IEC PAS 62240:2001
(Main)Use of semiconductor devices outside manufacturers' specified temperature range
Use of semiconductor devices outside manufacturers' specified temperature range
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Standards Content (Sample)
IEC/PAS 62240
Edition 1.0
2001-04
PRE-STANDARD
Use of semiconductor devices
outside manufacturers' specified
temperature ranges
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62240
C O MMI S S I O N
Contents
INTRODUCTION .5
1. SCOPE.5
2. REFERENCES .6
2.1 NORMATIVE REFERENCES .6
2.2 INFORMATIVE REFERENCES.6
3. TERMS AND DEFINITIONS.6
4. OBJECTIVES.8
5. USING DEVICES OUTSIDE THE MANUFACTURER'S SPECIFIED TEMPERATURE
RANGES .8
5.1 DEVICE SELECTION, USAGE AND ALTERNATIVES .8
5.2 DEVICE CAPABILITY ASSESSMENT.9
5.3 DEVICE QUALITY ASSURANCE IN WIDER TEMPERATURE RANGES.12
5.4 DOCUMENTATION.13
5.5 DEVICE IDENTIFICATION .14
ANNEX A. DEVICE PARAMETER RE-CHARACTERIZATION .17
A.1 GLOSSARY OF SYMBOLS.17
A.2 RATIONALE FOR PARAMETER RE-CHARACTERIZATION .18
A.3 CAPABILITY ASSURANCE .19
A.4 QUALITY ASSURANCE .26
A.5 FACTORS TO BE CONSIDERED IN PARAMETER RE-CHARACTERIZATION.26
A.6 REFERENCES .28
ANNEX B - STRESS BALANCING.31
B.1 INTRODUCTION.31
B.2 GLOSSARY OF SYMBOLS.31
B.3 STRESS BALANCING .31
B.4 APPLICATION EXAMPLE .35
B.5 OTHER NOTES .39
ANNEX C: PARAMETER CONFORMANCE ASSESSMENT.42
C.1 INTRODUCTION.42
C.2 TEST PLAN .42
ANNEX D - HIGHER ASSEMBLY LEVEL TESTING .49
D.1 INTRODUCTION.49
D.2 PROCESS.49
Figures
Figure 1: Flow Chart for Semiconductor Devices in Wider Temperature Ranges .15
Figure 2: Report Form for Documenting Device Usage In Wider Temperature Ranges.16
Figure 3: Parameter re-characterization.19
Figure 4: Flow diagram of parameter re-characterization capability assurance process .21
Figure 5: Margin in electrical parameter measurement based on the results of sample test.24
Figure 6: Schematic diagram of parameter limit modifications .25
Figure 7: Parameter Re-Characterization Part Quality Assurance.26
– 2 –
Figure 8: Schematic of outlier products that may invalidate sample testing .27
Figure 9: Example of intermediate peak of electrical parameter.28
Figure 10: Report Form for Documenting Device Parameter Re-Characterization.30
Figure 11: Iso-TJ curve: the relationship between ambient temperature and disspated power .33
Figure 12: Graph of electrical parameters vs. dissipated power.35
Figure 13: Iso-TJ curve for the Fairchild MM74HC244 .38
Figure 14: Power vs. frequency curve for the Fairchild MM74HC244.39
Figure 15: Flow Chart for Stress Balancing .40
Figure 16: Report Form for Documenting Stress Balancing .41
Figure 17: Relationship of Temperature Ratings, Requirements and Margins.43
Figure 18: Typical Fallout Distribution versus T .35
req-max
Figure 19: Parameter Conformance Testing Flow.47
Figure 20: Report Form for Documenting Parameter Conformance Testing .48
Figure 21: Flow Chart of Higher Level Assembly Testing .50
Figure 22: Report Form for Documenting Higher Level Assembly Test at Temperature Extremes.51
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
USE OF SEMICONDUCTOR DEVICES OUTSIDE MANUFACTURERS'
SPECIFIED TEMPERATURE RANGE
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and
electronic fields. To this end and in addition to other activities, the IEC publishes International Standards.
Their preparation is entrusted to technical committees; any IEC National Committee interested in the
subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has
representation from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical specifications, technical reports or guides and they are accepted by the
National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC
International Standards transparently to the maximum extent possible in their national and regional
standards. Any divergence between the IEC Standard and the corresponding national or regional standard
shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for
any equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the
subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
This PAS Pre-Standard has been published using a rapid procedure as a result of
technical consensus at the level of experts working on the subject within the IEC. The
normal IEC procedure for the preparation of an International Standard is pursued in
parallel and this Pre-Standard will be withdrawn upon publication of the corresponding
International Standard.
IEC-PAS 62240 has been processed by IEC technical committee 107: Process
management for avionics.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
107/3/PAS 107/8/RVD
Full information on the voting for the approval of this PAS Pre-Standard can be found in
the report on voting indicated in the above table.
– 4 –
Introduction
Traditionally, industries that produce electronic equipment for rugged applications have relied on
the military specification system for semiconductor device standards; and upon manufacturers of
military-specified devices as device sources. This assured the availability of semiconductor
devices specified to operate over the temperature ranges required for electronic equipment in
rugged applications. Many device manufacturers have exited the military market in recent years,
resulting in decreased availability of devices specified to operate over wide temperature ranges.
Following are some typical temperature ranges at which devices are marketed:
Military: -55°C to +125°C
Automotive:
-40°C to +125°C
Industrial:
-40°C to +85°C
Commercial:
0°C to +70°C
If there are no reasonable or practical alternatives, then a potential response is for equipment
manufacturers to use devices in temperature ranges that are wider than those specified by the device
manufacturer. If properly documented and controlled, this practice may be used by electronic
equipment manufacturers to meet the design goals of their equipment.
This document prescribes practices and procedures to select semiconductor devices; to assess their
capability to operate; and to assure their intended quality in the wider temperature ranges. It also
prescribes the documentation of such usage.
1. Scope
This document prescribes processes for using semiconductor devices in wider temperature ranges
than those specified by the device manufacturer. It applies to any designer or manufacturer of
equipment intended to operate under conditions that require semiconductor devices to function in
temperature ranges beyond those for which the devices are marketed.
This document is intended for applications in which only the performance of the device is an issue.
Even though the device is used at wider temperatures, the wider temperatures will be limited to
those that do not compromise the system performance or application-specific reliability of the
device in the application. Specifically, this document is not intended for applications that require
the device to function at an operating or environmental stress level that significantly increases the
risk of catastrophic device failure, loss of equipment function, or unstable operation of the device.
The use of devices outside the parameters specified by the device manufacturer is discouraged;
however, such usage may occur if other options prove to be impossible, unreasonable, or
impractical.
Note: Alternate means of thermal uprating may have been performed prior to the implementation of this document
by the equipment manufacturer. Rationale for decisions made may have been valid considering the application,
semiconductor market conditions, experience with the particular component manufacturer, etc. at the times these
decisions were made. Field performance using these methods also may validate their use, however, their continued
use must take into account the risk of changes to the subject devices such as feature size reducti
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