IEC 62769-4:2023

Field Device Integration (FDI®) - Part 4: FDI Packages

IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Intégration des appareils de terrain (FDI®) - Partie 4: Paquetages FDI

L'IEC 62769-4:2023 spécifie les Paquetages FDI®[1]. L'architecture FDI® complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans Diagramme de l'architecture figure.
[1] FDI® est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des utilisateurs du présent document et ne signifie nullement que l'IEC approuve le détenteur de la marque ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de la marque. L'utilisation de la marque exige l'autorisation du détenteur de la marque.

General Information

• Status: Published
• Publication Date: 04-Apr-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Drafting Committee: WG 7 - TC 65/SC 65E/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 12-May-2023
• Completion Date: 05-Apr-2023

Relations

• Revises: IEC 62769-4:2021 - Field Device Integration (FDI) - Part 4: FDI Packages
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62769-4 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: [phone]
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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(IEV) online.
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If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
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IEC 62769-4 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6827-8
– 2 – IEC 62769-4:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 8
INTRODUCTION .
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, abbreviated terms and conventions acronyms . 12
3.1 Terms and definitions . 13
3.2 Abbreviated terms and acronyms . 14
3.3 Conventions . 14 ®
4 FDI Package Model . 14
4.1 Overview. 14 ®
4.2 FDI Package Elements . 15
4.2.1 Package Catalog . 15
4.2.2 Package Feature Table . 15
4.2.3 Feature Unit Conversion . 16
4.2.4 Electronic Device Description . 15
4.2.5 User Interface Plug-in . 16
4.2.6 Attachment . 18 ®
4.3 FDI Package Types . 18 ®
4.3.1 FDI Device Package . 18 ®
4.3.2 FDI Communication Package . 19 ®
4.3.3 FDI UIP Package . 19 ®
4.3.4 FDI Profile Package . 20 ®
5 FDI Package implementation . 21
5.1 Packaging technology . 21
5.2 Use of Open Packaging Conventions . 21
5.2.1 Unknown parts . 21
5.2.2 Invalid parts . 22
5.2.3 Unknown relationships . 22
5.2.4 Interleaving. 22
5.2.5 Core properties . 22
5.2.6 Thumbnails . 22
5.2.7 Digital Signatures . 22 ®
5.3 FDI Package parts. 22
5.3.1 Package Catalog . 22
5.3.2 Package Feature Table . 23
5.3.3 Electronic Device Description . 23
5.3.4 User Interface Plug-in . 24
5.3.5 Attachments . 27 ®
6 FDI Package versioning . 30
6.1 Version scheme . 30
6.2 Versioned elements . 31
6.3 Version hierarchy . 31
6.4 UIP compatibility . 33 ®
7 Digital Signatures and FDI Registration Certificates . 34
7.1 Signed elements and certification documents . 34
7.2 Signing mechanism . 35

® ®
7.3 FDI Package Originator, FDI Registration Authority . 36 ®
7.4 FDI Host behaviour . 36
Annex A (normative) File name conventions . 37
A.1 Identification . 37 ®
A.2 FDI Package filename convention . 37 ®
Annex B (informative) FDI Package creation . 39
B.1 General . 39
B.2 Tools and components . 39
B.2.1 Overview . 39 ®
B.2.2 FDI Reference Implementation/Common EDD Engine . 39 ®
B.2.3 FDI Package IDE . 39 ®
B.2.4 FDI Device Package Conformance Test Tool . 39
B.3 Development . 39 ®
B.3.1 FDI Package core development . 39
B.3.2 User Interface Plug-in development . 40 ®
B.3.3 FDI Package Attachment development . 40 ®
B.3.4 FDI Package binding and packaging . 40
B.3.5 Conformance Test . 41 ®
Annex C (informative) FDI Package deployment . 42
C.1 General . 42
C.2 Scenarios . 42 ®
C.2.1 FDI Package deployment to PC based client/server systems . 42
® ®
C.2.2 FDI Package deployment to an FDI standalone system . 43
Annex D (informative) Example . 45
D.1 General . 45
D.2 Open Packaging Conventions . 45
D.2.1 Overview . 45
D.2.2 Parts. 45
D.2.3 Relationships . 46
D.2.4 OPC Core features . 46
D.2.5 OPC additional features . 47 ®
D.3 Creation and handling of FDI Packages. 48 ®
D.4 FDI Device Package example . 48
D.4.1 Overview . 48
D.4.2 User Interface Plug-in . 53
D.4.3 EDD reference to UIP . 55 ®
D.4.4 FDI Registration Certificate . 56 ®
Annex E (normative) FDI Package Catalog XML Schema . 57
E.1 Target Namespace . 57
E.2 Catalog . 57
E.3 ClassificationIdT . 57
E.4 CommunicationProfileT . 57
E.5 CommunicationRoleT . 57
E.6 CommunicationServerT . 58
E.7 DeviceTypeT . 58
E.8 FDIRegistrationCert . 59
E.9 FDIRegistrationCertT . 59
E.10 InterfaceT . 60

– 4 – IEC 62769-4:2023 RLV © IEC 2023
E.11 ListOfCommunicationProfilesT . 61
E.12 ListOfDeviceImagesT . 61
E.13 ListOfDeviceTypesT . 62
E.14 ListOfDocumentsT .
...

IEC 62769-4 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages ®
Intégration des appareils de terrain (FDI ) –
Partie 4: Paquetages FDI
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: [e-mail].
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IEC 62769-4 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside ®
Field Device Integration (FDI ) –

Part 4: FDI Packages ®
Intégration des appareils de terrain (FDI ) –

Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6794-3

– 2 – IEC 62769-4:2023 © IEC 2023
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions, abbreviated terms and acronyms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms and acronyms . 12
3.3 Conventions . 13 ®
4 FDI Package Model . 13
4.1 Overview. 13 ®
4.2 FDI Package Elements . 14
4.2.1 Package Catalog . 14
4.2.2 Package Feature Table . 14
4.2.3 Feature Unit Conversion . 15
4.2.4 Electronic Device Description . 15
4.2.5 User Interface Plug-in . 15
4.2.6 Attachment . 17 ®
4.3 FDI Package Types . 17 ®
4.3.1 FDI Device Package . 17 ®
4.3.2 FDI Communication Package . 18 ®
4.3.3 FDI UIP Package . 18 ®
4.3.4 FDI Profile Package . 19 ®
5 FDI Package implementation . 20
5.1 Packaging technology . 20
5.2 Use of Open Packaging Conventions . 20
5.2.1 Unknown parts . 20
5.2.2 Invalid parts . 21
5.2.3 Unknown relationships . 21
5.2.4 Interleaving. 21
5.2.5 Core properties . 21
5.2.6 Thumbnails . 21
5.2.7 Digital Signatures . 21 ®
5.3 FDI Package parts. 21
5.3.1 Package Catalog . 21
5.3.2 Package Feature Table . 22
5.3.3 Electronic Device Description . 23
5.3.4 User Interface Plug-in . 23
5.3.5 Attachments . 26 ®
6 FDI Package versioning . 29
6.1 Version scheme . 29
6.2 Versioned elements . 29
6.3 Version hierarchy . 30
6.4 UIP compatibility . 31 ®
7 Digital Signatures and FDI Registration Certificates . 32
7.1 Signed elements and certification documents . 32
7.2 Signing mechanism . 33
® ®
7.3 FDI Package Originator, FDI Registration Authority . 34
®
7.4 FDI Host behaviour . 34
Annex A (normative) File name conventions . 35
A.1 Identification . 35 ®
A.2 FDI Package filename convention . 35 ®
Annex B (informative) FDI Package creation . 37
B.1 General . 37
B.2 Tools and components . 37
B.2.1 Overview . 37 ®
B.2.2 FDI Reference Implementation/Common EDD Engine . 37 ®
B.2.3 FDI Package IDE . 37 ®
B.2.4 FDI Device Package Conformance Test Tool . 37
B.3 Development . 37 ®
B.3.1 FDI Package core development . 37
B.3.2 User Interface Plug-in development . 38 ®
B.3.3 FDI Package Attachment development . 38 ®
B.3.4 FDI Package binding and packaging . 38
B.3.5 Conformance Test . 39 ®
Annex C (informative) FDI Package deployment . 40
C.1 General . 40
C.2 Scenarios . 40 ®
C.2.1 FDI Package deployment to PC based client/server systems . 40
® ®
C.2.2 FDI Package deployment to an FDI standalone system . 41
Annex D (informative) Example . 43
D.1 General . 43
D.2 Open Packaging Conventions . 43
D.2.1 Overview . 43
D.2.2 Parts. 43
D.2.3 Relationships . 44
D.2.4 OPC Core features .
...