IEC 62769-1:2021

Field Device Integration (FDI) - Part 1: Overview

IEC 62769-1:2021 is available as IEC 62769-1:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62769-1:2021 describes the concepts and overview of the Field Device Integration (FDI) specifications. The detailed motivation for the creation of this technology is also described (see 4.1). Reading this document is helpful to understand the other parts of this multi-part standard.

Intégration des appareils de terrain (FDI) - Partie 1: Vue d'ensemble

IEC 62769-1:2021 est disponible sous forme de IEC 62769-1:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 62769-1:2021 décrit les concepts et donne une vue d'ensemble des spécifications d'intégration des appareils de terrain (FDI). La motivation détaillée pour la création de cette technologie est également décrite (voir 4.1). La lecture du présent document est utile pour comprendre les autres parties de cette norme en plusieurs parties.

General Information

• Status: Published
• Publication Date: 04-Feb-2021
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Current Stage: PPUB - Publication issued
• Completion Date: 05-Feb-2021

Standards Content (sample)

IEC 62769-1
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 1: Overview
Intégration des appareils de terrain (FDI) –
Partie 1: Vue d'ensemble
IEC 62769-1:2021-02(en-fr)
---------------------- Page: 1 ----------------------
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IEC 62769-1
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 1: Overview
Intégration des appareils de terrain (FDI) –
Partie 1: Vue d'ensemble
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9307-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62769-1:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions, abbreviated terms and conventions .................................................... 7

3.1 Terms and definitions .............................................................................................. 7

3.2 IEC TR 62541-1 terms (OPC UA) .......................................................................... 10

3.3 IEC 62541-3 (OPC UA) terms ............................................................................... 10

3.4 IEC 62541-4 (OPC UA) terms ............................................................................... 11

3.5 IEC 62541-5 (OPC UA) terms ............................................................................... 11

3.6 IEC 62541-100 (OPC UA for Devices) terms ......................................................... 11

3.7 Abbreviated terms ................................................................................................. 12

3.8 Conventions .......................................................................................................... 12

4 Background ................................................................................................................... 12

4.1 Motivation ............................................................................................................. 12

4.2 Electronic Device Description Language (EDDL) ................................................... 13

4.3 Field Device Tool (FDT ) ..................................................................................... 13

4.4 OPC Unified Architecture (OPC UA) ...................................................................... 14

5 Architecture ................................................................................................................... 14

5.1 Overview............................................................................................................... 14

5.2 FDI Packages ....................................................................................................... 15

5.3 FDI Client ............................................................................................................. 16

5.4 FDI Server ............................................................................................................ 16

5.5 FDI Communication Server ................................................................................... 17

5.6 User Interface tiering ............................................................................................ 17

5.7 FDI security considerations ................................................................................... 17

5.8 Redundancy .......................................................................................................... 18

6 Deployment ................................................................................................................... 18

6.1 Overview............................................................................................................... 18

6.2 Engineering, operator and maintenance stations ................................................... 19

6.3 FDI Server ............................................................................................................ 19

6.4 FDI Communication Servers ................................................................................. 19

6.5 Device Tools ......................................................................................................... 19

6.6 Third-party Tools .................................................................................................. 19

6.7 Handheld Tools ..................................................................................................... 19

6.8 Generic OPC UA Clients ....................................................................................... 19

7 FDI Host ........................................................................................................................ 19

7.1 Overview............................................................................................................... 19

7.2 FDI Host Variants and Entities .............................................................................. 20

7.3 FDI Host Facets .................................................................................................... 20

8 Life-cycle model ............................................................................................................ 21

8.1 Overview............................................................................................................... 21

8.2 Identification mechanism ....................................................................................... 21

8.3 Versioning mechanism .......................................................................................... 22

8.3.1 Version levels ................................................................................................ 22

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IEC 62769-1:2021 © IEC 2021 – 3 –

8.3.2 FDI Technology Version ................................................................................ 22

8.3.3 Forward compatibility ..................................................................................... 25

Annex A (informative) FDI life-cycle concept summary ......................................................... 27

A.1 General ................................................................................................................. 27

A.2 Life-cycle relevant topics (references) ................................................................... 27

Annex B (informative) Issue reporting .................................................................................. 28

Bibliography .......................................................................................................................... 29

Figure 1 – FDI architecture diagram ...................................................................................... 15

Figure 2 – Typical deployment scenario ................................................................................ 18

Figure 3 – FDI Technology Version dependencies ................................................................ 23

Table 1 – FDI Host Variants and possible Facets .................................................................. 20

Table 2 – FDI Host Facets and related FDI Entities ............................................................... 21

Table 3 – Summary of influences on the FDI Technology Version ......................................... 25

Table 4 – Combinations of Minor Versions that require special handling ............................... 25

Table A.1 – Life-cycle aspects as part of the FDI technology ................................................ 27

Table A.2 – Life-cycle aspects as part of products and services provided with the FDI

technology ............................................................................................................................ 27

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– 4 – IEC 62769-1:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 1: Overview
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62769-1 has been prepared by subcommittee 65E: Devices and

integration in enterprise systems, of IEC technical committee 65: Industrial-process

measurement, control and automation.

This second edition cancels and replaces the first edition published in 2015. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) support for generic protocol extension for faster adoption of other technologies;

b) digital signature now include trusted timestamping for long term validation of FDI Package;

c) support of new protocols.
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IEC 62769-1:2021 © IEC 2021 – 5 –
The text of this International Standard is based on the following documents:
FDIS Report on voting
65E/758/FDIS 65E/768/RVD

Full information on the voting for the approval of this International Standard can be found in the

report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62769 series, published under the general title Field Device

Integration (FDI), can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

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– 6 – IEC 62769-1:2021 © IEC 2021
INTRODUCTION

The IEC 62769 series has the general title Field Device Integration (FDI) and the following

parts:
– Part 1: Overview
– Part 2: FDI Client
– Part 3: FDI Server
– Part 4: FDI Packages
– Part 5: FDI Information Model
– Part 6: FDI Technology Mapping
– Part 7: FDI Communication Devices
– Part 100: Profiles – Generic Protocol Extensions
– Part 101-1: Profiles – Foundation Fieldbus H1
– Part 101-2: Profiles – Foundation Fieldbus HSE
– Part 103-1: Profiles – PROFIBUS
– Part 103-4: Profiles – PROFINET
– Part 109-1: Profiles – HART and WirelessHART
– Part 115-2: Profiles – Protocol-specific Definitions for Modbus RTU
– Part 150-1: Profiles – ISA 100.11a
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IEC 62769-1:2021 © IEC 2021 – 7 –
FIELD DEVICE INTEGRATION (FDI) –
Part 1: Overview
1 Scope

This part of IEC 62769 describes the concepts and overview of the Field Device Integration

(FDI) specifications. The detailed motivation for the creation of this technology is also described

(see 4.1). Reading this document is helpful to understand the other parts of this multi-part

standard.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC TR 62541-1, OPC Unified Architecture – Part 1: Overview and concepts
IEC 62541-3, OPC Unified Architecture – Part 3: Address Space Model
IEC 62541-4, OPC Unified Architecture – Part 4: Services
IEC 62541-5, OPC Unified Architecture – Part 5: Information Model
IEC 62541-100, OPC Unified Architecture – Part 100: Device Interface
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions

For the purposes of this document, the following terms and definitions given in IEC TR 62541-1,

IEC 62541-3, IEC 62541-4, IEC 62541-5, IEC 62541-100, as well as the following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
Field Device Integration
FDI
device integration and device management technology, combining base concepts and

technology aspects of the Electronic Device Description Language (EDDL) according to

IEC 61804 and Field Device Tool (FDT ) according to IEC 62453, as well as in IEC 62541-1

(OPC UA)

Note 1 to entry: The combination of those different proven technologies ensures a secure life cycle and the ability

to address all challenges of Device Integration and Device Management in a scalable manner.

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– 8 – IEC 62769-1:2021 © IEC 2021
3.1.2
Action
procedure that requires collaboration between an FDI Client and an FDI Server
3.1.3
Business Logic

descriptive element of an FDI Package that specifies the device-specific behavior and/or

mapping logic for a Nested Communication
3.1.4
Business Logic Interface
interface through which Business Logic is integrated with the Information Model
3.1.5
Communication Device
physical device that provides access to networks and devices
Note 1 to entry: Gateways and routers are examples of communication devices.
3.1.6
Connection Point

logical representation of a connection of a communication end point to a communication

network
3.1.7
Device Access Services

set of services through which a User Interface Plug-in accesses the Information Model of an

FDI Server
3.1.8
Device Definition
required element of an FDI Package that provides the core definition of a device
3.1.9
Device Instance
representation of a specific device in the Information Model of an FDI Server
3.1.10
Device Tool
standalone application that contains both an FDI Client and an FDI Server
3.1.11
Device Topology
arrangement of communication networks and devices that forms a network
3.1.12
Device Type
representation of a type of device in the Information Model of an FDI Server
3.1.13
FDI Client

software component that uses the Information Model, interprets user interface descriptions, and

hosts user interface plug-ins
3.1.14
FDI Communication Server
OPC UA server that is used by an FDI Server to access non-native networks
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IEC 62769-1:2021 © IEC 2021 – 9 –
3.1.15
FDI Package

collection of components that provide all the information necessary to integrate a type of device

into a system
3.1.16
FDI Server

software component that implements the Information Model, executes Business Logic, and

communicates with device via Native Communication and/or Nested Communication
3.1.17
FDI Technology Version

version number that identifies to a specific revision of the overall FDI technology

3.1.18
Hosting Services

set of services through which a User Interface Plug-in interacts with an FDI Client

3.1.19
Information Model
set of objects, variables, and methods exposed by an FDI Server
3.1.20
Modular Device
device that is composed of one or more subdevices
3.1.21
Native Communication
communication with devices that are an integral part of the system
3.1.22
Nested Communication
communication with devices through a series of communication devices
3.1.23
Offline Data

device information maintained by an FDI Server that is stored in an FDI Server-specific

database
3.1.24
Online Data

device information maintained by an FDI Server that is retrieved from a physical device

3.1.25
User Interface Services
UI Services

set of services through which a User Interface Plug-in accesses the operating system

3.1.26
Platform User Interface Services
platform UI services
user interface services provided natively by the operating system
3.1.27
User Interface Description
UID

descriptive element of an FDI package that is used by an FDI Client to render user interface

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– 10 – IEC 62769-1:2021 © IEC 2021
3.1.28
User Interface Description Interpreter
UID interpreter

software component in an FDI Client that renders user interface descriptions and invokes

actions
3.1.29
User Interface Plug-In
UIP
executable element of an FDI package that is executed by an FDI Client
3.1.30
User Interface Plug-In Services
UIP services

set of services through which an FDI Client interacts with a user interface plug-in

3.2 IEC TR 62541-1 terms (OPC UA)

For the purposes of this document, the following terms and definitions given in IEC TR 62541-1

apply.
AddressSpace
Attribute
Client
Method
Node
NodeClass
Notification
Object
ObjectType
Reference
ReferenceType
Server
Service Set
Session
Subscription
Variable
3.3 IEC 62541-3 (OPC UA) terms

For the purposes of this document, the following terms and definitions given in IEC 62541-3

apply.
Aggregates
ArrayDimensions
AuditEvent
AuditUpdateMethodEvent
BrowseName
ByteString
DataType
DataVariable
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IEC 62769-1:2021 © IEC 2021 – 11 –
Folder
HasComponent
HasProperty
HasSubType
HasTypeDefinition
ModellingRule
NodeId
Property
UserAccessLevel
UserExecutable
Value
ValueRank
3.4 IEC 62541-4 (OPC UA) terms

For the purposes of this document, the following terms and definitions given in IEC 62541-4

apply.
AddReferences
Browse
BrowseNext
Call
CreateSession
NodeManagement
Read
Request Header
Response Header
StatusCode
TranslateBrowsePathsToNodeIds
UserIdentityToken
Write
3.5 IEC 62541-5 (OPC UA) terms

For the purposes of this document, the following terms and definitions given in IEC 62541-5

apply.
BaseObjectType
PropertyType
3.6 IEC 62541-100 (OPC UA for Devices) terms

For the purposes of this document, the following terms and definitions given in IEC 62541-100

apply.
Block
Device
DeviceType
Parameter
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– 12 – IEC 62769-1:2021 © IEC 2021
3.7 Abbreviated terms
DTM Device Type Manager
EDD Electronic Device Description
EDDL Electronic Device Description Language
FB Function blocks
FDI Field Device Integration
Field Device Tool (see IEC 62453)
FDT
GUI Graphical User Interface
n/a Not applicable
OPC Open packaging conventions
OPC UA OPC Unified Architecture (see IEC 62541)
PC Personal computer
PNO PROFIBUS Nutzerorganisation e. V. (is a regional organization of the
PROFIBUS and PROFINET International consortium)
RPC Remote Procedure Call
UI User Interface
UID User Interface Description
UIP User Interface Plug-in
UUID Universally unique identifier
XML Extensible markup language
ZVEI Zentralverband Elektrotechnik- und Elektronikindustrie e. V.
3.8 Conventions

Capitalization of the first letter of words beyond those defined in ISO/IEC Directives Part 2 is

used in the IEC 62769 series to emphasize an FDI-specific meaning. It is used for the following

cases:
• Defined terms
• Names of Services defined in IEC 62769-2
• Names of FDI Package elements defined in IEC 62769-4
• Names of Information Model elements defined in IEC 62769-5
EDD language elements are written with all letters in uppercase.
4 Background
4.1 Motivation

In today’s automation systems, field devices from many different suppliers have to be integrated

into the system, which results in additional effort for installation, version management and

operation of these devices. This challenge is best met with an open and standardized device

integration solution.
___________

FDT logo is a trade name of the non-profit organization FDT Group AISBL. This information is given for the

convenience of users of this part of IEC 62769 and does not constitute an endorsement by IEC of the trade names

holder or any of its products. Compliance does not require use of the registered trade name. Use of the trade

names requires permission of the trade name holder.
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IEC 62769-1:2021 © IEC 2021 – 13 –

Two different device integration technologies exist: the Electronic Device Description Language

(EDDL) in accordance with IEC 61804 and the Field Device Tool (FDT ) in accordance with

IEC 62453. While these technologies take different approaches to solve the problem, there is a

lot of overlap between them. This has led to a situation where the technologies compete instead

of complementing each other. As a result, system suppliers have taken their positions, device

suppliers have had to double their efforts in order to support EDDL and FDT , and the end

users have become frustrated because they want the best of both technologies.

For all parties involved, the ideal solution looks different. System suppliers want to

...