IEC 62769-1:2023

Field Device Integration (FDI®) - Part 1: Overview

IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Intégration des appareils de terrain (FDI®) - Partie 1: Vue d'ensemble

L'IEC 62769-1:2023 décrit les concepts et présente une vue d'ensemble des spécifications relatives à l'intégration des appareils de terrain (FDI®[1], Field Device Integration). La motivation détaillée pour la création de cette technologie est également décrite . La lecture du présent document est utile pour comprendre les autres parties de cette norme en plusieurs parties.
[1] FDI® est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des utilisateurs du présent document et ne signifie nullement que l'IEC approuve le détenteur de la marque ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de la marque. L'utilisation de la marque exige l'autorisation du détenteur de la marque.

General Information

• Status: Published
• Publication Date: 03-Apr-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Drafting Committee: WG 7 - TC 65/SC 65E/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 09-Mar-2023
• Completion Date: 04-Apr-2023

Relations

• Revises: IEC 62769-1:2021 - Field Device Integration (FDI) - Part 1: Overview
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62769-1 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI®) –
Part 1: Overview
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: [phone]
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 62769-1 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI®) –
Part 1: Overview
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6801-8
– 2 – IEC 62769-1:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION .
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms and conventions acronyms . 8
3.1 Terms and definitions . 8
3.2 IEC TR 62541-1 terms (OPC UA) . 11
3.3 IEC 62541-3 (OPC UA) terms . 11
3.4 IEC 62541-4 (OPC UA) terms . 12
3.5 IEC 62541-5 (OPC UA) terms . 12
3.6 IEC 62541-100 (OPC UA for Devices) terms . 12
3.7 Abbreviated terms and acronyms . 12
3.8 Conventions . 13
4 Background . 13
4.1 Motivation . 13
4.2 Electronic Device Description Language (EDDL) . 14 ®
4.3 Field Device Tool (FDT ) . 14
4.4 OPC Unified Architecture (OPC UA) . 15
5 Architecture . 16
5.1 Overview. 16 ®
5.2 FDI Packages . 16 ®
5.3 FDI Client . 17 ®
5.4 FDI Server . 17 ®
5.5 FDI Communication Server. 18
5.6 User Interface tiering . 18 ®
5.7 FDI security considerations . 18
5.8 Redundancy . 19
6 Deployment . 19
6.1 Overview. 19
6.2 Engineering, operator and maintenance stations . 20 ®
6.3 FDI Server . 20 ®
6.4 FDI Communication Servers . 21
6.5 Device Tools . 21
6.6 Third-party Tools . 21
6.7 Handheld Tools . 21
6.8 Generic OPC UA Clients . 21 ®
7 FDI Host . 21
7.1 Overview. 21 ®
7.2 FDI Host Variants and Entities . 21 ®
7.3 FDI Host Facets . 22
8 Life-cycle Model . 22
8.1 Overview. 22
8.2 Identification mechanism . 23
8.3 Versioning mechanism . 23
8.3.1 Version levels . 23 ®
8.3.2 FDI Technology Version . 24

8.3.3 Forward compatibility . 27 ®
Annex A (informative) FDI life-cycle concept summary . 29
A.1 General . 29
A.2 Life-cycle relevant topics (references) . 29
Annex B (informative) Issue reporting .
Bibliography . 32
®
Figure 1 – FDI architecture diagram . 16
Figure 2 – Typical deployment scenario . 20 ®
Figure 3 – FDI Technology Version dependencies . 25
®
Table 1 – FDI Host Variants and possible Facets . 22
® ®
Table 2 – FDI Host Facets and related required FDI Entities . 22 ®
Table 3 – Summary of influences on the FDI Technology Version . 26
Table 4 – Combinations of Minor Versions that require special handling . 27 ®
Table A.1 – Life-cycle aspects as part of the FDI technology . 29 ®
Table A.2 – Life-cycle aspects as part of products and services provided with the FDI
technology . 30

– 4 – IEC 62769-1:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –

Part 1: Overview
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62769-1:2021. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62769-1 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2021. This edition
constitutes a technical rev
...

IEC 62769-1 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI®) –
Part 1: Overview
Intégration des appareils de terrain (FDI®) –
Partie 1: Vue d'ensemble
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
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and withdrawn publications.
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Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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further assistance, please contact the Customer Service
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IEC 62769-1 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI®) –

Part 1: Overview
Intégration des appareils de terrain (FDI®) –

Partie 1: Vue d'ensemble
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6441-6

– 2 – IEC 62769-1:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and acronyms . 7
3.1 Terms and definitions . 7
3.2 IEC TR 62541-1 terms (OPC UA) . 9
3.3 IEC 62541-3 (OPC UA) terms . 10
3.4 IEC 62541-4 (OPC UA) terms . 10
3.5 IEC 62541-5 (OPC UA) terms . 11
3.6 IEC 62541-100 (OPC UA for Devices) terms . 11
3.7 Abbreviated terms and acronyms . 11
3.8 Conventions . 12
4 Background . 12
4.1 Motivation . 12
4.2 Electronic Device Description Language (EDDL) . 12 ®
4.3 Field Device Tool (FDT ) . 13
4.4 OPC Unified Architecture (OPC UA) . 14
5 Architecture . 14
5.1 Overview. 14 ®
5.2 FDI Packages . 15 ®
5.3 FDI Client . 16 ®
5.4 FDI Server . 16 ®
5.5 FDI Communication Server. 17
5.6 User Interface tiering . 17 ®
5.7 FDI security considerations . 17
5.8 Redundancy . 18
6 Deployment . 18
6.1 Overview. 18
6.2 Engineering, operator and maintenance stations . 19 ®
6.3 FDI Server . 19 ®
6.4 FDI Communication Servers . 19
6.5 Device Tools . 19
6.6 Third-party Tools . 19
6.7 Handheld Tools . 19
6.8 Generic OPC UA Clients . 19 ®
7 FDI Host . 19
7.1 Overview. 19 ®
7.2 FDI Host Variants and Entities . 20 ®
7.3 FDI Host Facets . 20
8 Life-cycle Model . 21
8.1 Overview. 21
8.2 Identification mechanism . 21
8.3 Versioning mechanism . 22
8.3.1 Version levels . 22 ®
8.3.2 FDI Technology Version . 22
8.3.3 Forward compatibility . 25
®
Annex A (informative) FDI life-cycle concept summary . 27
A.1 General . 27
A.2 Life-cycle relevant topics (references) . 27
Bibliography . 29
®
architecture diagram . 15
Figure 1 – FDI
Figure 2 – Typical deployment scenario . 18 ®
Figure 3 – FDI Technology Version dependencies . 23
®
Host Variants and possible Facets . 20
Table 1 – FDI
® ®
Table 2 – FDI Host Facets and required FDI Entities . 21 ®
Table 3 – Summary of influences on the FDI Technology Version . 25
Table 4 – Combinations of Minor Versions that require special handling . 25 ®
Table A.1 – Life-cycle aspects as part of the FDI technology . 27 ®
Table A.2 – Life-cycle aspects as part of products and services provided with the FDI
technology . 28

– 4 – IEC 62769-1:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –

Part 1: Overview
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for interna
...