SIST EN 140401-804:2011
(Main)Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25
Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25
Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another. The following combinations of temperature coefficient, tolerance on rated resistance shall be used for qualification approval according to 2.2.1 and quality conformance inspection according to 2.3. Resistance values of E-series according to IEC 60063 shall be used. The qualification of resistance values below or beyond the specified resistance values is permitted, if they fulfill the requirements of the closest stability class.
Bauartspezifikation: SMD Schicht-Festwiderstände niedriger Belastbarkeit mit hoher Stabilität - Rechteckig - Stabilitätsklassen 0,1; 0,25
Spécification particulière: Résistances fixes à couche de haute stabilité et à faible dissipation CMS - Rectangulaires - Catégories de stabilité 0,1; 0,25
Podrobna specifikacija: Zelo stabilni fiksni plastni upori majhnih moči za površinsko montažo (SMD) - Pravokotni - Razreda stabilnosti 0,1 in 0,25
Različni parametri tega sestavnega dela so natančno opisani v tej specifikaciji. Nedoločeni parametri se lahko razlikujejo med sestavnimi deli. Naslednje kombinacije temperaturnega koeficienta in tolerance nazivne upornosti se uporabljajo za odobritev kvalifikacije v skladu s točko 2.2.1 ter prevzemno kontrolo v skladu s točko 2.3. Uporabljajo se vrednosti upornosti serije E v skladu s standardom IEC 60063. Dovoljena je kvalifikacija vrednosti upornosti pod ali nad določenimi vrednostmi, če izpolnjujejo zahteve najbližjega razreda stabilnosti.
General Information
Relations
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Bauartspezifikation: SMD Schicht-Festwiderstände niedriger Belastbarkeit mit hoher Stabilität - Rechteckig - Stabilitätsklassen 0,1; 0,25Spécification particulière: Résistances fixes à couche de haute stabilité et à faible dissipation CMS - Rectangulaires - Catégories de stabilité 0,1; 0,25Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,2531.040.10Fiksni uporFixed resistorsICS:Ta slovenski standard je istoveten z:EN 140401-804:2011SIST EN 140401-804:2011en01-september-2011SIST EN 140401-804:2011SLOVENSKI
STANDARD
SIST EN 140401-804:2011
EUROPEAN STANDARD EN 140401-804 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2011
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 140401-804:2011 E
ICS 31.040.10 Supersedes EN 140401-804:2005
English version
Detail Specification: Fixed low power film high stability SMD resistors -
Rectangular -
Stability classes 0,1; 0,25
Spécification particulière: Résistances fixes à couche de haute stabilité et à faible dissipation CMS -
Rectangulaires -
Catégories de stabilité 0,1; 0,25
Bauartspezifikation: SMD Schicht-Festwiderstände niedriger Belastbarkeit mit hoher Stabilität -
Rechteckig -
Stabilitätsklassen 0,1; 0,25
This European Standard was approved by CENELEC on 2011-05-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 140401-804:2011
EN 140401-804:2011 – 2 –
Foreword This European Standard was prepared by Technical Committee CENELEC TC 40XB, Resistors. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 140401-804 on 2011-05-09. This document supersedes EN 140401-804:2005. Preceding documents on the subject covered by this specification have been:
– only on resistors without established reliability, now version A: – CECC 40 401-010:1995-02;
– CECC 40 401-010:1997-10. EN 140401-804:2011 the following significant technical changes with respect to EN 140401-804:2005: – modification of the title; – introduction of a test on the resistance to electrostatic discharge in 1.6 and Annex A; – introduction of description and test methods for lead-free soldering in 1.8, 1.10.3 and Annex A; – introduction of the code letters for temperature coefficient as given in EN 60062; – revision of the ordering information in 1.9.4; – revised information on pulse load capability in 1.10.6; – revised information on resistance value drift in 1.10.7; – revised information on current noise in 1.10.9; – adoption of the IECQ rules of procedure, IEC QC 001002-3; – revision of the sample quantities and the sequence of tests in Annex A. Additionally, EN 140401-804:2011 is also an editorial revision of EN 140401-804:2005. The following dates were fixed: – latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement
(dop)
2012-05-09 – latest date by which the national standards conflicting with the EN have to be withdrawn
(dow)
2014-05-09 This specification is part of four documents describing fixed resistors for surface mount technology as follows: EN 60115-1 Fixed resistors for use in electronic equipment – Part 1: Generic specification
(IEC 60115-1, mod.) EN 140400 Sectional Specification: Fixed low power surface mount (SMD) resistors EN 140401 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors EN 140401-804 Detail Specification: Fixed low power film high stability surface mount (SMD) resistors –
Rectangular – Stability classes 0,1; 0,25 __________ SIST EN 140401-804:2011
– 3 – EN 140401-804:2011 Contents Foreword . 2Contents . 31Characteristics and ratings . 51.1Dimensions and ratings . 51.2Derating curve . 71.3Resistance range and tolerance on rated resistance . 71.3.1Version A . 71.3.2Version E . 91.4Variation of resistance with temperature and temperature rise. 101.5Climatic categories . 101.6Limits for change of resistance at tests . 111.7Non-linear properties . 121.8Tests related to soldering . 121.8.1Severities for solderability testing . 121.8.2Severities for testing resistance to soldering heat . 131.9Marking, packaging and ordering designation . 141.9.1Marking of the component . 141.9.2Taping. 141.9.3Marking of the packaging . 141.9.4Ordering information . 141.10Additional information (not for inspection purpose) . 151.10.1Storage . 151.10.2Mounting . 151.10.3Soldering process . 151.10.4Conductive gluing . 151.10.5Use of cleaning solvents . 161.10.6Pulse load capability . 161.10.7Variation of resistance value (drift) for lifetimes up to 200 000 h . 191.10.8Dissipation notes . 221.10.9Current noise . 231.10.10Temperature range extension . 232Quality assessment procedures . 232.1General . 232.1.1Zero defect approach . 232.1.2100 %-test . 242.1.30 Ω resistor . 242.1.4Certificate of Conformity (CoC) . 242.1.5Certified test records . 242.1.6Failure rate level . 242.2Qualification approval . 252.2.1Version A . 252.2.2Version E . 252.3Quality conformance inspection . 252.3.1Qualification approval according to IEC QC 001002-3:2005, Clause 3 . 252.3.2Technology approval according to IEC QC 001002-3:2005, Clause 6 . 252.3.3Non-conforming items . 25SIST EN 140401-804:2011
EN 140401-804:2011 – 4 –
Annex A (normative)
Fixed sample size Qualification Approval and Quality Conformance Inspection test schedule
for fixed low power surface mount (SMD) resistors . 26Annex B (informative)
Letter symbols and abbreviations . 35Annex C (normative)
Normative references . 37 Figures Figure 1 – Outline and dimensions (see Table 1) . 5Figure 2 – Derating curve . 7Figure 3 – Limits of non-linearity of resistors . 12Figure 4 – Pulse parameter for rectangular and exponential pulses. 17Figure 5 – Maximum permissible pulse load Pi, max . 17Figure 6 – Maximum permissible pulse load Pi, max for single pulses . 18Figure 7 – Maximum permissible pulse voltage Ui, max . 19Figure 8 – Drift factor M . 21Figure 9 – Temperature rise for high packaging density . 22Figure 10 – Current noise. 23 Tables Table 1 – Style and dimensions . 5Table 2a – Ratings for stability class 0,25 . 6Table 2b – Ratings for stability class 0,1 . 6Table 2c – Ratings for 0 Ω resistors . 6Table 3a – Resistance range, tolerance on rated resistance for version A . 8Table 3b – Resistance range, tolerance on rated resistance for version E . 9Table 4 – Temperature coefficients and percentage change of resistance
(according to EN 140400:2003, Table 2) . 10Table 5 – Limit of temperature rise . 10Table 6 – Climatic categories . 10Table 7a – Limits for change of resistance at tests . 11Table 7b – Limits for change of resistance at tests . 11Table 8 – Test method for resistance to soldering heat test . 13Table 9 – Maximum thermal resistance in applications . 20Table A.1 – Test schedule for qualification approval and quality conformance inspection, lot-by-lot tests, assessment level EZ . 26Table A.2 – Test schedule for qualification approval and quality conformance inspection, periodic tests, assessment level EZ . 29
SIST EN 140401-804:2011
– 5 – EN 140401-804:2011 Specification available from CENELEC Central Secretariat,
Avenue Marnix 17, B – 1000
Brussels, Belgium or from the National Committees members of CENELEC EN 140401-804
Electronic components of assessed quality in accordance with: EN 60115-1:201X EN 140400:2003 EN 140401:2009 Issue 2 (month) 201X
Other shapes are permitted within the given dimensions. Figure 1 – Outline and dimensions (see Table 1) Fixed low power high stability film chip resistors with rectangular base for surface mounting Style: RR Ceramic substrate with protected, insulated, resistance film and solder terminations, typically thin film Assessment level EZ a Version A: with 100-%-test Version E: with failure rate level and 100-%-test Stability classes 0,1 and 0,25 a For explanations on assessment level EZ, see 2.1.1.
1 Characteristics and ratings Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another. 1.1 Dimensions and ratings Table 1 – Style and dimensions Style Length L mm Width W mm Height H mm Termination T mm Mass amg metric inch min. max. min. max. min. max. min. max. max. RR 1005M RR 0402 0,95 1,05 0,45 0,55 0,30 0,40 0,05 /
0,1 b 0,35 0,8 RR 1608M RR 0603 1,50 1,70 0,70 0,90 0,35 0,55 0,10 0,50 2,1 RR 2012M RR 0805 1,90 2,10 1,10 1,40 0,40 0,60 0,15 0,60 6,0 RR 3216M RR 1206 3,00 3,40 1,45 1,75 0,45 0,65 0,25 0,75 10,0 RR 5025M RR 2010 4,80 5,20 2,30 2,70 0,35 0,75 0,35 0,85 30,0 a For information only. b The first figure indicates the termination width on the film side, the second figure the termination width on the reverse side. Termination:
WT ≥ 0,75 × W
Thickness: 0,005 mm to 0,05 mm
Information about manufacturers who have components qualified to this detail specification is available in the approvals section of the website http://www.iecq.org.
SIST EN 140401-804:2011
EN 140401-804:2011 – 6 –
Table 2a – Ratings for stability class 0,25 Style Stability class Rated dissipation P70 Limiting element voltaged.c. or a.c. (r.m.s.) Umax Insulation voltage d.c. or a.c. (peak) Uins
mW V V
1 min continuousRR 1005M 0,25 100 50 75 75 RR 1608M 0,25 150 75 100 75 RR 2012M 0,25 200 150 200 75 RR 3216M 0,25 400 200 300 75 RR 5025M 0,25 500 300 300 75
Table 2b – Ratings for stability class 0,1 Style Stability class Rated dissipation P70 Limiting element voltaged.c. or a.c. (r.m.s.) Umax Insulation voltage d.c. or a.c. (peak) Uins
mW V V
1 min continuousRR 1005M 0,1 63 25 75 75 RR 1608M 0,1 100 50 100 75 RR 2012M 0,1 125 75 200 75 RR 3216M 0,1 250 150 300 75 RR 5025M 0,1 330 200 300 75
Table 2c – Ratings for 0 ΩΩΩΩ resistors Style Maximum current Imax Maximum resistance aRres max Insulation voltage d.c. or a.c. (peak) Uins A mΩ V
1 min continuousRR 1005M 0,63 20 75 75 RR 1608M 1 20 100 75 RR 2012M 1,5 20 200 75 RR 3216M 2,0 20 300 75 RR 5025M 3,0 20 300 75 a The resistance value shall be measured on the film side.
SIST EN 140401-804:2011
– 7 – EN 140401-804:2011 1.2 Derating curve Resistors covered by this specification are derated according to Figure 2. Ambient temperature ϑϑϑϑaPercentage of rated dissipation-50 °C100 °C50 °C0 °C150 °C0 %60 %40 %20 %100 %80 %70 °C-55 °C155 °CLower category temperature (LCT)Upper category temperature (UCT)-100 °C200 °CStability class 0,25 125 °CStability class 0,1
Figure 2 – Derating curve For the category temperatures of stability classes, refer to Table 6. 1.3 Resistance range and tolerance on rated resistance 1.3.1 Version A The following combinations of temperature coefficient and tolerance on rated resistance may be approved only. Products from this extent shall be used for the qualification approval according to 2.2.1 and for the quality conformance inspection according to 2.3. Resistance values of an E-series according to IEC 60063 shall be used.
The qualification of resistance values below or beyond the specified resistance values is permitted, if they fulfil the requirements of the closest stability class (e.g. RR 1608M, 1 % > 500 kΩ shall fulfil the requirements of stability class 0,25). SIST EN 140401-804:2011
EN 140401-804:2011 – 8 –
Table 3a – Resistance range, tolerance on rated resistance for version A Style Tolerance on rated resistance Temperature coefficient Resistance range Stability class
% Code a ppm/K
RR 1005M ± 1 F ± 25 100 Ω to 49,9 kΩ 0,1
24,9 Ω to 100 kΩ 0,25
± 0,5 D ± 10; ± 25 100 Ω to 49,9 kΩ 0,1
100 Ω to 49,9 kΩ 0,25
± 0,1 B ± 10 100 Ω to 49,9 kΩ 0,1
100 Ω to 49,9 kΩ 0,25 RR 1608M ± 1 F ± 25 100 Ω to 261 kΩ 0,1
24,9 Ω to 500 kΩ 0,25
± 0,5 D ± 10; ± 25 100 Ω to 261 kΩ 0,1
100 Ω to 261 kΩ 0,25
± 0,1 B ± 10 100 Ω to 261 kΩ 0,1
100 Ω to 261 kΩ 0,25 RR 2012M ± 1 F ± 25 100 Ω to 301 kΩ 0,1
24,9 Ω to 750 kΩ 0,25
± 0,5 D ± 10; ± 25 100 Ω to 301 kΩ 0,1
100 Ω to 301 kΩ 0,25
± 0,1 B ± 10 100 Ω to 301 kΩ 0,1
100 Ω to 301 kΩ 0,25 RR 3216M ± 1 F ± 25 100 Ω to 1 MΩ 0,1
24,9 Ω to 2 MΩ 0,25
± 0,5 D ± 10; ± 25 100 Ω to 1 MΩ 0,1
100 Ω to 1 MΩ 0,25
± 0,1 B ± 10 100 Ω to 1 MΩ 0,1
100 Ω to 1 MΩ 0,25 RR 5025M ± 1 F ± 25 100 Ω to 3,01 MΩ 0,1
24,9 Ω to 6,04 MΩ 0,25
± 0,5 D ± 10; ± 25 100 Ω to 3,01 MΩ 0,1
100 Ω to 3,01 MΩ 0,25
± 0,1 B ± 10 100 Ω to 3,01 MΩ 0,1
100 Ω to 3,01 MΩ 0,25 0 Ω resistors according to Table 2c for all styles. a Code letters according to EN 60062.
SIST EN 140401-804:2011
– 9 – EN 140401-804:2011 1.3.2 Version E The following combinations of temperature coefficient, tolerance on rated resistance, resistance range and E-series according to IEC 60063 are permitted only. Products from this extent shall be used for the qualification approval according to 2.2.2 and for the quality conformance inspection according to 2.3. Table 3b – Resistance range, tolerance on rated resistance for version E Style Tolerance on rated resistance Temperature coefficient Resistance range Stability class E series % Code a ppm/K
RR 1005M ± 1 F ± 25 24,9 Ω to 97,6 Ω 0,25 E96
100 Ω to 49,9 kΩ 0,1
± 0,1 B ± 10 100 Ω to 49,9 kΩ 0,1 E192 RR 1608M ± 1 F ± 25 24,9 Ω to 97,6 Ω 0,25 E96
100 Ω to 261 kΩ 0,1
267 kΩ to 500 kΩ 0,25
± 0,1 B ± 10 100 Ω to 261 kΩ 0,1 E192 RR 2012M ± 1 F ± 25 24,9 Ω to 97,6 Ω 0,25 E96
100 Ω to 301 kΩ 0,1
309 kΩ to 750 kΩ 0,25
± 0,1 B ± 10 100 Ω to 301 kΩ 0,1 E192 RR 3216M ± 1 F ± 25 24,9 Ω to 97,6 Ω 0,25 E96
100 Ω to 1 MΩ 0,1
1,02 MΩ to 2 MΩ 0,25
± 0,1 B ± 10 100 Ω to 1 MΩ 0,1 E192 RR 5025M ± 1 F ± 25 24,9 Ω to 97,6 Ω 0,25 E96
100 Ω to 3,01 MΩ 0,1
3,09 MΩ to 6,04 MΩ 0,25
± 0,1 B ± 10 100 Ω to 3,01 MΩ 0,1 E192 0 Ω resistors according to Table 2c for all styles. a Code letters according to EN 60062.
SIST EN 140401-804:2011
EN 140401-804:2011 – 10 –
1.4 Variation of resistance with temperature and temperature rise Table 4 – Temperature coefficients and percentage change of resistance
(according to EN 140400:2003, Table 2)
Temperature coefficient Limit of resistance change ∆∆∆∆R/R %
10-6/K a Code b Code c Code d LCT / Reference temperature°C Reference temperature / UCT°C - 55 / 20 20 / 125 20 / 155 ± 25 Q D E ± 0,188 ± 0,262 ± 0,338 ± 10 N F Y ± 0,075 ± 0,105 ± 0,135 a The unit 10-6/K is traditionally referred to as ppm/K. b Code letters according to EN 60062. c Historical code letters according to EN 140400, for information only. d Historical code letters according to CECC 40401-010, for information only.
Table 5 – Limit of temperature rise Stability class Limit of temperature rise at rated dissipation 0,1 Tr ≤ 55 K 0,25 Tr ≤ 85 K
The thermal resistance is calculated to Rth = Tr / P70. 1.5 Climatic categories Table 6 – Climatic categories Stability class Climatic category LCT / UCT / Duration 0,1 55 / 125 / 56 0,25 55 / 155 / 56
SIST EN 140401-804:2011
– 11 – EN 140401-804:2011 1.6 Limits for change of resistance at tests Table 7a – Limits for change of resistance at tests
Stability class Limit of resistance change ∆∆∆∆R EN 60115-1:201X, 4.23 Climatic sequence 4.24 Damp heat, steady state 4.25.3 Endurance at upper category temperature EN 60115-1:201X, 4.25.1 Endurance at 70 °C EN 60115-1:201X, 4.13 Overload 4.18 Resistance to soldering heat 4.19 Rapid change of temperature4.22 Vibration 4.33 Substrate bending 1 000 h Extended, 8 000 h
0,25 ± (0,25 % R + 0,05 Ω) ± (0,25 % R + 0,05 Ω) ± (0,5 % R + 0,05 Ω) ± (0,05 % R + 0,01 Ω) 0,1 ± (0,1 % R + 0,02 Ω)
± (0,1 % R + 0,02 Ω) ± (0,25 % R + 0,02 Ω) ± (0,05 % R + 0,01 Ω)
Table 7b – Limits for change of resistance at tests
Stability class Limit of resistance change ∆∆∆∆R
EN 60115-1:201X, 4.19 Rapid change of temperature, 1 000 cycles EN 60115-1:201X, 4.27 Single-pulse high-voltage overload test EN 60115-1:201X, 4.39 Periodic-pulse overload test EN 60115-1:201X, 4.38 Electrostatic discharge a 0,25 ± (0,25 % R + 0,05 Ω) ± (0,5 % R + 0,05 Ω) ± (1 % R + 0,05 Ω) ± (0,5 % R + 0,05 Ω) 0,1 a Human Body Model (HBM) according to EN 61340-3-1, 3 positive + 3 negative discharges.
SIST EN 140401-804:2011
EN 140401-804:2011 – 12 –
1.7 Non-linear properties If measurement of non-linearity for resistors is required according to 2.1.2, the measured values shall be above the limits given in Figure 3. The resistors shall be tested according to IEC/TR 60440 where the test voltage shall be the rated voltage.
Figure 3 – Limits of non-linearity of resistors 1.8 Tests related to soldering 1.8.1 Severities for solderability testing To prove the compatibility of resistors according to this specification with lead-free solder, e.g. SnCu, SnCuNi, SnAg or SnAgCu, and traditional SnPb solder, solderability shall be tested with both types of solder. a) Solderability with traditional SnPb solder shall be tested according to EN 60068-2-58:2004, 8.2.1, solder bath method, with the following conditions:
solder alloy: Sn60Pb40 or Sn63Pb37;
solder bath temperature: (235 ± 5) °C;
immersion time: (2 ± 0,2) s. b) Solderability with lead-free solder shall be tested according to EN 60068-2-58:2004, 8.1.1, solder bath method, with the following conditions (Group 3):
solder alloy: Sn96,5Ag3,0Cu0,5;
solder bath temperature: (245 ± 5) °C;
immersion time: (3 ± 0,3) s, or with the following conditions (Group 4):
solder alloy: Sn99,3Cu0,7;
solder bath temperature: (250 ± 5) °C;
immersion time: (3 ± 0,3) s. The categories Group 3 and Group 4 are defined in EN 60068-2-58 for the discrimination of the wide variety of lead-free solder alloys by means of the related typical soldering processes and their specific temperature ranges. Group 3, described as „medium-high temperature“, lists examples of solder alloys SnAg, SnAgCu and SnAgBi, all intended for both reflow and flow (wave) soldering. Group 4, described as „high temperature“, covers SnCu solder, primarily intended for flow (wave) soldering. SIST EN 140401-804:2011
– 13 – EN 140401-804:2011 1.8.2 Severities for testing resistance to soldering heat The severity of the resistance to soldering heat test is determined by the peak temperature and by the temperature slopes before and after the dwell time at the peak temperature. Therefore, no separate tests are required for lead-free soldering (e.g. SnCu, SnCuNi, SnAg or SnAgCu) and for traditional SnPb soldering if the more severe test condition from those given in EN 60068-2-58 is adopted. a) For the solder bath method, EN 60068-2-58:2004, 8.1.1. for lead-free soldering, and EN 60068-2-58:2004, 8.2.1 for SnPb soldering require similar test conditions:
solder alloy: any alloy SnPb or SnCu or SnAgCu or SnAg;
solder bath temperature: (260 ± 5) °C;
immersion time: (10 ± 1) s;
test cycles: one only. b) For reflow soldering using the vapour phase reflow method, the most severe test conditions from EN 61760-1:2006, Clause 6 for lead-free soldering, and EN 60068-2-58:2004, 8.2.4 for SnPb soldering are:
solder alloy: none,
the specimen shall be placed on an unmetallized ceramic substrate;
temperature slopes: (3 ± 0,5) K/s;
peak temperature: (230 ± 5) °C;
peak dwell time: (40 ± 1) s;
test cycles: 3, the recovery period between two successive cycles shall be
the time it takes until the specimen drops below 50 °C. c) For reflow soldering using the infrared and forced gas convection reflow method, the most severe test conditions from EN 60068-2-58:2004, 8.1.2 for lead-free soldering, and EN 60068-2-58:2004, 8.2.4 for SnPb soldering are:
solder alloy: none,
the specimen shall be placed on an unmetallized ceramic substrate;
preheating: 150 °C to 180 °C for (120 ± 5) s;
peak temperature: (255 ± 5) °C;
dwell times: (20 ± 1) s above 245 °C;
(60 ± 5) s above 220 °C;
test cycles: 3, the recovery period between two successive cycles shall be
the time it takes until the specimen drops below 50 °C. The solder bath method is the most severe of the above test methods, representing the soldering stress of all wave soldering and reflow soldering methods.
For precision resistors, where the prime concern is the overall stability of the resistance value, wave soldering is not considered a recommendable method. Table 8 – Test method for resistance to soldering heat test Stability class Test method for resistance to soldering heat test 0,25 Solder bath method see 1.8.2 a) 0,1 Solder reflow method see 1.8.2 b) or c)
For version E resistors the solder bath method shall be used. SIST EN 140401-804:2011
EN 140401-804:2011 – 14 –
1.9 Marking, packaging and ordering designation 1.9.1 Marking of the component Surface mount resistors are generally not marked on the body. However, if marking is applied to version A resistors, the component shall be marked with the rated resistance using a letter and digit code according to EN 60062:2005, Clause 4, preferably the four-character code according to EN 60062:2005, 4.2.3. For version E resistors, the component shall be marked with the rated resistance using a letter and digit code according to EN 60062:2005, Clause 4, preferably the four-character code according to EN 60062:2005, 4.2.3. The marking of the styles RR 1005M and RR 1608M is not required. The choice of marking of the temperature coefficient and of any other item from the list of EN 60115-1:201X, 2.4 is left to the manufacturer. 1.9.2 Taping Components may be taped or put in a bulk case. For environmental protection, packaging into bulk cases is preferred. Taping shall be in accordance with type I of EN 60286-3. Bulk case packaging shall be in accordance with EN 60286-6. 1.9.3 Marking of the packaging The packaging of the component shall be marked with ordering information in accordance to 1.9.4 and additionally with − CECC or IECQ sign of conformity, − CECC or IECQ manufacturer code, − NATO manufacturer code (only version E, if required), − date code of manufacture according to EN 60062. Additional in
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.