ISO 9455-18:2024
(Main)Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
Titre manque — Partie 18: Titre manque
General Information
Standards Content (Sample)
International
Standard
ISO 9455-18
First edition
Soft soldering fluxes — Test
2024-08
methods —
Part 18:
Cleanliness of soldered printed
circuit assemblies before and/or
after cleaning
Reference number
© ISO 2024
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ii
Contents Page
Foreword .iv
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 1
5 Reagents and cleaning solvent . 2
6 Apparatus . 3
7 Procedure . 3
7.1 Preparation of the test sample .3
7.2 Test method .3
7.2.1 SIR .3
7.2.2 Ionic contamination test .3
8 Assessment and expression of results . 3
9 Test report . 3
Annex A (informative) Example of test methods and test results of cleanliness of the soldered
printed circuit boards before and/or after cleaning . 4
Annex B (informative) FT-IR analysis . 9
Bibliography .12
iii
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
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The procedures used to develop this document and those intended for its further maintenance are described
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This document was prepared by Technical Committee ISO/TC 44, Welding and allied processes, Subcommittee
SC 12, Soldering materials.
A list of all parts in the ISO 9455 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s
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iv
International Standard ISO 9455-18:2024(en)
Soft soldering fluxes — Test methods —
Part 18:
Cleanliness of soldered printed circuit assemblies before
and/or after cleaning
1 Scope
This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/
or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
3.1
flux residue
flux components remaining around the soldering area after reflow
3.2
white residue
flux components remaining around the soldering area after cleaning
4 Principle
Test sample before and/or after cleaning the soldered printed circuit assemblies is prepared without
contamination. Then, the test sample is tested by the flow chart given in Figure 1. The test methods are
detailed in Table 1.
The first step is to check for the presence or absence of flux residue on the PCB by microscope and/or SEM.
Next step is identification and/or reliability test of the flux residue. Identification of flux residue is carried
out by SEM/EDX and/or FT-IR. Reliability tests are carried out by ionic contamination tester (Ref. ROSE test)
and/or SIR and/or dielectric property test. This second step tests are optional, where users can select the
test methods to meet user’s requirements. An example of test methods and test results of cleanliness of the
soldered printed circuit boards before and/or after cleaning is provided in Annex A. An example for a FT-IR
analysis is shown in Annex B.
ISO 945
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