SIST EN 60191-6-13:2017

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2016)

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets
for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this
part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test
and burn-in sockets applied to FBGA and FLGA.

Mechanische Normung von Halbleiterbauelementen -Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2016)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-13: Guide de conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas fins et les boîtiers matriciels à zone de contact plate et à pas fins (FBGA/FLGA) (IEC 60191-6-13:2016)

L'IEC 60191-6-13:2016 spécifie un guide de conception des supports à semiconducteurs sans couvercle pour les boîtiers matriciels à billes et à pas fins (FBGA, fine-pitch ball grid array) et les boîtiers matriciels à zone de contact plate et à pas fins (FLGA, fine-pitch land grid array). En particulier, la présente partie de l'IEC 60191 établit les dessins d'encombrement et les dimensions des supports sans couvercle d'essais et de rodage appliqués aux FBGA et aux FLGA. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) La longueur et la largeur nominales du boîtier BGA ont récemment été étendues respectivement à 43 mm et 43 mm. En conséquence, six tailles de supports ont été ajoutées aux groupes de supports numéros 1, 2 et 3, et vingt-deux tailles de supports ont été ajoutées au groupe de support numéro 4.

Standardizacija mehanskih lastnosti polprevodniških elementov - 6-13. del: Smernica za načrtovanje zgoraj odprtih podstavkov za fini raster mreže krogličnih priključkov in fini raster mreže priključkov v ravnini (FBGA/FLGA) (IEC 60191-6-13:2016)

Ta del standarda IEC 60191 določa smernice za načrtovanje zgoraj odprtih polprevodniških podstavkov za fini raster mreže krogličnih priključkov (FBGA) in fini raster mreže priključkov v ravnini (FLGA). Ta del standarda IEC 60191 zlasti opredeljuje risanje osnutkov in dimenzije zgoraj odprtih preskusnih in vžganih podstavkov, ki se uporabljajo za fini raster mreže krogličnih priključkov in fini raster mreže priključkov v ravnini.

General Information

• Status: Published
• Publication Date: 04-Dec-2016
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 30-Nov-2016
• Due Date: 04-Feb-2017
• Completion Date: 05-Dec-2016
• Ref Project: EN 60191-6-13:2016 - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Relations

• Replaces: SIST EN 60191-6-13:2008 - Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
• Effective Date: 28-Jan-2014
• Revised: SIST EN 60191-6-13:2008 - Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
• Effective Date: 06-May-2014
• Replaces: SIST EN 60191-6-13:2008 - Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-13:2017
01-januar-2017
1DGRPHãþD
SIST EN 60191-6-13:2008
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRYGHO
6PHUQLFD]DQDþUWRYDQMH]JRUDMRGSUWLKSRGVWDYNRY]DILQLUDVWHUPUHåHNURJOLþQLK
SULNOMXþNRYLQILQLUDVWHUPUHåHSULNOMXþNRYYUDYQLQL)%*$)/*$,(&

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of
open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array
(FBGA/FLGA) (IEC 60191-6-13:2016)
Mechanische Normung von Halbleiterbauelementen -Teil 6-13: Konstruktionsleitfaden für
Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array
(FBGA/FLGA) (IEC 60191-6-13:2016)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-13: Guide de
conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas
fins et les boîtiers matriciels à zone de contact plate et à pas fins (FBGA/FLGA) (IEC
60191-6-13:2016)
Ta slovenski standard je istoveten z: EN 60191-6-13:2016
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60191-6-13:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-13:2017

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SIST EN 60191-6-13:2017


EUROPEAN STANDARD EN 60191-6-13

NORME EUROPÉENNE

EUROPÄISCHE NORM
November 2016
ICS 31.080.01 Supersedes EN 60191-6-13:2007
English Version
Mechanical standardization of semiconductor devices -
Part 6-13: Design guideline of open-top-type sockets for Fine-
pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array
(FLGA)
(IEC 60191-6-13:2016)
Normalisation mécanique des dispositifs à semiconducteurs Mechanische Normung von Halbleiterbauelementen -
- Partie 6-13: Guide de conception pour les supports sans Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen
couvercle pour les boîtiers matriciels à billes et à pas fins für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-
(FBGA) et les boîtiers matriciels à zone de contact plate et Array (FBGA/FLGA)
à pas fins (FLGA) (IEC 60191-6-13:2016)
(IEC 60191-6-13:2016)
This European Standard was approved by CENELEC on 2016-11-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 60191-6-13:2016 E

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SIST EN 60191-6-13:2017
EN 60191-6-13:2016
European foreword
The text of document 47D/878/FDIS, future edition 2 of IEC 60191-6-13, prepared by
SC 47D "Semiconductor devices packaging" of IEC/TC 47 "Semiconductor devices" was submitted to
the IEC-CENELEC parallel vote and approved by CENELEC as EN 60191-6-13:2016.

The following dates are fixed:
(dop) 2017-08-01
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-11-01
standards conflicting with the
document have to be withdrawn

This document supersedes EN 60191-6-13:2007.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 60191-6-13:2016 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN 60191-6-13:2017
EN 60191-6-13:2016
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 60191-2 -  Mechanical standardization of - -
semiconductor devices -
Part 2: Dimensions
IEC 60191-6 -  Mechanical standardization of EN 60191-6 -
semiconductor devices -
Part 6: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages

3

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SIST EN 60191-6-13:2017

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SIST EN 60191-6-13:2017



IEC 60191-6-13

®


Edition 2.0 2016-09




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Mechanical standardization of semiconductor devices –

Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid

Array (FBGA) and Fine-pitch Land Grid Array (FLGA)




Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-13: Guide de conception pour les supports sans couvercle pour les


boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone

de contact plate et à pas fins (FLGA)












INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-3662-8



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 60191-6-13:2017
– 2 – IEC 60191-6-13:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms and definitions . 6
4 Socket code . 6
4.1 Construction of socket code . 6
4.2 Symbols . 7
4.2.1 Semiconductor sockets symbol . 7
4.2.2 Socket type symbol . 7
4.2.3 Socket nominal dimension symbol . 7
4.2.4 Number of terminal arrays . 7
4.2.5 Terminal pitch . 7
5 Terminal number . 7
6 Socket nominal dimension . 8
7 Socket length and width . 8
8 Reference symbols and schematics . 8
8.1 Outline drawings . 8
8.2 Reference symbols and schematics of recommended socket mounting
pattern on printed circuit board . 11
8.3 Overall dimensions . 12
8.4 Recommended dimensions of socket mounting pattern on printed circuit
board . 17
9 Individual outline drawing standard registration . 18

Figure 1 – Outline drawings of the socket . 9
Figure 2 – Outline drawings for the definition of terminal diameter . 10
Figure 3 – Applicable package outline . 10
Figure 4 – Socket mounting pattern . 11

Table 1 – Overview for the different socket groups . 8
Table 2 – Overall dimensions (1 of 2) . 12
Table 3 – Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2) . 14
Table 4 – Socket dimension for Group 4 (square or rectangular socket) . 16
Table 5 – Socket mounting dimensions. 17
Table 6 – Registration table . 18

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SIST EN 60191-6-13:2017
IEC 60191-6-13:2016 © IEC 2016 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-13: Design guideline of open-top-type sockets for
Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-13 has been prepared by subcommittee 47D:
Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2007. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm,
respectively. Accordingly, six socket sizes have been added to the socket group
numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group
number 4.

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SIST EN 60191-6-13:2017
– 4 – IEC 60191-6-13:2016 © IEC 2016
The text of this standard is based on the following documents:
FDIS Report on voting
47D/878/FDIS 47D/885/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 60191-6-13:2017
IEC 60191-6-13:2016 © IEC 2016 – 5 –
INTRODUCTION
This part of IEC 60191 aims to standardize the outer dimensions of the sockets for FBGA and
FLGA, where leading-edge developments are aggressively innovated, to establish their
compatibility with the needs of the surface-mount industry that is globally expanding due to
enhanced functions and performances of electrical devices
...