SIST EN IEC 62148-21:2021
(Main)Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic
integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon
fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA
package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen - Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA) (IEC 62148-21:2021)
Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21: Lignes directrices de conception de l'interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA) (IEC 62148-21:2021)
IEC 62148-21:2021 est disponible sous forme de IEC 62148-21:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del: Smernice za projektiranje električnega vmesnika za PIC-ohišja, ki uporabljajo silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster mreže priključkov v ravnini (S-FLGA) (IEC 62148-21:2021)
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 62148-21:2021
01-september-2021
Nadomešča:
SIST EN IEC 62148-21:2019
Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del:
Smernice za projektiranje električnega vmesnika za PIC-ohišja, ki uporabljajo
silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster
mreže priključkov v ravnini (S-FLGA) (IEC 62148-21:2021)
Fibre optic active components and devices - Package and interface standards - Part 21:
Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid
array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)
Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen -
Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-
Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA) (IEC
62148-21:2021)
Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21:
Lignes directrices de conception de l'interface électrique des boîtiers PIC utilisant des
boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à
zone de contact plate et à pas fins en silicium (S-FLGA) (IEC 62148-21:2021)
Ta slovenski standard je istoveten z: EN IEC 62148-21:2021
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
SIST EN IEC 62148-21:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 62148-21:2021
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SIST EN IEC 62148-21:2021
EUROPEAN STANDARD EN IEC 62148-21
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2021
ICS 33.180.20 Supersedes EN IEC 62148-21:2019 and all of its
amendments and corrigenda (if any)
English Version
Fibre optic active components and devices - Package and
interface standards - Part 21: Design guidelines of electrical
interface of PIC packages using silicon fine-pitch ball grid array
(S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
(IEC 62148-21:2021)
Composants et dispositifs actifs fibroniques - Normes de Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse-
boîtier et d'interface - Partie 21: Lignes directrices de und Schnittstellennormen - Teil 21: Konstruktionsleitfaden
conception de l'interface électrique des boîtiers PIC utilisant für elektrische Schnittstellen von PIC-Gehäusen mit Si-
des boîtiers matriciels à billes et à pas fins en silicium (S- Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-
FBGA) et des boîtiers matriciels à zone de contact plate et Land-Grid-Array (S-FLGA)
à pas fins en silicium (S-FLGA) (IEC 62148-21:2021)
(IEC 62148-21:2021)
This European Standard was approved by CENELEC on 2021-05-27. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62148-21:2021 E
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SIST EN IEC 62148-21:2021
EN IEC 62148-21:2021 (E)
European foreword
The text of document 86C/1684/CDV, future edition 2 of IEC 62148-21, prepared by SC 86C "Fibre
optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62148-21:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-02-27
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-05-27
document have to be withdrawn
This document supersedes EN IEC 62148-21:2019 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62148-21:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60191-6-22 NOTE Harmonized as EN 60191-6-22
IEC 62148-1 NOTE Harmonized as EN IEC 62148-1
IEC 62148-19 NOTE Harmonized as EN IEC 62148-19
2
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SIST EN IEC 62148-21:2021
EN IEC 62148-21:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-731 - International Electrotechnical Vocabulary - - -
Chapter 731: Optical fibre communication
IEC/TR 61931 - Fibre optic - Terminology - -
3
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SIST EN IEC 62148-21:2021
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SIST EN IEC 62148-21:2021
IEC 62148-21
®
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-9723-0
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
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SIST EN IEC 62148-21:2021
– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13
Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8
Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E
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SIST EN IEC 62148-21:2021
IEC 62148-21:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –
Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)
FOREWORD
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...
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