Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

IEC 60747-16-4:2004 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT. However, this standard is applicable to the other types of switches.

Dispositifs à semiconducteurs - Partie 16-4: Circuits intégrés hyperfréquences - Commutateurs

La CEI 60747-16-4:2004 fournit de nouvelles méthodes de mesure, la terminologie et les symboles littéraux, ainsi que les valeurs assignées et caractéristiques essentielles pour les commutateurs hyperfréquences à circuits intégrés. Les commutateurs de la présente Norme sont basés sur les commutateurs unipolaires bidirectionnels (SPDT). Toutefois, la présente Norme est applicable aux autres types de commutateurs.

General Information

Status
Published
Publication Date
27-Jul-2004
Current Stage
PPUB - Publication issued
Start Date
31-Oct-2004
Completion Date
28-Jul-2004
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INTERNATIONAL IEC
STANDARD 60747-16-4
First edition
2004-07
Semiconductor devices –
Part 16-4:
Microwave integrated circuits –
Switches
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
• IEC Web Site (www.iec.ch)
• Catalogue of IEC publications
The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to
search by a variety of criteria including text searches, technical committees
and date of publication. On-line information is also available on recently issued
publications, withdrawn and replaced publications, as well as corrigenda.
• IEC Just Published
This summary of recently issued publications (www.iec.ch/online_news/ justpub)
is also available by email. Please contact the Customer Service Centre (see
below) for further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:

Email: custserv@iec.ch
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Fax: +41 22 919 03 00
INTERNATIONAL IEC
STANDARD 60747-16-4
First edition
2004-07
Semiconductor devices –
Part 16-4:
Microwave integrated circuits –
Switches
” IEC 2004  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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For price, see current catalogue

– 2 – 60747-16-4 ” IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope .5
2 Normative references .5
3 Terms and definitions .5
4 Essential ratings and characteristics .7
4.1 Circuit identification and types .7
4.2 Application description.8
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics .11
4.7 Mechanical and environmental ratings, characteristics and data .12
4.8 Additional information .12
5 Measuring methods .13
5.1 General .13
5.2 Insertion loss (L ) .14
ins
5.3 Isolation (L ) .16
iso
5.4 Return loss (L ) .18
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) .20
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ).21
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) .23
o(mod) adj
5.8 n-th order harmonic distortion ratio (P /P ).26
nth 1
Bibliography .28
Figure 1 – Circuit diagram for the measurement of the insertion loss L .14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L .16
iso
Figure 3 – Circuit for the measurements of the return loss .18
Figure 4 – Circuit for the measurements of switching time.21
Figure 5 – Input and output waveforms.21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio .23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio .26

60747-16-4 ” IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/256/FDIS 47E/261/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 60747-16-4 ” IEC:2004(E)
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

60747-16-4 ” IEC:2004(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Terms related to electrical characteristics
3.1
insertion loss
L
ins
ratio of the output power at the switched on port to the input power in the linear region of the
power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the insertion loss is expressed in decibels.

– 6 – 60747-16-4 ” IEC:2004(E)
3.2
isolation
L
iso
ratio of the output power at the switched off port to the input power in the linear region of the
power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the isolation is expressed in decibels.
3.3
return loss
L
ret
ratio of the incident power P at the specified port to the reflected power P at the same
inc ref
port in the linear region of the power transfer curve P (dBm) = f(P )
ref inc
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
ref inc
NOTE 2 Usually the return loss is expressed in decibels.
3.4
input power at 1 dB compression
P
i(1 dB)
input power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.5
output power at 1 dB compression
P
o(1dB)
output power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.6
turn on time
t
on
interval between the lower reference point on the leading edge of the control voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.7
turn off time
t
off
interval between the upper reference point on the trailing edge of the control voltage and the
lower reference point on the trailing edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.8
rise time
t
r(out)
interval between the lower reference point on the leading edge of the output voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
60747-16-
...


IEC 60747-16-4 ®
Edition 1.1 2011-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
 Catalogue of IEC publications: www.iec.ch/searchpub
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It also gives information on projects, withdrawn and replaced publications.
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IEC 60747-16-4 ®
Edition 1.1 2011-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
CL
ICS 31.080.99 ISBN 978-2-88912-417-6

– 2 – 60747-16-4  IEC:2004+A1:2009(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 8
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 13
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 17
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 19
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 20
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) . 22
o(mod) adj
5.8 nth order harmonic distortion ratio (P /P ) (P /P ) . 26
nth 1 1 nth
Bibliography . 28

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 17
Figure 4 – Circuit for the measurements of switching time . 20
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 26

60747-16-4  IEC:2004+A1:2009(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

This consolidated version of IEC IEC 60747-16-4 consists of the first edition (2004)
[documents 47E/256/FDIS and 47E/261/RVD] and its amendment 1 (2009) [documents
47E/358/CDV and 47E/373/RVC]. It bears the edition number 1.1.
The technical content is therefore identical to the base edition and its amendment and
has been prepared for user convenience. A vertical line in the margin shows where the
base publication has been modified by amendment 1. Additions and deletions are
displayed in red, with deletions being struck through.

– 4 – 60747-16-4  IEC:2004+A1:2009(E)
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

60747-16-4  IEC:2004+A1:2009(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60617, Graphical symbols for diagrams
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60747-16-1:2001, Semiconductor devices – Part 16-1: Microwave integrated circuits –
Amplifiers
Amendment 1 (2007)
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
___________
There exists a consolidated edition 1.1 published in 2007, including the base publication (2001) and its
Amendment 1 (2007).
– 6 – 60747-16-4  IEC:2004+A1:2009(E)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Terms related to electrical characteristics
3.1
insertion loss
L
ins
ratio of the out input power to the output power at the switched on port, to the input power in
the linear region of the power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, ΔP (dBm) = ΔP (dBm).
o i
NOTE 2 Usually the insertion loss is expressed in decibels.
3.2
isolation
L
iso
ratio of the out input power to the output power at the switched off port, to the input power in
the linear region of the power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, ΔP (dBm) = ΔP (dBm).
o i
NOTE 2 Usually the isolation is expressed in decibels.
3.3
return loss
L
ret
ratio of the incident power P at the specified port to the reflected power P at the same
inc ref
port in the linear region of the po
...


IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
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and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

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Centre: csc@iec.ch.
IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-4751-8

IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
REDLINE VERSION
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches
– 2 – IEC 60747-16-4:2004+AMD1:2009
+AMD2:2017 CSV © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 9
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 13
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 17
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 19
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 20
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) (P /P ) . 22
o(mod) adj adj o(mod)
5.8 nth order harmonic distortion ratio (P /P ) . 25
nth 1
Bibliography . 27

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 17
Figure 4 – Circuit for the measurements of switching time . 20
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 25

+AMD2:2017 CSV © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This consolidated version of the official IEC Standard and its amendments has been prepared
for user convenience.
IEC 60747-16-4 edition 1.2 contains the first edition (2004-07) [documents 47E/256/FDIS and
47E/261/RVD], its amendment 1 (2009-03) [documents 47E/358/CDV and 47E/373/RVC] and its
amendment 2 (2017-08) [documents 47E/546/CDV and 47E/563/RVC].
In this Redline version, a vertical line in the margin shows where the technical
content is modified by amendments 1 and 2. Additions are in green text,
deletions are in strikethrough red text. A separate Final version with all changes
accepted is available in this publication.

– 4 – IEC 60747-16-4:2004+AMD1:2009
+AMD2:2017 CSV © IEC 2017
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

+AMD2:2017 CSV © IEC 2017
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60617, Graphical symbols for diagrams (available from )
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-1:2006/AMD1:2010
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60747-16-1:2001, Semiconductor devices – Part 16-1: Microwave integrated circuits –
Amplifiers
IEC 60747-16-1:2001/AMD1:2007
IEC 60747-16-1:2001/AMD2:2017
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IE
...


IEC 60747-16-4 ®
Edition 1.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
 Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
 IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
 Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
 Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
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A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
 Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
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publications parues. Disponible en-ligne et aussi par email.
 Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
 Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: csc@iec.ch
Tél.: +41 22 919 02 11
Fax: +41 22 919 03 00
IEC 60747-16-4 ®
Edition 1.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 31.080.99 ISBN 978-2-88912-574-6

– 2 – 60747-16-4  IEC:2004
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 8
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 11
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 12
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 18
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 20
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 21
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) . 23
o(mod) adj
5.8 n-th order harmonic distortion ratio (P /P ) . 26
nth 1
Bibliography . 28

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 18
Figure 4 – Circuit for the measurements of switching time . 21
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 26

60747-16-4  IEC:2004 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This bilingual version, published in 2011-07, corresponds to the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/256/FDIS 47E/261/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 60747-16-4  IEC:2004
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60747-16-4  IEC:2004 – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60748-2, Semiconduct
...


IEC 60747-16-4 ®
Edition 1.1 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
 Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
 IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
 Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
 Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: csc@iec.ch
Tel.: +41 22 919 02 11
Fax: +41 22 919 03 00
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
 Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
 Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
 Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
 Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: csc@iec.ch
Tél.: +41 22 919 02 11
Fax: +41 22 919 03 00
IEC 60747-16-4 ®
Edition 1.1 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX CL
ICS 31.080.99 ISBN 978-2-88912-773-3

– 2 – 60747-16-4  IEC:2004+A1:2009
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 8
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 13
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 17
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 19
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 20
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) . 22
o(mod) adj
5.8 nth order harmonic distortion ratio (P /P ) (P /P ) . 26
nth 1 1 nth
Bibliography . 28

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 17
Figure 4 – Circuit for the measurements of switching time . 20
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 26

60747-16-4  IEC:2004+A1:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
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This consolidated version of IEC 60747-16-4 consists of the first edition (2004)
[documents 47E/256/FDIS and 47E/261/RVD] and its amendment 1 (2009) [documents
47E/358/CDV and 47E/373/RVC]. It bears the edition number 1.1.
The technical content is therefore identical to the base edition and its amendment and
has been prepared for user convenience. A vertical line in the margin shows where the
base publication has been modified by amendment 1. Additions and deletions are
displayed in red, with deletions being struck through.

– 4 – 60747-16-4  IEC:2004+A1:2009
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The French version of this standard has not been voted upon.
This bilingual consolidated version (2011-11) replaces the English version.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of the base publication and its amendments will
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IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
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60747-16-4  IEC:2004+A1:2009 – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT
...


IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

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IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –

Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-8955-6

IEC 60747-16-4 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
REDLINE VERSION
VERSION REDLINE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

– 2 – IEC 60747-16-4:2004+AMD1:2009
+AMD2:2017 CSV © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 9
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 12
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 17
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 19
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 20
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) (P /P ) . 22
o(mod) adj adj o(mod)
5.8 nth order harmonic distortion ratio (P /P ) . 25
nth 1
Bibliography .

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 17
Figure 4 – Circuit for the measurements of switching times . 20
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 26

+AMD2:2017 CSV © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This consolidated version of the official IEC Standard and its amendments has been
prepared for user convenience.
IEC 60747-16-4 edition 1.2 contains the first edition (2004-07) [documents 47E/256/FDIS
and 47E/261/RVD], its amendment 1 (2009-03) [documents 47E/358/CDV and
47E/373/RVC] and its amendment 2 (2017-08) [documents 47E/546/CDV and
47E/563/RVC].
In this Redline version, a vertical line in the margin shows where the technical content
is modified by amendments 1 and 2. Additions are in green text, deletions are in
strikethrough red text. A separate Final version with all changes accepted is available
in this publication.
– 4 – IEC 60747-16-4:2004+AMD1:2009
+AMD2:2017 CSV © IEC 2017
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of the base publication and its ame
...

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