IEC TR 62240:2005
(Main)Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range
Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range
Reports processes that exist for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. Covers applications in avionics in which only the performance of the device is an issue. The wider temperature ranges will be limited to those that do not compromise the system performance or application-specific reliability of the device.
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TECHNICAL IEC
REPORT TR 62240
First edition
2005-06
Process management for avionics –
Use of semiconductor devices
outside manufacturers' specified
temperature range
Reference number
IEC/TR 62240:2005(E)
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TECHNICAL IEC
REPORT TR 62240
First edition
2005-06
Process management for avionics –
Use of semiconductor devices
outside manufacturers' specified
temperature range
IEC 2005 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XA
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – TR 62240 IEC:2005(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Terms and definitions .7
4 Objectives .10
5 Using devices outside the manufacturer's specified temperature ranges.10
5.1 Device selection, usage and alternatives.10
5.2 Device capability assessment.12
5.3 Device quality assurance in wider temperature ranges .15
5.4 Documentation .16
5.5 Device identification .16
Annex A (informative) Device parameter re-characterisation .19
A.1 Glossary of Symbols.19
A.2 Rationale for parameter re-characterisation .20
A.3 Capability assurance .21
A.4 Quality assurance.28
A.5 Factors to be considered in parameter re-characterisation.28
A.6 References .30
Annex B (informative) Stress balancing .32
B.1 General .32
B.2 Glossary of symbols.32
B.3 Stress balancing.33
B.4 Application example.36
B.5 Other notes.39
Annex C (informative) Parameter conformance assessment.42
C.1 General .42
C.2 Test plan.42
Annex D (informative) Higher assembly level testing.49
D.1 General .49
D.2 Process.49
Bibliography.52
TR 62240 IEC:2005(E) – 3 –
Figure 1 – Flow chart for semiconductor devices in wider temperature ranges .17
Figure 2 – Report form for documenting device usage in wider temperature ranges .18
Figure A.1 – Parameter re-characterisation.20
Figure A.2 – Flow diagram of parameter re-characterisation capability assurance
process.23
Figure A.3 – Margin in electrical parameter measurement based on the results of
sample test .26
Figure A.4 – Schematic diagram of parameter limit modifications.27
Figure A.5 – Parameter Re-Characterisation Part Quality Assurance .28
Figure A.6 – Schematic of outlier products that may invalidate sample testing .29
Figure A.7 – Example of intermediate peak of an electrical parameter: voltage
feedback input threshold change for Motorola MC34261 power factor controller [4] .30
Figure A.8 – Report form for documenting device parameter re-characterisation.31
Figure B.1 – Iso-T curve: the relationship between ambient temperature and
J
dissipated power.34
Figure B.2 – Graph of electrical parameters versus dissipated power .35
Figure B.3 – Iso-TJ curve for the Fairchild MM74HC244 .38
Figure B.4 – Power versus frequency curve for the Fairchild MM74HC244.39
Figure B.5 – Flow chart for stress balancing .40
Figure B.6 – Report form for documenting stress balancing .41
Figure C.1 – Relationship of temperature ratings, requirements and margins.43
Figure C.2 – Typical Fallout Distribution versus T .45
req-max
Figure C.3 – Parameter conformance assessment flow.47
Figure C.4 – Report form for documenting parameter conformance testing .48
Figure D.1 – Flow chart of higher level assembly testing.50
Figure D.2 – Report form for documenting higher level assembly test at temperature
extremes.51
Table A.1 – Example of sample size calculation.24
Table A.2 – Parameter re-characterisation example: SN74ALS244 Octal Buffer/Driver .27
– 4 – TR 62240 IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
USE OF SEMICONDUCTOR DEVICES OUTSIDE
MANUFACTURERS' SPECIFIED TEMPERATURE RANGE
FOREWORD
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The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62240, which is a technical report, has been prepared by IEC Technical Committee 107:
Process management for avionics.
This Technical Report cancels and replaces IEC/PAS 62240 published in 2001. This first
edition constitutes a technical revision.
TR 62240 IEC:2005(E) – 5 –
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
107/33/DTR 107/36/RVC
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At
...
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