SIST EN 60249-1:2002

Base materials for printed circuits -- Part 1: Test methods

Describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in the field of printed circuits irrespective of the nature of the insulating base material.

Basismaterialien für gedruckte Schaltungen -- Teil 1: Prüfverfahren

Matériaux de base pour circuits imprimés -- Partie 1: Méthodes d'essai

Décrit les méthodes d'essai des propriétés électriques, mécaniques et autres des supports isolants en feuilles ou en rouleaux utilisés dans le domaine des circuits imprimés, indépendamment de la nature du support isolant de base.

Base materials for printed circuits - Part 1: Test methods

General Information

• Status: Withdrawn
• Publication Date: 30-Apr-2002
• Withdrawal Date: 28-Feb-2007
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 01-Mar-2007
• Due Date: 01-Mar-2007
• Completion Date: 01-Mar-2007
• Ref Project: EN 60249-1:1993 - Base materials for printed circuits - Part 1: Test methods

Relations

• Replaced By: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 01-Mar-2007
• Amended By: SIST EN 60249-1:2001/A4:2001 - Base materials for printed circuits -- Part 1: Test methods
• Effective Date: 29-Jan-2023
• Amended By: SIST EN 60249-1:2001/A4:2001 - Base materials for printed circuits -- Part 1: Test methods
• Effective Date: 01-Mar-2001