Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLGA) (IEC 62148-21:2019)

This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated
circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch
land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is
informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.

Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen - Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA) (IEC 62148-21:2019)

Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21: Guide de conception de l'interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA) (IEC 62148-21:2019)

La présente partie de l'IEC 62148 traite du guide de conception de l'interface électrique destinée aux boîtiers de circuits intégrés photoniques (PIC) utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA). Dans le présent document, l'interface électrique destinée au boîtier S-FBGA est présentée à titre informatif.
L'objet du présent document est de spécifier de manière adéquate l'interface électrique des boîtiers PIC composés d'émetteurs et de récepteurs optiques qui permettent l'interchangeabilité électrique et mécanique des boîtiers PIC.

Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del: Vodilo za načrtovanje električnega vmesnika za PIC-ohišja, ki uporabljajo silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster mreže priključkov v ravnini (S-FLGA) (IEC 62148-21:2019)

Ta del standarda IEC 62148 zajema vodilo za načrtovanje električnega vmesnika za PIC-ohišja, ki uporabljajo silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster mreže priključkov v ravnini (S-FLGA). V tem dokumentu je električni vmesnik za paket S-FBGA informativen.
Namen tega dokumenta je ustrezno določiti električni vmesnik PIC-ohišij, sestavljen iz optičnih oddajnikov in sprejemnikov, ki omogočajo mehansko in električno izmenljivost PIC-ohišij.

General Information

Status
Published
Publication Date
14-May-2019
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
10-May-2019
Due Date
15-Jul-2019
Completion Date
15-May-2019

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SLOVENSKI STANDARD
SIST EN IEC 62148-21:2019
01-julij-2019
Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del:
Vodilo za načrtovanje električnega vmesnika za PIC-ohišja, ki uporabljajo silicijev
fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster mreže
priključkov v ravnini (S-FLGA) (IEC 62148-21:2019)
Fibre optic active components and devices - Package and interface standards - Part 21:
Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid
Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLGA) (IEC 62148-21:2019)
Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen -
Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-
Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA) (IEC
62148-21:2019)
Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21:
Guide de conception de l'interface électrique des boîtiers PIC utilisant des boîtiers
matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de
contact plate et à pas fins en silicium (S-FLGA) (IEC 62148-21:2019)
Ta slovenski standard je istoveten z: EN IEC 62148-21:2019
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
SIST EN IEC 62148-21:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62148-21:2019

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SIST EN IEC 62148-21:2019


EUROPEAN STANDARD EN IEC 62148-21

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2019
ICS 33.180.20

English Version
Fibre optic active components and devices - Package and
interface standards - Part 21: Design guide of electrical interface
of PIC packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)
(IEC 62148-21:2019)
Composants et dispositifs actifs fibroniques - Normes de Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse-
boîtier et d'interface - Partie 21: Guide de conception de und Schnittstellennormen - Teil 21: Konstruktionsleitfaden
l'interface électrique des boîtiers PIC utilisant des boîtiers für elektrische Schnittstellen von PIC-Gehäusen mit Si-
matriciels à billes et à pas fins en silicium (S-FBGA) et des Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-
boîtiers matriciels à zone de contact plate et à pas fins en Land-Grid-Array (S-FLGA)
silicium (S-FLGA) (IEC 62148-21:2019)
(IEC 62148-21:2019)
This European Standard was approved by CENELEC on 2019-04-15. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62148-21:2019 E

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SIST EN IEC 62148-21:2019
EN IEC 62148-21:2019 (E)
European foreword
The text of document 86C/1571/FDIS, future edition 1 of IEC 62148-21, prepared by SC 86C "Fibre
optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62148-21:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-01-15
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-04-15
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62148-21:2019 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60191-6-22 NOTE Harmonized as EN 60191-6-22
IEC 62148-1 NOTE Harmonized as EN IEC 62148-1
1 2
IEC 62148-19 NOTE Harmonized as EN IEC 62148-19


1
Under preparation. Stage at the time of publication: IEC/TFDIS 62148-19:2018.
2
Under preparation. Stage at the time of publication: FprEN IEC 62148-19:2019.
2

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SIST EN IEC 62148-21:2019
EN IEC 62148-21:2019 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 60050-731 -  International Electrotechnical Vocabulary - Chapter - -
731: Optical fibre communication
IEC/TR 61931 -  Fibre optic - Terminology - -

3

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SIST EN IEC 62148-21:2019

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SIST EN IEC 62148-21:2019



IEC 62148-21

®


Edition 1.0 2019-03




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Fibre optic active components and devices – Package and interface standards –

Part 21: Design guide of electrical interface of PIC packages using silicon fine-

pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)




Composants et dispositifs actifs fibroniques – Normes de boîtier et d'interface –

Partie 21: Guide de conception de l'interface électrique des boîtiers PIC utilisant


des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers

matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)












INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 33.180.20 ISBN 978-2-8322-6636-6




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 62148-21:2019
– 2 – IEC 62148-21:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8

Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E

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SIST EN IEC 62148-21:2019
IEC 62148-21:2019 © IEC 2019 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guide of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote i
...

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