IEC 62149-11:2020

Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

IEC 62149-11: 2020 specifies the performance standards for a multiple channel transmitter/receiver chip scale package (CSP) with multimode fibre interface that operates at up to 28 Gbit/s per channel. It specifies the parameters that apply, with clearly defined conditions, severities, and pass/fail criteria. The tests are intended to be run as an initial design verification to prove any product's ability to satisfy the performance standard's requirements. A product that has been shown to meet all the requirements of a performance standard can be declared as complying with the performance standard, but is then controlled by a quality assurance/quality conformance program.

Composants et dispositifs actifs fibroniques - Normes de performances - Partie 11 : Boîtier-puce émetteur/récepteur à plusieurs canaux avec interface à fibre multimodale

IEC 62149-11: 2020 spécifie les normes de performances d’un boîtier-puce (CSP) émetteur/récepteur à plusieurs canaux avec interface à fibre multimodale qui fonctionne à une vitesse allant jusqu’à 28 Gbit/s par canal. Il spécifie les paramètres qui s’appliquent, avec des conditions clairement définies, des sévérités et des critères d’acceptation/de refus. Les essais sont destinés à être effectués à titre de vérification initiale de conception, pour prouver la capacité du produit à satisfaire aux exigences des normes de performances. Un produit dont il a été démontré qu’il satisfait à toutes les exigences d’une norme de performance peut être déclaré comme étant conforme à celle-ci, mais il convient ensuite de le contrôler selon un programme d’assurance de la qualité/de conformité de la qualité.

General Information

• Status: Published
• Publication Date: 27-Apr-2020
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: SC 86C - Fibre optic systems, sensing and active devices
• Current Stage: PPUB - Publication issued
• Start Date: 28-Apr-2020
• Completion Date: 29-Jan-2020

Overview

IEC 62149-11:2020 defines the performance standards for fibre optic active components, focusing on multiple channel transmitter/receiver chip scale packages (CSP) with multimode fibre (MMF) interface. Developed by the International Electrotechnical Commission (IEC), this standard applies to CSPs capable of operating at data rates up to 28 Gbit/s per channel. It specifies the parameters, test conditions, and pass/fail criteria required for initial product verification and quality assurance. The standard is part of the IEC 62149 series, aiming to ensure consistent product performance, interoperability, and reliability in high-speed optical communication applications.

Key Topics

• Scope & Purpose:
  IEC 62149-11:2020 covers CSPs that convert electrical signals to optical signals (and vice versa) via a multimode fibre interface. It focuses on transmitter/receiver packages for use in high-speed data transmission environments, including those utilizing free space optics or multi-channel fibre connectors.

• Performance Parameters:

  • Maximum data rate: up to 28 Gbit/s per channel
  • Clearly defined limits for electrical and optical parameters
  • Absolute ratings for extended product reliability
  • Operating conditions, including power supply and environmental factors

• Testing & Verification:

  • Initial design verification to confirm compliance with the performance standard
  • Parameters include transmitter/receiver electrical and optical characteristics, such as input impedance, signal rise/fall times, and optical output power
  • Pass/fail criteria for conformance

• Quality Assurance:
  Products conforming to this standard must be managed under established quality conformance programs, supporting consistent long-term performance.

Applications

IEC 62149-11:2020 is crucial for manufacturers, designers, and integrators working with high-speed fibre optic communication systems. Key application domains include:

• Data Centers:
  High-density connections and bandwidth scalability using multi-lane optical interfaces in servers, switches, and storage networks.

• Telecommunications:
  Reliable, high-rate data transmission in core and access network infrastructure utilizing multimode fibre links.

• Industrial Automation:
  Secure, fast, and immune communications for control systems demanding robust chip scale packages.

• Enterprise and High-Performance Computing:
  Backbone optical interconnects supporting rapid data exchange with minimal signal loss and latency.

Adhering to IEC 62149-11:2020 enables industry stakeholders to:

• Guarantee interoperability and compatibility of photonic CSPs across multiple vendors
• Mitigate risks related to performance deviations and failures
• Reduce time-to-market through predictable product validation workflows

Related Standards

To ensure full regulatory conformance and interoperability, IEC 62149-11:2020 should be considered alongside other relevant standards, including:

• IEC 62149 Series: General requirements and additional performance standards for fibre optic active components and devices.
• IEC 60793-2-10: Product specifications for category A1 multimode fibres, relevant to interface compatibility.
• IEC 62148-1 & IEC 62148-19: General and photonic chip scale package interface standards, providing packaging and interface guidelines.
• IEC 61280 Series: Fibre optic communication subsystem test procedures, supporting testing and qualification.
• IEC 61281-1: Generic specification for fibre optic communication subsystems.
• IEC 62007 Series: Semiconductor optoelectronic device specifications and measuring methods.

Staying current with these standards ensures that development and deployment of chip scale fibre optic transmitter/receiver devices meet industry best practices, support reliable interoperability, and comply with international requirements for quality and safety.

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Key SEO terms: IEC 62149-11:2020, fibre optic active components, transmitter/receiver chip scale package, multimode fibre interface, performance standards, data centre networking, optical communication, telecommunications standards, IEC standards for fibre optics.

Standards Content (Sample)

IEC 62149-11 ®
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Performance standards –
Part 11: Multiple channel transmitter/receiver chip scale package with multimode
fibre interface
Composants et dispositifs actifs fibroniques – Normes de performances –
Partie 11: Boîtier-puce émetteur/récepteur à plusieurs canaux avec interface
à fibre multimodale
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IEC 62149-11 ®
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Performance standards –

Part 11: Multiple channel transmitter/receiver chip scale package with

multimode fibre interface
Composants et dispositifs actifs fibroniques – Normes de performances –

Partie 11: Boîtier-puce émetteur/récepteur à plusieurs canaux avec interface

à fibre multimodale
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-7793-5

– 2 – IEC 62149-11:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions, abbreviated terms and symbols . 6
3.1 Terms and definitions . 6
3.2 Abbreviated terms . 6
3.3 Symbols . 7
4 Product parameters . 7
4.1 Diagram . 7
4.2 Absolute limiting ratings . 9
4.3 Operating conditions . 10
4.4 Functional specification. 10
4.4.1 Transmitter electrical characteristics . 10
4.4.2 Receiver electrical characteristics . 11
4.4.3 Transmitter optical characteristics . 11
4.4.4 Receiver optical characteristics . 11
(informative)  Optical coupling to chip scale package – Recommended optical
interface scheme . 13
Bibliography . 15

Figure 1 – Block diagram for chip scale package of 4ch transceiver . 8
Figure 2 – Block diagram for chip scale package of 12ch transmitter . 8
Figure 3 – Block diagram for chip scale package of 12ch receiver. 9
Figure A.1 – Recommended optical coupling scheme for output beam from chip scale
package to multimode fibre . 13
Figure A.2 – Recommended optical coupling scheme for output beam from chip scale
package to polymer waveguide . 14

Table 1 – Terminal function definitions . 9
Table 2 – Absolute limiting ratings . 10
Table 3 – Operating conditions . 10
Table 4 – Transmitter electrical characteristics . 11
Table 5 – Receiver electrical characteristics . 11
Table 6 – Transmitter optical characteristics . 11
Table 7 – Receiver optical characteristics . 12

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PERFORMANCE STANDARDS –
Part 11: Multiple channel transmitter/receiver chip scale package with
multimode fibre interface
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62149-11 has been prepared by subcommittee 86C: Fibre optic
systems and active devices, of IEC technical committee 86: Fibre optics.
The text of this International Standard is based on the following documents:
CDV Report on voting
86C/1596/CDV 86C/1615/RVC
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62149 series, published under the general title Fibre optic active
components and devices – Performance standards, can be found on the IEC website.

– 4 – IEC 62149-11:2020 © IEC 2020
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
A photonic chip scale package (CSP) is used to convert electrical signals into optical signals
and vice-versa. This document covers the performance standards for photonic chip scale
packages for use with multimode fibre through free space optics or multiple channel optical
fibre connectors.
– 6 – IEC 62149-11:2020 © IEC 2020
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PERFORMANCE STANDARDS –
Part 11: Multiple channel transmitter/receiver chip scale package with
multimode fibre interface
1 Scope
This part of IEC 62149 specifies the performance standards for a multiple channel
transmitter/receiver chip scale package (CSP) with multimode fibre interface that operates at
up to 28 Gbit/s per channel. It specifies the parameters that apply, with clearly defined
conditions, severities, and pass/fail criteria. The tests are intended to be run as an initial design
verification to prove any product's ability to satisfy the performance standard's requirements.
A product that has been shown to meet all the requirements of a performance standard can be
declared as complying with the performance standard, but is then controlled by a quality
assurance/quality conformance program.
2 Normative references
There are no normative references in this document.
3 Terms and definitions, abbreviated terms and symbols
For the purposes of this document, the following terms, definitions and abbreviated terms apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
photonic chip scale package
chip O/E and/or E/O convertor, where electrical I/Os and optical I/Os are also included
3.2 Abbreviated terms
CDR clock data recovery
CSP chip scale package
DIN inverted data input voltage

DIP non-inverted data input voltage
E/O electrical to optical
I/O input/output
LD laser diode
MOD optical modulator
O/E optical to electrical
OMA optical modulation amplitude

PD photodiode
RH relative humidity
TIA transimpedance amplifier
VDD power supply voltage
3.3 Symbols
Δλ spectral radiation bandwidth
E extinction ratio
x
λ central wavelength
c
P optical output power
o
S receiver sensitivity
T ambient temperature
amb
T case temperature
C
t fall time
f
t rise time
r
T storage temperature
stg
V nominal operating voltage
nom
V data output voltage
O
4 Product parameters
4.1 Diagram
The chip scale package is constructed with a silicon photonics platform. Alternatives of 4ch
transceiver (transmitter and receiver), 12ch transmitter, and 12ch receiver are specified. The
block diagram for the 4ch transceiver is shown in Figure 1; the 12ch transmitter is shown in
Figure 2, and the 12ch receiver is shown in Figure 3. The transmitter and receiver do not contain
CDR functions, so the external CDR functions shall be provided as separate chips when needed.
The terminal definitions for all alternatives are summarized in Table 1. The definitions for "p"
and "n" for electrical signal inputs and outputs are "non-inverted" and "inverted" respectively.

– 8 – IEC 62149-11:2020 © IEC 2020

Figure 1 – Block diagram for chip scale package of 4ch transceiver

Figure 2 – Block diagram for chip scale package of 12ch transmitter

Figure 3 – Block diagram for chip scale package of 12ch receiver
Table 1 – Terminal function definitions
Symbol Function
GND Ground
GPIO General purpose I/O
MONOUT Optical power monitor output
SCL 2-wire serial interface clock
SDA 2-wire serial interface data
TMON Temperature monitor output
VBIAS1 Bias voltage 1 for optical modulator
VBIAS2 Bias voltage 2 for optical modulator
VDD 1,0 V power supply
VDD33 3,3 V power supply
VPD PD bias voltage
VPLD LD driver power supply
4.2 Absolute limiting ratings
Absolute limiting (maximum and/or minimum) ratings are listed in Table 2.
It should not be assumed that limiting values of more than one parameter can be applied at any
one time.
– 10 – IEC 62149-11:2020 © IEC 2020
Table 2 – Absolute limiting ratings
Parameter Symbol Min. Max. Units Notes
Storage temperature −40 80 °C
1,0 V Power supply voltage VDD −0,5 1,3 V
3,3 V power supply voltage VDD33 −0,5 4,0 V
3,3 V power supply voltage for PD VPD −0,5 4,0 V
3,3 V power supply voltage for LD VPLD −0,5 4,0 V
Data input voltage – single ended DIP, DIN −0,5 VDD33 + 0,5 V
Data input voltage – differential |DIP – DIN| 1,3 V
Control input voltage SCL, SDA −0,5 VDD33 + 0,5 V
Bias voltage VBIAS1, VBIAS2 −0,1 VDD33 + 0,1 V
Analog input/output port for debug GPIO −0,5 4,0 V
a
RH 5 95 %
Relative humidity
Soldering temperature  260 (for 10 s) °C
a
No condensation allowed.
4.3 Operating conditions
Operating conditions are listed in Table 3.
Table 3 – Operating conditions
Parameter Symbol Min. Typ. Max. Units Reference
Case temperature T
0 70 °C
C
1,0 V power supply voltage VDD 1,0 1,02 1,1 V
3,3 V power supply voltage VDD33 3,135 3,3 3,465 V
Signal rate per channel  1,0 28 Gbit/s
MMF fibre length (2 000 MHz·km) Maximum length is for
0,5 300 m the signal rate of
28 Gbit/s
The specifications in 4.4 describe the functional requirements which shall be satisfied for the
operating conditions specified in Table 3.
Annex A describes a recommended optical interface scheme for optical coupling from
multimode transmission fibre to chip scale package.
4.4 Functional specification
4.4.1 Transmitter electrical characteristics
Transmitter electrical characteristics are listed in Table 4.

Table 4 – Transmitter electrical characteristics
Parameter Symbol Min. Typ. Max. Units Reference
Differential data input voltage |DIP – DIN| 200 1 200 mV
Data input common mode voltage 0 VDD33 V
Differential input impedance
90 100 110 Ω
Data input rise and fall times (20 % to
35 ps
80 %)
4.4.2 Receiver electrical characteristics
The receiver characteristics in Table 5 are defined over the recommended operating conditions.
Typical values are T = 40 °C
c
Table 5 – Receiver electrical characteristics
Parameter Symbol Min. Typ. Max. Units Reference
Data output differential peak-to-peak
V
400 1 000 mVpp
o
voltage swing
Data output common mode voltage 0,5 0,55 V = VDD/2
t
Output rise time (20 % to 80 %) 16 20 ps
r
t
Output fall time (20 % to 80 %) 14 20 ps
f
Low frequency cut-off  100 kHz
Receiver differential data output load
90 100 110 Ω
4.4.3 Transmitter optical characteristics
Transmitter optical characteristics are listed in Table 6.
Table 6 – Transmitter optical characteristics
Parameter Symbol Min. Typ. Max. Units Reference
Average output optical power P −3 2,0 dBm
o
(each channel)
Average output optical power – disabled  −15 dBm

(each channel)
Extinction ratio E 2,0 3,5 dB

x
Centre wavelength λ 1 280 1 320 nm

c
Spectral width – RMS Δλ 3 5 nm

4.4.4 Receiver optical characteristics
Receiver optical characteristics are listed in Table 7.

– 12 – IEC 62149-11:2020 © IEC 2020
Table 7 – Receiver optical characteristics
Parameter Symbol Min. Typ. Max. Units Reference
a
S  −9,0 dBm
Input optical power sensitivity
(each channel)
a
−2,0  dBm
Overload optical power(OMA)
(each channel)
Operating centre wavelength λ 1 280 1 320 nm
c
Return loss 10  dB
a −12
Bit-error ratio = 10
(informative)
Optical coupling to chip scale package – Recommended optical interface
scheme
The transmitter/receiver chip scale package has a free-space optical interface. The optical
coupling scheme to multimode fibre (A1-OMx series: IEC 60793-2-10) is shown in Figure A.1,
and the optical coupling scheme to polymer waveguide is shown in Figure A.2.
The chip scale package using a silicon photonics platform uses grating couplers to couple the
output beam. The grating coupler produces a tilted beam output, typically at 8 °. The output
beam from the grating coupler is guided by an optical guiding structure to the surface of the
package. The optical reference plane is defined at the top surface of the package.
Proper structure to place the MMF with an angled facet
...