SIST EN IEC 62150-6:2022

Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-6:2022)

This part of IEC 62150 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.

Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6: Universelle Mezzanine Platinen zur Prüfung und Messung von photonischen Baugruppen (IEC 62150-6:2022)

Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des dispositifs photoniques (IEC 62150-6:2022)

IEC 62150-6:2022 spécifie un système de carte mezzanine générique pour prendre en charge les essais et les mesures des dispositifs basés sur des technologies micro‑optiques et microphotoniques, incluant, entre autres, les dispositifs à circuit intégré photonique (PIC).

Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del: Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC 62150-6:2022)

Ta del standarda IEC 62150 določa splošni sistem medetažnih plošč za podporo preizkušanja in merjenja naprav, ki temeljijo na mikrooptičnih in mikrofotonskih tehnologijah, kar med drugim vključuje naprave s fotonskim integriranim vezjem (PIC).

General Information

• Status: Published
• Publication Date: 03-Apr-2022
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: MOC - Mobile Communications
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 25-Mar-2022
• Due Date: 30-May-2022
• Completion Date: 04-Apr-2022
• Ref Project: EN IEC 62150-6:2022 - Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 62150-6:2022
01-maj-2022
Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del:
Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC
62150-6:2022)
Fibre optic active components and devices - Test and measurement procedures - Part 6:
Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-
6:2022)
Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6:
Universelle Mezzanine Platinen zur Prüfung und Messung von photonischen
Baugruppen (IEC 62150-6:2022)
Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de
mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des
dispositifs photoniques (IEC 62150-6:2022)
Ta slovenski standard je istoveten z: EN IEC 62150-6:2022
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
SIST EN IEC 62150-6:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62150-6:2022


EUROPEAN STANDARD EN IEC 62150-6

NORME EUROPÉENNE

EUROPÄISCHE NORM March 2022
ICS 33.180.20

English Version
Fibre optic active components and devices - Test and
measurement procedures - Part 6: Universal mezzanine boards
for test and measurement of photonic devices
(IEC 62150-6:2022)
Composants et dispositifs actifs fibroniques - Procédures Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf-
d'essais de base et de mesures - Partie 6: Cartes und Messverfahren - Teil 6: Universelle Mezzanine Platinen
mezzanines universelles pour les essais et les mesures des zur Prüfung und Messung von photonischen Baugruppen
dispositifs photoniques (IEC 62150-6:2022)
(IEC 62150-6:2022)
This European Standard was approved by CENELEC on 2022-03-04. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62150-6:2022 E

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EN IEC 62150-6:2022 (E)
European foreword
The text of document 86C/1721/CDV, future edition 1 of IEC 62150-6, prepared by SC 86C "Fibre
optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62150-6:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-12-04
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-03-04
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62150-6:2022 was approved by CENELEC as a European
Standard without any modification.
2

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EN IEC 62150-6:2022 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-731 - International Electrotechnical Vocabulary - - -
Part 731: Optical fibre communication
IEC 62150-1 - Fibre optic active components and devices - EN 62150-1 -
Test and measurement procedures - Part 1:
General and guidance
IEC TR 63072-1 - Photonic integrated circuits - Part 1: - -
Introduction and roadmap for standardization


3

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SIST EN IEC 62150-6:2022




IEC 62150-6

®


Edition 1.0 2022-01




INTERNATIONAL



STANDARD








colour

inside










Fibre optic active components and devices – Test and measurement

procedures –

Part 6: Universal mezzanine boards for test and measurement of photonic

devices
























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 33.180.20 ISBN 978-2-8322-1074-9




  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mezzanine board requirements . 7
4.1 Functional description . 7
4.2 Critical dimensions . 9
4.3 Daughtercard and extended system . 11
4.4 Power and signal flows . 15
Annex A (informative)  International collaborative research and development . 18
A.1 Overview. 18
A.2 European FP7 PhoxTroT project . 19
A.3 European H2020 Nephele project . 19
A.4 European H2020 COSMICC project . 19
A.5 Benefit of universal test board. 20
Bibliography . 21

Figure 1 – Outlines of mezzanine test boards . 7
Figure 2 – Attachment of PDS onto M2 board . 8
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 9
Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 10
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power
and low speed signal connectors on bottom surfaces and mezzanine board origin . 10
Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors . 12
Figure 7 – Attachment of M2 boards onto daughtercard . 13
Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards
attached. 14
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards
attached. 14
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards
and one M2 board attached . 15
Figure 11 – Functional diagram showing power and low speed signal distribution
between PDS, M1/M2, daughtercard and backplane . 16
Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots
on a system backplane . 17
Figure A.1 – Example of cross-project deployment of mezzanine test card [3] . 18
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project. 20

Table 1 – Critical relative dimensions . 11
Table 2 – Voltages and low-power signal designations . 16

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active
devices of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1721/CDV 86C/1752/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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A list of all parts in the IEC 62150 series, published under the general title Fibre optic active
components and devices – Test and measurement procedures, can be found on the IEC
website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

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IEC 62150-6:2022 © IEC 2022 – 5 –
INTRODUCTION
This document defines a generic electro-optic mezzanine board for the test and measurement
of micro-optical and micro-photonic devices, including a wide diversity of photonic integrated
circuit (PIC) technologies including, but not limited to, transceivers, switches, sensors,
neuromorphic networks, LiDAR and quantum integrated circuits. The board size and shape
would allow two mezzanine boards to be mounted, side-by-side, on a larger Eurocard form
factor daughtercard, which itself can be docked into and powered from a backplane system.
Alternatively, each mezzanine board can be operated alone, for example on a lab bench
powered from a bench supply.
The purpose of this generic mezzanine board concept is to allow like-for-like comparative
characterisation of devices under test (DUTs) with respect to one another and to measure the
performance of DUTs within larger test environments, relevant to their targeted application,
such as data centre systems, high performance computers, automotive or 5G cabinets. The
mezzanine board PCB will be designed to accommodate very high-speed electronic signals and
a high-speed electronic signal interface to allow external test equipment such as test pattern
generators, bit error rate testers and communication signal analysers to drive the device under
test (DUT).
This approach will be instrumental in accelerating commercial adoption of micro-photonic
devices as they will provide a common benchmark, against which to evaluate the true
performance of a DUT. For example, power consumption is an increasingly important figure of
merit for optical micro-transceivers in ICT systems; however, the declared values of power
consumption as interpreted by the developer often do not reflect the true power consumption of
a device under test in operation. The mezzanine board will therefore include provision for a
smaller detachable power distribution and sensor mezzanine board allowing multiple tuneable
voltages to be provided to the device under test and real-time current or power measurement
for each voltage.
Variants of these mezzanine boards have been successfully developed and adopted within the
1
European research and development projects European FP7 project PhoxTrot [1] , European
H2020 Nephele [2] and European H2020 COSMICC [3]. Annex A provides an introduction to
these projects.

___________
1
 Numbers in square brackets refer to the Bibliography.

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FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices



1 Scope
This part of IEC 62150 specifies a generic mezzanine board system to support test and
measurement of devices based on micro-optical and micro-photonic technologies, including but
not limited to photonic integrated circuit (PIC) devices.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-731, International Electrotechnical Vocabulary – Part 731: Optical fibre
communication (available at www.electropedia.org)
IEC 62150-1, Fibre optic active components and devices – Test and measurement procedures
– Part 1: General and guidance
IEC TR 63072-1, Photonic integrated circuits – Part 1: Introduction and roadmap for
standardization
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-731,
IEC 62150-1, IEC TR 63072-1 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
mezzanine board
electronic, optical, or electro-optical printed circuit board designed to be docked onto a larger
board such that the surfaces of the mezzanine board and larger board are parallel
3.2
photonic integrated circuit
PIC
integrated circuit that contains optical structures to guide and process optical signals
Note 1 to entry: See IEC TR 63072-1.

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3.3
device under test
DUT
single component or combination of components as defined to be tested
4 Mezzanine board requirements
4.1 Functional description
This document specifies three categories of mezzanine boards:
• half-width mezzanine test board 1 (M1);
• full-width mezzanine test board 2 (M2);
• power distribution and sensor board (PDS).
Figure 1 shows the outline shapes of these three mezzanine boards with electric power and
other low-speed electric connectors on the top and bottom surfaces.
This document defines the outline boundary of the three boards, as shown by the solid thick
line in Figure 1, but the designer is free to adopt any shape within the defined boundary, as
long as it does not interfere with the positions of the power and low-speed connectors on the
top and/or bottom surfaces. M2 is shown with optional example cut-outs along the edges. The
purpose of such cut-outs typically is to allow the user to access components on the underlying
host board over which the mezzanine board is attached. For example, during operation, the
user may require transient access to connectors on the underlying host board for low-speed
diagnostic read-outs from the PDS.

Figure 1 – Outlines of mezzanine test boards
M1 and M2 are mezzanine test boards with areas assigned for micro-optical or micro-photonic
devices under test (DUTs) and the associated electronic and optical test interfaces.

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For example, the DUT on a mezzanine test board (M1 or M2) could be an experimental photonic
integrated circuit (PIC) optical transceiver. The associated electronic test interface could be a
high RF electronic signal header connector array through which high-speed test signals
generated from an external electronic signal pattern generator could be conveyed to the optical
transmit section of the transceiver DUT and through which electronic high-speed signals
generated from the optical receiver section of the transceiver DUT could be conveyed off the
mezzanine test board to an external electronic communications signal analyser or bit error rate
tester. The associated optical test interface could be an optical array connector attached by an
optical fibre ribbon to the optical transceiver DUT through which high-speed optical signals from
an external optical signal pattern generator could be conveyed to the optical receiver section
of the transceiver DUT and through which optical high-speed optical signals generated from the
optical transmit section of the transceiver DUT could be conveyed off the mezzanine test board
to an external optical communications signal analyser or optical bit error rate tester.
The PDS is a power distribution and sensor board that attaches onto a full width mezzanine
card (M1) or across one or two half-width mezzanine test boards (M1) and provides the requisite
voltage or separate voltages to the device under test on its host mezzanine test board or boards.
In addition, the PDS provides a current sensor for each voltage provided to the mezzanine test
board(s), allowing the power consumption of the corresponding DUT to be measured. Typically,
the current sensor will communicate the readings of current in real-time across a low-speed
signal interface, for example a serial wire interface such as I2C. Figure 2 shows a PDS attaching
to an M2 board.

Figure 2 – Attachment of PDS onto M2 board

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4.2 Critical dimensions
This document defines the outline board dimensions and the relative positions of the origin
points of the power and low-speed signal connectors on the top and bottom surfaces with
respect to one another and the board origin points. The connector origin points are always
defined by the centre position of pin 1. In Figure 2, as well as in Figure 3 to Figure 10, the
connector origin points are represented by a corner of the package shape itself, but as
connectors may vary, the package sizes may also vary.
Figure 3 shows the relative positions of the origin points of the power and low-speed signal
connectors on top and bottom surfaces and the mezzanine board origin point on M1.

Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin
Figure 4 shows the relative positions of the origin points of the power and low-speed signal
connectors on top and bottom surfaces and the mezzanine board origin point on M2.

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Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin
Figure 5 shows the relative positions of power and low-speed signal header connectors on
bottom surfaces and the mezzanine board origin point on the PDS.

Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power and
low speed signal connectors on bottom surfaces and mezzanine board origin
Table 1 shows the values of the critical relative dimensions of the board outline and relative
positions of the power and low-speed signal connectors on the top and bottom surfaces with
respect to one another and the board origin points.

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Table 1 – Critical relative dimensions
Value
Designation Description
mm
Mezzanine board 1 (M1)
a Length of M1 145
b Width of M1 Maximum 53
c Vertical distance between bottom connector 1 and top connector 3 48
d Vertical distance between top connector 3 and bottom connector 2 86,35
e Vertical distance between bottom connector 2 and board origin point 8,25
f Horizontal distance between bottom connector 2 and board origin point 15
Mezzanine board 2 (M2)
g Length of M2 145
h Width of M2 Maximum 112
i Horizontal distance between bottom connectors 4 and 5 70
j Horizontal distance between top connectors 8 and 9 70
k Vertical distance between bottom connectors 4 and 6 134
l Vertical distance between bottom connector 4 and top connector 8 48
m Vertical distance between top connector 8 and bottom connector 6 86,35
n Vertical distance between bottom connector 6 and board origin point 8,25
o Horizontal distance between bottom connector 6 and board origin point 15
Power distribution and sensor board (PDS)
p Length of PDS 112
q Width of PDS Maximum 145
r Horizontal distance between bottom connectors 10 and 11 70
s Vertical distance between bottom connector 10 and board origin point 14,75
t Horizontal distance between bottom connector 10 and board origin point 16,5

4.3 Daughtercard and extended system
The M1 and M2 boards populated with PDS can be used stand-alone, for example on a lab
bench powered by an external power supply.
Alternatively, the M1 and M2 boards can be incorporated into a wider rack-scale test system,
whereby they are mounted onto a test daughtercard, and the test daughtercard, in turn, could
be electro-optically plugged into the backplane of the test enclosure.
The M1 and M2 board dimensions were designed to allow either four M1 or two M2 boards to
be populated onto a daughtercard with "extended double Eurocard form factor", which is a
common industrial form factor appropriate for deployment in rack-scale enclosures.
Figure 6 shows the outline dimensions of an extended double Eurocard form factor
daughtercard with example electrical edge connectors and example cut-outs to accommodate
optical backplane connectors.

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Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors
Figure 7 shows two M2 boards being attached to a test daughtercard.

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