Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard (IEC 60917-1:2019)

This Standard specifies the relationships between equipment practices and the modular order which are applicable to the main structural dimensions of electronic and electrical equipment mounted in various installations where dimensional interfaces have to be considered for mechanical compatibility. This document also established terms for parts and assemblies of mechanical structures for electrical and electronic equipment, to clarify the specific relations between equipment practices and modular order.

Modulordnung für die Entwicklung von Bauweisen für elektronische Einrichtungen - Teil 1: Fachgrundnorm (IEC 60917-1:2019)

Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 1: Norme générique (IEC 60917-1:2019)

IEC 60917-1:2019 est disponible sous forme de IEC 60917-1:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 60917-1:2019 spécifie les relations entre les infrastructures et l’ordre modulaire qui sont applicables aux dimensions structurelles principales de l’équipement électronique et électrique monté au sein de diverses installations où des interfaces dimensionnelles doivent être considérées pour une compatibilité mécanique. Le présent document établit également les termes pour les composants et les ensembles des structures mécaniques pour l’équipement électrique et électronique, afin de clarifier les relations spécifiques entre les infrastructures et l’ordre modulaire. Cette deuxième édition annule et remplace la première édition publiée en 1998, ainsi que son Amendement 1:2000. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) informations ajoutées sur les nouvelles normes de spécification particulière de structures mécaniques pour les infrastructures électroniques et électriques; b) informations ajoutées sur les nouvelles normes d’essai de performances destinées à la vérification des performances environnementales, les aspects de la sécurité et le sujet des performances thermiques et de la gestion thermique pour les infrastructures électroniques et électriques; c) introduction des relations entre la structure mécanique pour les systèmes électriques et électroniques, la vérification des performances environnementales, les aspects de la sécurité et le sujet des performances thermiques et de la gestion thermique pour les infrastructures électroniques et électriques. Mots-clés: Baies, Structures mécaniques

Razpored modulov za razvoj mehanske zgradbe elektronske opreme - 1. del: Osnovni standard (IEC 60917-1:2019)

Ta standard opredeljuje razmerja med postopki opreme in razporedom modulov, ki veljajo za glavne strukturne dimenzije elektronike in elektronske opreme, nameščene v različnih napravah, pri katerih je treba za mehansko združljivost upoštevati dimenzijske vmesnike. Ta dokument opredeljuje tudi izraze za dele in sklope mehanskih struktur za elektroniko ter elektronsko opremo za pojasnitev posebnih razmerij med opremo in razporedom modulov.

General Information

Status
Published
Publication Date
28-Nov-2019
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
20-Nov-2019
Due Date
25-Jan-2020
Completion Date
29-Nov-2019

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SLOVENSKI STANDARD
SIST EN IEC 60917-1:2020
01-januar-2020
Nadomešča:
SIST EN 60917-1:2002
SIST EN 60917-1:2002/A1:2002
Razpored modulov za razvoj mehanske zgradbe elektronske opreme - 1. del:
Osnovni standard (IEC 60917-1:2019)

Modular order for the development of mechanical structures for electronic equipment

practices - Part 1: Generic standard (IEC 60917-1:2019)

Modulordnung für die Entwicklung von Bauweisen für elektronische Einrichtungen - Teil

1: Fachgrundnorm (IEC 60917-1:2019)
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électroniques - Partie 1: Norme générique (IEC 60917-1:2019)
Ta slovenski standard je istoveten z: EN IEC 60917-1:2019
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN IEC 60917-1:2020 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60917-1:2020
---------------------- Page: 2 ----------------------
SIST EN IEC 60917-1:2020
EUROPEAN STANDARD EN IEC 60917-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2019
ICS 31.240 Supersedes EN 60917-1:1998 and all of its amendments
and corrigenda (if any)
English Version
Modular order for the development of mechanical structures for
electrical and electronic equipment practices - Part 1: Generic
standard
(IEC 60917-1:2019)

Ordre modulaire pour le développement des structures Modulordnung für die Entwicklung von Bauweisen für

mécaniques pour les infrastructures électriques et elektrische und elektronische Einrichtungen - Teil 1:

électroniques - Partie 1: Norme générique Fachgrundnorm
(IEC 60917-1:2019) (IEC 60917-1:2019)

This European Standard was approved by CENELEC on 2019-10-18. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60917-1:2019 E
---------------------- Page: 3 ----------------------
SIST EN IEC 60917-1:2020
EN IEC 60917-1:2019 (E)
European foreword

The text of document 48D/703/FDIS, future edition 2 of IEC 60917-1, prepared by SC 48D

"Mechanical structures for electrical and electronic equipment" of IEC/TC 48 "Electrical connectors

and mechanical structures for electrical and electronic equipment" was submitted to the IEC-

CENELEC parallel vote and approved by CENELEC as EN IEC 60917-1:2019.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2020-07-18

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2022-10-18

document have to be withdrawn

This document supersedes EN 60917-1:1998 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60917-1:2019 was approved by CENELEC as a European

Standard without any modification.
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SIST EN IEC 60917-1:2020
EN IEC 60917-1:2019 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-581 - International Electrotechnical Vocabulary - - -
Part 581: Electromechanical components
for electronic equipment
IEC 60297 series Dimensions of mechanical structures of the - -
482,6 mm (19 in) series
IEC 60297-3-100 - Mechanical structures for electronic EN 60297-3-100 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-100: Basic dimensions of front
panels, subracks, chassis, racks and
cabinets
IEC 60297-3-101 - Mechanical structures for electronic EN 60297-3-101 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-101: Subracks and associated plug-
in units
IEC 60297-3-102 - Mechanical structures for electronic EN 60297-3-102 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-102: Injector/extractor handle
IEC 60297-3-103 - Mechanical structures for electronic EN 60297-3-103 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-103: Keying and alignment pin
IEC 60297-3-104 - Mechanical structures for electronic EN 60297-3-104 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-104: Connector dependent
interface dimensions of subracks and plug-
in units
---------------------- Page: 5 ----------------------
SIST EN IEC 60917-1:2020
EN IEC 60917-1:2019 (E)
Publication Year Title EN/HD Year
IEC 60297-3-105 - Mechanical structures for electronic EN 60297-3-105 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-105: Dimensions and design
aspects for 1U high chassis
IEC 60297-3-106 - Mechanical structures for electronic EN 60297-3-106 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-106: Adaptation dimensions for
subracks and chassis applicable with
metric cabinets or racks in accordance with
IEC 60917-2-1
IEC 60297-3-107 - Mechanical structures for electronic EN 60297-3-107 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-107: Dimensions of subracks and
plug-in units, small form factor
IEC 60297-3-108 - Mechanical structures for electronic EN 60297-3-108 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-108: Dimensions of R-type subracks
and plug-in units
IEC 60297-3-109 - Mechanical structures for electrical and EN 60297-3-109 -
electronic equipment – Dimensions of
mechanical structures of the 482,6 mm (19
in) series – Part 3-109: Dimensions of
chassis for embedded computing devices

IEC 60297-3-110 - Mechanical structures for electrical and EN IEC 60297-3-110 -

electronic equipment - Dimensions of
mechanical structures of the 482,6 mm (19
in) series - Part 3-110: Residential racks
and cabinets for smart houses
IEC/TR 60668 - Dimensions of panel areas and cut-outs for - -
panel and rack-mounted industrial-process
measurement and control instruments
IEC 60917-2 - Modular order for the development of EN 60917-2 -
mechanical structures for electronic
equipment practices - Part 2: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice
IEC 60917-2-1 - Modular order for the development of EN 60917-2-1 -
mechanical structures for electronic
equipment practices - Part 2: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice - Section 1: Detail specification -
Dimensions for cabinets and racks
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SIST EN IEC 60917-1:2020
EN IEC 60917-1:2019 (E)
Publication Year Title EN/HD Year
IEC 60917-2-2 - Modular order for the development of EN 60917-2-2 -
mechanical structures for electronic
equipment practices - Part 2: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice - Section 2: Detail specification -
Dimensions for subracks, chassis,
backplanes, front panels and plug-in units
IEC 60917-2-3 - Modular order for the development of EN 60917-2-3 -
mechanical structures for electronic
equipment practices - Part 2-3: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice - Extended detail specification -
Dimensions for subracks, chassis,
backplanes, front panels and plug-in units
IEC 60917-2-4 - Modular order for the development of EN 60917-2-4 -
mechanical structures for electronic
equipment practices - Part 2-4: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice - Adaptation dimensions for
subracks or chassis applicable in cabinets
or racks in accordance with IEC 60297-3-
100 (19 in)
IEC 60917-2-5 - Modular order for the development of EN 60917-2-5 -
mechanical structures for electronic
equipment practices - Part 2-5: Sectional
specification - Interface co-ordination
dimensions for the 25 mm equipment
practice - Cabinet interface dimensions for
miscellaneous equipment
IEC 61554 - Panel mounted equipment - Electrical - -
measuring instruments - Dimensions for
panel mounting
IEC 61587 series Mechanical structures for electronic EN 61587 series
equipment - Tests for IEC 60917 and IEC
60297 series
IEC 61969-1 - Mechanical structures for electronic EN 61969-1 -
equipment - Outdoor enclosures - Part 1:
Design guidelines
IEC 61969-2 - Mechanical structures for electronic EN 61969-2 -
equipment - Outdoor enclosures - Part 2:
Coordination dimensions
IEC 61969-3 - Mechanical structures for electronic EN 61969-3 -
equipment - Outdoor enclosures - Part 3:
Environmental requirements, tests and
safety aspects
IEC 62194 - Method of evaluating the thermal EN 62194 -
performance of enclosures
---------------------- Page: 7 ----------------------
SIST EN IEC 60917-1:2020
EN IEC 60917-1:2019 (E)
Publication Year Title EN/HD Year
IEC/TS 62454 - Mechanical structures for electronic - -
equipment - Design guide: Interface
dimensions and provisions for water
cooling of electronic equipment within
cabinets of the IEC 60297 and IEC 60917
series
IEC 62610 series Mechanical structures for electrical and EN 62610 series
electronic equipment – Thermal
management for cabinets in accordance
with IEC 60297 and IEC 60917 series
IEC Guide 103 1980 Guide on dimensional co-ordination - -
ISO 1006 - Building construction; Modular - -
coordination; Basic module
ISO 1040 - Building construction - Modular - -
coordination - Multimodules for horizontal
coordinating dimensions
ISO 1791 - Building construction - Modular co- - -
ordination - Vocabulary
ISO 2848 - Building construction - Modular - -
coordination - Principles and rules
ISO 3394 - Dimensions of rigid rectangular packages; - -
Transport packages
ISO 3676 - - -
ISO 6514 - Building construction - Modular - -
coordination - Sub-modular increments
ISO 80000-1 2009 Quantities and units -- Part 1: General EN ISO 80000-1 2013
ISO 80000-3 2006 Quantities and units -- Part 3: Space and EN ISO 80000-3 2013
time
---------------------- Page: 8 ----------------------
SIST EN IEC 60917-1:2020
IEC 60917-1
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Modular order for the development of mechanical structures for electrical and
electronic equipment practices –
Part 1: Generic standard
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électriques et électroniques –
Partie 1: Norme générique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-7164-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 9 ----------------------
SIST EN IEC 60917-1:2020
– 2 – IEC 60917-1:2019 © IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 9

4 Fundamentals and background information .................................................................... 19

4.1 General ................................................................................................................. 19

4.2 Structures of electrical and electronic equipment practices ................................... 20

4.3 Dimensional co-ordination with adjacent technical fields ....................................... 20

4.4 Preparation of standards for new equipment practices .......................................... 21

5 Modular order details ..................................................................................................... 24

5.1 Modular grid .......................................................................................................... 24

5.2 Pitches ................................................................................................................. 24

5.2.1 Base and multiple pitches for equipment practice .......................................... 24

5.2.2 Mounting pitches example ............................................................................. 25

5.3 Co-ordination dimensions ..................................................................................... 26

5.4 Illustration of the modular order ............................................................................ 27

Figure 1 – Pitch .................................................................................................................... 10

Figure 2 – Grid...................................................................................................................... 11

Figure 3 – Rack .................................................................................................................... 12

Figure 4 – Cabinet ................................................................................................................ 12

Figure 5 – Case .................................................................................................................... 13

Figure 6 – Swing frame ......................................................................................................... 13

Figure 7 – Subrack ............................................................................................................... 14

Figure 8 – Chassis ................................................................................................................ 14

Figure 9 – Plug-in unit........................................................................................................... 15

Figure 10 – Console.............................................................................................................. 15

Figure 11 – Plug-in unit guide ............................................................................................... 15

Figure 12 – Slides ................................................................................................................. 16

Figure 13 – Telescopic slides ................................................................................................ 16

Figure 14 – Mounting frame .................................................................................................. 17

Figure 15 – Mounting plate ................................................................................................... 17

Figure 16 – Front panel ......................................................................................................... 17

Figure 17 – Backplane .......................................................................................................... 18

Figure 18 – Cabinet panel ..................................................................................................... 18

Figure 19 – Door ................................................................................................................... 19

Figure 20 – Mounting section ................................................................................................ 19

Figure 21 – Structures of electrical and electronic equipment practices ................................ 20

Figure 22 – Structure of equipment practice standards ......................................................... 23

Figure 23 – Modular grid ....................................................................................................... 24

Figure 24 – Partitioning of co-ordination dimensions C with the same mounting pitch mp ..... 26

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SIST EN IEC 60917-1:2020
IEC 60917-1:2019 © IEC 2019 – 3 –

Figure 25 – Examples of the application of the modular order ............................................... 28

Table 1 – Publications containing standardized modular dimensions and/or related

documents ............................................................................................................................ 21

Table 2 – Co-ordination dimensions C .................................................................................. 26

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SIST EN IEC 60917-1:2020
– 4 – IEC 60917-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES FOR ELECTRICAL
AND ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60917-1 has been prepared by subcommittee 48D: Mechanical

structures for electrical and electronic equipment, of IEC technical committee 48: Electrical

connectors and mechanical structures for electrical and electronic equipment.

This second edition cancels and replaces the first edition published in 1998 and its Amendment

1:2000. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) added information on newly developed detail specification standards of mechanical

structures for the electrical and electronic equipment practices;

b) added information on newly developed performance test standards for the verifications of

environmental performances and safety aspects and issues of the thermal performance and

thermal management for the electrical and electronic equipment practices;
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SIST EN IEC 60917-1:2020
IEC 60917-1:2019 © IEC 2019 – 5 –

c) introduced the relations between the mechanical structure for electrical and electronic

system, the verification of environmental performance and safety aspects and issues of the

thermal performance and thermal management for the electrical and electronic equipment

practices.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/703/FDIS 48D/708/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

Future standards in this series will carry the new general title as cited above. Titles of existing

standards in this series will be updated at the time of the next edition.

A list of all parts in the IEC 60917 series, published under the general title Modular order for

the development of mechanical structures for electrical and electronic equipment practices, can

be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until the

stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to

the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 13 ----------------------
SIST EN IEC 60917-1:2020
– 6 – IEC 60917-1:2019 © IEC 2019
INTRODUCTION

There is a continuous trend towards higher functional integration and smaller electronic

components and integrated circuits. At the same time, new manufacturing methods, automatic

manufacturing and testing equipment, and Computer Aided Engineering (CAE) systems have

created commercial advantages for their users.

For users to take technical and economic advantage of these new components and technologies

during planning, design, manufacturing, and testing, it is necessary for equipment practices to

meet the following requirements (see IEC Guide 103): arrangement of products with a minimum

loss of area and space;

– dimensional interchangeability of products, e.g. regarding overall dimensions, mounting

dimensions (fixing holes, cut-out, etc.);

– dimensional compatibility and determination of interface dimensions of products which:

• are combined with other products, e.g. instruments, racks, panels and cabinets, etc.;

• are used in buildings that have been built in accordance with a modular system, e.g.

column spacing, room height, door height, etc.

An obstacle arises from the use of two systems of dimensioning (inch – metre) that are not

compatible with each other. The use of an interface between both dimensioning systems

represents one way around this obstacle. The recommendation is:
– to use only one dimensioning system and to use SI units.

The dimensions given in 5.3 of this document have been taken from System l of IEC Guide 103

in consideration with other documents on dimensional coordination.

In accordance with the above considerations, IEC 60917-1 Ed.1 was published in 1998. This

generic standard for mechanical structures for electronic equipment practices has been used

to meet advanced requirements for various industrial applications of micro-electronics

technology.

After publication of this generic standard, development of dimensional sectional and detail

specifications consisting of the metric 25 mm modular standards, IEC 60917-2-X, and 19 inch

(in) conventional standards, IEC 60297-3-XXX, was undertaken. In parallel, standards to

address environmental performance and safety aspects of the mechanical structures were

developed as the IEC 61587 series. All these standards are based on indoor system

applications. The next step for the mechanical structure was the developments of the IEC 61969

series for outdoor applications.

In the first decade of the 21st century, the IEC 62194 and IEC 62610 series were developed to

define the verification of the thermal performance of enclosures and address thermal

management issues of the electrical and electronic equipment practices.

This document describes the relationships between the mechanical structure for electrical and

electronic systems, the verification of environmental performance and safety aspects, and the

issues of the thermal performance and of the thermal management for the electrical and

electronic equipment practices.
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SIST EN IEC 60917-1:2020
IEC 60917-1:2019 © IEC 2019 – 7 –
MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES FOR ELECTRICAL
AND ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
1 Scope

This part of IEC 60917 specifies the relationships between equipment practices and the modular

order which are applicable to the main structural dimensions of electronic and electrical

equipment mounted in various installations where dimensional interfaces have to be considered

for mechanical compatibility.

This document also established terms for parts and assemblies of mechanical structures for

electrical and electronic equipment, to clarify the specific relations between equipment practices

and modular order.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.

IEC 60050-581, International Electrotechnical Vocabulary – Part 581: Electromechanical

components for electronic equipment
IEC
...

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