IEC PAS 62250:2001

Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)

Covers qualification and performance requirements of rigid printed boards which may be single-sided, double-sided, with or without plated-through holes, multilayer with plated-through holes, multilayer with or without buried/blind vias, and metal core boards.

General Information

• Status: Withdrawn
• Publication Date: 21-May-2001
• Withdrawal Date: 28-Oct-2004
• ICS: 33.200 - Telecontrol. Telemetering
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: WPUB - Publication withdrawn
• Start Date: 31-Oct-2004
• Completion Date: 29-Oct-2004

Standards Content (Sample)

IEC/PAS 62250
Edition 1.0
2001-05
Qualification and performance
specification for rigid
printed boards
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62250
C O MMI S S I O N
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
IPC-6012A
with Amendment 1
Qualification and Performance
Specification for Rigid
Printed Boards
IPC-6012A
with Amendment 1
July 2000 A standard developed by IPC
2215 Sanders Road, Northbrook, IL 60062-6135
Supersedes IPC-6012A
Tel. [phone]  Fax [phone]
October 1999
www.ipc.org
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
QUALIFICATION AND PERFORMANCE SPECIFICATION

FOR RIGID PRINTED BOARDS
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the

public and established in an organization operating under given procedures.

IEC-PAS 62250 was submitted by the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) and
has been processed by IEC technical committee 91: Surface mounting technology.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
91/210/PAS 91/236/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and IPC and is
recorded at the Central Office.
The IPC has the leadership position on this publication, as suggested by the Surface Mount Council. Any
input or suggestion from other persons or organizations, not apart of the IPC membership, has been
coordinated by the IPC during the development process.
The IEC and its members are authorized to exploit the following document:
IPC-6012A Qualification and performance specification for rigid printed boards.
under the PAS procedures for the purpose of international standardization.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
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IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
The Principles of
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• Include a feedback system on use and be defended with data

problems for future improvement
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Specification
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Revision Change
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IPC-6012A with Amendment 1
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
Qualification and
Performance Specification
for Rigid Printed Boards
Developed by the Rigid Board Performance Specifications Task Group
(D-33a) of the Rigid Printed Board Committee (D-30) of IPC

Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel [phone]
Fax [phone]
HIERARCHY OF IPC QUALIFICATION AND

PERFORMANCE SPECIFICATIONS
(6010 SERIES)
IPC-6011
GENERIC
IPC-6018
IPC-6012 IPC-6013 IPC-6014 IPC-6015 IPC-6016
HIGH
RIGID FLEX PCMCIA MCM-L HDI
FREQUENCY
FOREWORD
This specification is intended to provide information on the detailed performance criteria of rigid printed boards. It super-
sedes IPC-RB-276 and IPC-6012 and was developed as a revision to those documents. The information contained herein is
also intended to supplement the generic requirements identified in IPC-6011. When used together, these documents should
lead both manufacturer and customer to consistent terms of acceptability.
IPC’s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues.
In this regard, document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0) (i.e., IPC-6010).
Included in the set is the generic information, which is contained in the first document of the set. The generic specification
is supplemented by one or multiple performance documents, each of which provide a specific focus on one aspect of the
topic or the technology selected.
Failure to have all information available prior to building a board may result in a conflict in terms of acceptability.
As technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-
ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completion

of ‘‘Suggestions for Improvement’’ forms located at the end of each document.

July 2000 IPC-6012A with Amendment 1

Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members

of the Rigid Board Performance Specifications Task Group (D-33a) of the Rigid Printed Board Committee (D-30) are shown

below, it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the mem-

bers of the IPC extend their gratitude.

Rigid Printed Board Rigid Board Performance Technical Liaison of the

Committee SpecificationsTask Group IPC Board of Directors

Chair Chair
C. Don Dupriest Lisa Greenleaf Stan Plzak Peter Bigelow

Lockheed Martin Missiles and Space Teradyne Connection System Pensar Corp. Beaver Brook Circuits
Rigid Board Performance Specifications Task Group
Robyn L. Aagesen, Hadco Corp. Christopher Conklin, Lockheed George S. Gerberick, Velie Circuits
Martin Corp. Inc.
Dale E. Aldrich, Rockwell Collins
David J. Corbett, Defense Supply Becky A. Gillmouth, Merix
Masamitsu Aoki, Toshiba Chemical
Center Columbus Corporation
Corp.
Edward C. Couble, Shipley Co. Robert J. Gordon, Ford Motor Co.
Ivan E. Araktingi, AlliedSignal
L.L.C.
Laminate Systems Lisa A. Greenleaf, Teradyne
Frank D. Cox, Trace Laboratories - Connection System
Jerry Arreola, PairGain Technologies
East
Russell S. Griffith, Tyco PCG/
Lance A. Auer, Raytheon Missile
Charles Dal Currier, Ambitech Inc. Engineered Systems
Systems Company
Mukesh Dave, Lucent Technologies Grover Guerra, DSC
Richard A. Barnett, Compaq
Inc. Communications Corporation
Computer Corporation
Michele J. DiFranza, The Mitre Corp. Andrew J. Heidelberg, Micron
Martin W. Bayes, Shipley Co. L.L.C.
Technology Inc.
Joe Dihrkop, Defense Supply Center
Mary E. Bellon, Hughes Space &
Columbus Adam E. Hen, Celestica Inc.
Communications Co.
Fern Dove, Basic Electronics Aram Henesian, Basic Electronics
Erik J. Bergum, Polyclad Laminates
Incorporated Incorporated
Inc.
C. Don Dupriest, Lockheed Martin Steven A. Herrberg, Raytheon
John-Paul Besong, Rockwell Collins
Missiles and Space Systems Company
Robert J. Black, Northrop Grumman
Frank Durso, MacDermid Inc. Ralph J. Hersey, Ralph Hersey &
ES&SD
Associates
Theodore Edwards, Honeywell Inc.
Paul Boudreau, Raytheon Systems
Air Transport Sys Phillip E. Hinton, Hinton -PWB-
Company
Engineering
Philip J. Elias, Honeywell Inc. Air
Vern Bradshaw, Microtek
Transport Sys Kazuo Hirasaka, Eastern Company
Laboratories
Ltd.
Werner Engelmaier, Engelmaier
Mark Buechner, Teradyne Connection
Associates Robert R. Holmes, Interconnection
Systems
Technology Resea
Donna R. Fawcett, Hadco Santa
Lewis Burnett, Honeywell Inc. BCAS
Clara Inc. Lorraine Hook, Dynamic Details Inc.
Dennis J. Cantwell, Printed Circuits
Terry M. Fischer, Hitachi Chemical Les Hymes, Les Hymes Associates
Inc.
Co. America
Octavian Iordache, Viasystems
Thomas A. Carroll, Hughes Space &
Martin G. Freedman, Molex Inc. Canada Inc.
Communications Co
Mahendra S. Gandhi, Raytheon William I. Jacobi, Sheldahl Inc.
Pei-Liang Chen, Shanghai Printronics
Systems Company
Circuit Ted J. Jones, NSWC - Crane
Floyd L. Gentry, Sandia National
Kevin Y. Chen, 3M Company Roy M. Keen, Rockwell Collins
Labs Albuquerque
Steve Collins, ANTEC International Cindy A. Kemp, Evenflo Company
Corporation Inc.
iii
IPC-6012A with Amendment 1 July 2000

Thomas E. Kemp, Rockwell Collins Kelly J. Miller, CAE Electronics Ltd. Karl A. Sauter, Sun Microsystems

Inc.
Young J. Kim, Yamamoto Joseph L. Mulcahy, Methode

Manufacturing (USA) Inc Electronics Inc. East Roddy L. Scherff, Tyco Printed

Circuits
Edward Knowles, Lockheed Martin Suzanne F. Nachbor, Honeywell Inc.

Astronautics Kenneth C. Selk, TRW
Bob Neves, Microtek Laboratories

George T. Kotecki, Northrop Lowell Sherman, Defense Supply

William A. Ortloff, B/C En
...