kSIST prEN IEC 62024-1:2024
(Main)High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
IEC 62024-1:2024 is available as IEC 62024-1:2024 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62024-1:2024 specifies the electrical characteristics and measuring methods for the nanohenry range chip inductor that is normally used in the high frequency (over 100 kHz) range.
This edition includes the following significant technical changes with respect to the previous edition:
a) addition of S parameter measurement;
b) addition of the inductance, Q-factor and impedance of an inductor which are measured by the reflection coefficient method with a network analyzer;
c) addition of the resonance frequency of an inductor which is measured by a two-port network analyzer;
d) addition of the mounting method for a surface mounting inductor with Pb-free solder.
Induktive Hochfrequenz-Bauelemente - Elektrische Eigenschaften und Messmethoden - Teil 1: Chipinduktivitäten im Nanohenry-Bereich
Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de mesure - Partie 1: Inductance à puce de l'ordre du nanohenry
IEC 62024-1:2024 est disponible sous forme de IEC 62024-1:2024 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 62024-1:2024 spécifie les caractéristiques électriques et les méthodes de mesure pour l'inductance pastille de l'ordre du nanohenry qui est normalement utilisée dans la plage des hautes fréquences (supérieures à 100 kHz).
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) ajout du mesurage des paramètres S;
b) ajout des mesurages de l'inductance, du facteur Q et de l'impédance d'une bobine d'inductance par la méthode du facteur de réflexion au moyen d'un analyseur de réseau;
c) ajout du mesurage de la fréquence de résonance d'une bobine d'inductance par un analyseur de réseau à deux accès;
d) ajout de la méthode de montage d'une bobine d'inductance à montage en surface par brasage sans plomb.
Visokofrekvenčne induktivne komponente - Električne karakteristike in merilne metode - 1. del: Čipni induktor v območju nanohenrijev
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Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 62024-1:2023
01-september-2023
Visokofrekvenčne induktivne komponente - Električne karakteristike in merilne
metode - 1. del: Čipni induktor v območju nanohenrijev
High frequency inductive components - Electrical characteristics and measuring methods
- Part 1: Nanohenry range chip inductor
Induktive Hochfrequenz-Bauelemente - Elektrische Eigenschaften und Messmethoden -
Teil 1: Chipinduktivitäten im Nanohenry-Bereich
Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de
mesure - Partie 1: Inductance à puce de l'ordre du nanohenry
Ta slovenski standard je istoveten z: prEN IEC 62024-1:2023
ICS:
29.100.10 Magnetne komponente Magnetic components
oSIST prEN IEC 62024-1:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
oSIST prEN IEC 62024-1:2023
oSIST prEN IEC 62024-1:2023
51/1441/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62024-1 ED4
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-07-07 2023-09-29
SUPERSEDES DOCUMENTS:
51/1415/CD, 51/1424/CC
IEC TC 51 : MAGNETIC COMPONENTS, FERRITE AND MAGNETIC POWDER MATERIALS
SECRETARIAT: SECRETARY:
Japan Mr Takeshi Abe
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
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Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries”
clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for
submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
High frequency inductive components - Electrical characteristics and measuring methods - Part 1:
Nanohenry range chip inductor
PROPOSED STABILITY DATE: 2028
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
oSIST prEN IEC 62024-1:2023
IEC CDV 62024-1 © IEC 2023 2 51/1441/CDV
NOTE FROM TC/SC OFFICERS:
oSIST prEN IEC 62024-1:2023
51/1441/CDV 3 IEC CDV 62024-1 © IEC 2023
1 CONTENTS
3 FOREWORD . 5
4 1 Scope . 7
5 2 Normative references . 7
6 3 Terms and definitions . 7
7 4 Inductance, Q-factor and impedance . 7
8 4.1 Inductance . 7
9 4.1.1 Measuring method . 7
10 4.1.2 Measuring circuit . 8
11 4.1.3 Mounting the inductor for the test . 9
12 4.1.4 Measuring method and calculation formula . 11
13 4.1.5 Notes on measurement . 12
14 4.2 Quality factor . 13
15 4.2.1 Measuring method . 13
16 4.2.2 Measuring circuit . 13
17 4.2.3 Mounting the inductor for test . 14
18 4.2.4 Measuring methods and calculation formula . 14
19 4.2.5 Notes on measurement . 14
20 4.3 Impedance . 14
21 4.3.1 Measuring method . 14
22 4.3.2 Measuring circuit . 14
23 4.3.3 Mounting the inductor for test . 14
24 4.3.4 Measuring method and calculation . 14
25 4.3.5 Notes on measurement . 14
26 5 Resonance frequency . 14
27 5.1 Self-resonance frequency . 14
28 5.2 Minimum output method . 15
29 5.2.1 General . 15
30 5.2.2 Measuring circuit . 15
31 5.2.3 Mounting the inductor for test . 15
32 5.2.4 Measuring method and calculation formula . 16
33 5.2.5 Note on measurement . 16
34 5.3 Measurement by analyzer . 16
35 5.3.1 Measurement by impedance analyzer and one-port network analyzer . 16
36 5.3.2 Measurement by two-port network analyzer . 16
37 6 DC resistance . 17
38 6.1 Voltage-drop method. 17
39 6.1.1 Measuring circuit . 17
40 6.1.2 Measuring method and calculation formula . 17
41 6.2 Bridge method . 17
42 6.2.1 Measuring circuit . 17
43 6.2.2 Measuring method and calculation formula . 18
44 6.3 Notes on measurement . 18
45 6.4 Measuring temperature . 18
46 7 S parameter. 18
47 7.1 Measurement set-up and procedure . 18
oSIST prEN IEC 62024-1:2023
IEC CDV 62024-1 © IEC 2023 4 51/1441/CDV
48 7.1.1 General . 18
49 7.1.2 2-port S parameter . 19
50 7.1.3 Test fixture . 19
51 7.2 Calibrations and Verification of test setup . 21
52 7.2.1 General . 21
53 7.2.2 Calibration . 21
54 7.2.3 De-embedding . 24
55 7.3 Indirect Method of impedance . 24
56 7.3.1 Measurement set-up and procedure . 24
57 7.4 Evaluation from the 2-port S-parameter . 24
58 Annex A (normative) Mounting method for a surface mounting inductor . 27
59 A.1 Overview. 27
60 A.2 Mounting printed-circuit board and mounting land . 27
61 A.3 Solder . 27
62 A.4 Test condition . 27
63 A.5 Cleaning . 27
65 Figure 1 – Example of circuit for vector voltage/current method . 8
66 Figure 2 – Example of circuit for reflection coefficient method . 9
67 Figure 3 – Fixture A . 10
68 Figure 4 – Fixture B . 10
69 Figure 5 – Fixture C . 11
70 Figure 6 – Short device shape . 13
71 Figure 7 – Example of test circuit for the minimum output method . 15
72 Figure 8 – Self-resonance frequency test board (minimum output method) . 16
73 Figure 9 – Example of test circuit for voltage-drop method . 17
74 Figure 10 – Example of test circuit for bridge method . 18
75 Figure 11 – Schematic diagrams of the 2-port S-parameter measurement setup and the
76 network analyzer . 19
77 Figure 12 – S-parameter test fixture for two-terminal devices . 19
78 Figure 13 – Test fixture for a two-terminal device (Shunt connection) . 20
79 Figure 14 – Test fixture for a two-terminal device (Series connection) . 20
80 Figure 15 – Example of the standards for TRL calibration . 22
81 Figure 16 – Example of the standards for TRL calibration with microprobes . 23
82 Figure 17 – Example of full 2-port de-embedding with microprobes . 24
83 Figure 18 – 2-port measurement of a two-terminal device in shunt connection . 25
84 Figure 19 – 2-port measurement of a two-terminal device in series connection . 25
86 Table 1 – Dimensions of l and d . 10
87 Table 2 – Short device dimensions and inductances . 13
oSIST prEN IEC 62024-1:2023
51/1441/CDV 5 IEC CDV 62024-1 © IEC 2023
92 INTERNATIONAL ELECTROTECHNICAL COMMISSION
93 ____________
95 HIGH FREQUENCY INDUCTIVE COMPONENTS –
96 ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
98 Part 1: Nanohenry range chip inductor
100 FOREWORD
101 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
102 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
103 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
104 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
105 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
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108 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
109 Standardization (ISO) in accordance with conditions determined by agreemen
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