing method
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.190 ISBN 978-2-8322-3928-5
– 2 – IEC TR 61760-3-1:2022 IEC 2022
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Solder paste application methods . 6
4.1 General . 6
4.2 Through hole filled method . 8
4.2.1 Overview . 8
4.2.2 Advantages . 9
4.2.3 Disadvantages . 9
4.3 Solder paste surface printing method . 9
4.3.1 Overview . 9
4.3.2 Advantages . 9
4.3.3 Disadvantages . 9
5 Solder paste printing stencil aperture design guidelines. 10
5.1 General . 10
5.2 Amount of solder paste . 10
5.2.1 Needed amount of solder paste . 10
5.2.2 Printing volume of solder paste . 11
5.2.3 Designing amount of printing solder paste . 13
6 Influence of terminal position tolerance on through hole diameter and stencil
aperture design guidelines . 13
6.1 Terminal position tolerance . 13
6.2 Relationship between terminal position tolerance and through hole diameter . 14
6.2.1 General . 14
6.2.2 Terminal position tolerance of 0,40 mm . 14
6.2.3 Terminal position tolerance of 0,30 mm . 15
6.2.4 Terminal position tolerance of 0,20 mm . 15
6.3 Circuit board though hole diameter design guidelines for THR components . 16
6.3.1 Circuit board though hole diameter design . 16
6.3.2 Relationship through hole diameter and solder paste supply . 17
Annex A (informative) Calculation method for solder fillet volume of the round terminal . 21
Annex B (informative) Calculation method for metal volume of the printed solder paste . 24
Bibliography . 26
Figure 1 – Solder paste application method . 7
Figure 2 – Through hole filled method (bottom side view) . 8
Figure 3 – Solder paste fallen inside the reflow oven (through hole filled method) . 8
Figure 4 – Solder paste state of solder paste surface printing method. 8
Figure 5 – Conceptual view of solder wetting of component terminals after reflow
soldering . 10
Figure 6 – Single area printing . 12
Figure 7 – Slit printing . 13
Figure 8 – Terminal position tolerance 0,40 mm, through hole diameter 1,40 mm (one
side clearance 0,20 mm) . 14
Figure 9 – Terminal position tolerance 0,30 mm, through hole diameter 1,40 mm (one
side clearance 0,20 mm) . 15
Figure 10 – Terminal position tolerance 0,20 mm, through hole diameter 1,30 mm (one
side clearance 0,15 mm) . 16
Figure 11 – Circuit board through hole diameter and component terminal
diameter/diagonal line dimension . 17
Figure 12 – Through hole diameter and solder paste supply amount (printing area) for
round terminal . 18
Figure 13 – Through hole diameter and solder paste supply amount (printing area) for
square terminal . 19
Figure 14 – Through hole diameter and solder paste supply amount (printing area) for
rectangular terminal . 20
Figure A.1 – Solder joint region cross section . 21
Figure A.2 – Solder fillet approximated by a truncated cone . 22
– 4 – IEC TR 61760-3-1:2022 IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 3-1: Standard method for the specification of components for
through hole reflow (THR) soldering – Guidelines for through hole
diameter design with solder paste surface printing method
FOREWORD
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IEC TR 61760-3-1 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
91/1734/DTR 91/1773/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
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