EN IEC 62150-6:2022

Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices

This part of IEC 62150 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.

Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6: Universelle Mezzanine Leiterplatten zur Prüfung und Messung von photonischen Baugruppen

Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de mesures – Partie 6: Cartes mezzanines universelles pour les essais et les mesures des dispositifs photoniques

IEC 62150-6:2022 spécifie un système de carte mezzanine générique pour prendre en charge les essais et les mesures des dispositifs basés sur des technologies micro‑optiques et microphotoniques, incluant, entre autres, les dispositifs à circuit intégré photonique (PIC).

Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del: Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC 62150-6:2022)

Ta del standarda IEC 62150 določa splošni sistem medetažnih plošč za podporo preizkušanja in merjenja naprav, ki temeljijo na mikrooptičnih in mikrofotonskih tehnologijah, kar med drugim vključuje naprave s fotonskim integriranim vezjem (PIC).

General Information

• Status: Published
• Publication Date: 10-Mar-2022
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: CLC/SR 86C - Fibre optic systems and active devices
• Drafting Committee: IEC/SC 86C - IEC_SC_86C
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 11-Mar-2022
• Due Date: 16-Dec-2022
• Completion Date: 11-Mar-2022
• Ref Project: SIST EN IEC 62150-6:2022 - Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-6:2022)

Overview - EN IEC 62150-6:2022 (Universal mezzanine boards)

EN IEC 62150-6:2022 defines a generic mezzanine board system for the test and measurement of micro‑optical and micro‑photonic devices, including photonic integrated circuits (PICs). The standard specifies a modular electro‑optic mezzanine architecture (M1 / M2 types and a detachable power distribution and sensor board - PDS) that can be used stand‑alone on a bench supply or mounted side‑by‑side on an extended Eurocard daughtercard and system backplane. Its goal is to enable like‑for‑like comparative characterisation of photonic devices and to provide consistent, system‑relevant test interfaces for high‑speed signals and accurate power monitoring.

Key topics and requirements

• Generic mezzanine architecture: Defines a mezzanine board concept sized to allow two boards on a double Eurocard daughtercard; supports single‑board bench use or backplane integration.
• Board variants: Differentiates mezzanine types (M1/M2) and a detachable Power Distribution and Sensor (PDS) board for real‑time voltage/current monitoring.
• High‑speed electrical interface: PCB design considerations to support very high‑speed electronic signals and interfaces to external test equipment (test pattern generators, bit error rate testers, signal analyzers).
• Power and signal flows: Specifies distribution of multiple tunable voltages and low‑speed control signals, and provision for accurate real‑time power/current measurement per voltage rail.
• Mechanical and dimensional guidance: Critical relative dimensions and board outlines allow consistent mounting on daughtercards and system backplanes for system‑level testing.
• Intended device coverage: Applicable to a wide range of photonic devices - PIC transceivers, switches, sensors, LiDAR, neuromorphic and quantum photonic circuits.

Applications and who uses it

• Device developers and test engineers: For repeatable lab characterisation and fair comparative benchmarking of PICs and micro‑photonic devices.
• R&D projects and consortia: Used in collaborative projects to standardize test hardware and accelerate technology maturity (references in Annex A to EU projects such as PhoxTrot, Nephele, COSMICC).
• Manufacturers and integrators: For system‑level validation in data centre, HPC, automotive, 5G, LiDAR and quantum photonics use cases.
• Test labs and certification bodies: To ensure consistent test setups that reflect target application environments and support accurate power and performance claims.

Related standards

• IEC 62150-1 - Test and measurement procedures (general and guidance)
• IEC TR 63072-1 - Photonic integrated circuits - introduction and roadmap
• IEC 60050-731 - IEV (Optical fibre communication)

EN IEC 62150-6:2022 provides a practical, interoperable hardware baseline (mezzanine test boards, PDS, daughtercard/backplane integration) to improve comparability, reproducibility and system‑relevant performance assessment of photonic devices.

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2022
Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del:
Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC
62150-6:2022)
Fibre optic active components and devices - Test and measurement procedures - Part 6:
Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-
6:2022)
Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6:
Universelle Mezzanine Platinen zur Prüfung und Messung von photonischen
Baugruppen (IEC 62150-6:2022)
Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de
mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des
dispositifs photoniques (IEC 62150-6:2022)
Ta slovenski standard je istoveten z: EN IEC 62150-6:2022
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62150-6

NORME EUROPÉENNE
EUROPÄISCHE NORM March 2022
ICS 33.180.20
English Version
Fibre optic active components and devices - Test and
measurement procedures - Part 6: Universal mezzanine boards
for test and measurement of photonic devices
(IEC 62150-6:2022)
Composants et dispositifs actifs fibroniques - Procédures Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf-
d'essais de base et de mesures - Partie 6: Cartes und Messverfahren - Teil 6: Universelle Mezzanine Platinen
mezzanines universelles pour les essais et les mesures des zur Prüfung und Messung von photonischen Baugruppen
dispositifs photoniques (IEC 62150-6:2022)
(IEC 62150-6:2022)
This European Standard was approved by CENELEC on 2022-03-04. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
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Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62150-6:2022 E

European foreword
The text of document 86C/1721/CDV, future edition 1 of IEC 62150-6, prepared by SC 86C "Fibre
optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62150-6:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-12-04
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-03-04
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62150-6:2022 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-731 - International Electrotechnical Vocabulary - - -
Part 731: Optical fibre communication
IEC 62150-1 - Fibre optic active components and devices - EN 62150-1 -
Test and measurement procedures - Part 1:
General and guidance
IEC TR 63072-1 - Photonic integrated circuits - Part 1: - -
Introduction and roadmap for standardization

IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement

procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic

devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-1074-9

– 2 – IEC 62150-6:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mezzanine board requirements . 7
4.1 Functional description . 7
4.2 Critical dimensions . 9
4.3 Daughtercard and extended system . 11
4.4 Power and signal flows . 15
Annex A (informative)  International collaborative research and development . 18
A.1 Overview. 18
A.2 European FP7 PhoxTroT project . 19
A.3 European H2020 Nephele project . 19
A.4 European H2020 COSMICC project . 19
A.5 Benefit of universal test board. 20
Bibliography . 21

Figure 1 – Outlines of mezzanine test boards . 7
Figure 2 – Attachment of PDS onto M2 board . 8
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 9
Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 10
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power
and low speed signal connectors on bottom surfaces and mezzanine board origin . 10
Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors . 12
Figure 7 – Attachment of M2 boards onto daughtercard . 13
Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards
attached. 14
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards
attached. 14
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards
and one M2 board attached . 15
Figure 11 – Functional diagram showing power and low speed signal distribution
between PDS, M1/M2, daughtercard and backplane . 16
Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots
on a system backplane . 17
Figure A.1 – Example of cross-project deployment of mezzanine test card [3] . 18
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project. 20

Table 1 – Critical relative dimensions . 11
Table 2 – Voltages and low-power signal designations . 16

IEC 62150-6:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active
devices of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1721/CDV 86C/1752/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62150-6:2022 © IEC 2022
A list of all parts in the IEC 62150 series, published under the general title Fibre optic active
components and devices – Test and measurement procedures, can be found on the IEC
website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

IEC 62150-6:2022 © IEC 2022 – 5 –
INTRODUCTION
This document defines a generic electro-optic mezzanine board for the test and measurement
of micro-optical and micro-photonic devices, including a wide diversity of photonic integrated
circuit (PIC) technologies including, but not limited to, transceivers, switches, sensors,
neuromorphic networks, LiDAR and quantum integrated circuits. The board size and shape
would allow two mezzanine boards to be mounted, side-by-side, on a larger Eurocard form
factor daughtercard, which itself can be docked into and powered from a backplane system.
Alternatively, each mezzanine board can be operated alone, for example on a lab bench
powered from a bench supply.
The purpose of this generic mezzanine board concept is to allow like-for-like comparative
characterisation of devices under test (DUTs) with respect to one another and to measure the
performance of DUTs within larger test environments, relevant to their targeted application,
such as data centre systems, high performance computers, automotive or 5G cabinets. The
mezzanine board PCB will be designed to accommodate very high-speed electronic signals and
a high-speed electronic signal interface to allow external test equipment such as test pattern
generators, bit error rate testers and communication signal analysers to drive the device under
test (DUT).
This approach will be instrumental in accelerating commercial adoption of micro-photonic
devices as they will provide a common benchmark, against which to evaluate the true
performance of a DUT. For example, power consumption is an increasingly important figure of
merit for optical micro-transceivers in ICT systems; however, the declared values of power
consumption as interpreted by the developer often do not reflect the true power consumption of
a device under test in operation. The mezzanine board will therefore include provision for a
smaller detachable power distribution and sensor mezzanine board allowing multiple tuneable
voltages to be provided to the device under test and real-time current or power measurement
for each voltage.
Variants of these mezzanine boards have been successfully developed and adopted within the
European research and development projects European FP7 project PhoxTrot [1] , European
H2020 Nephele [2] and European H2020 COSMICC [3]. Annex A provides an introduction to
these projects.
___________
Numbers in square brackets refer to the Bibliography.

– 6 – IEC 62150-6:2022 © IEC 2022
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

1 Scope
This part of IEC 62150 specifies a generic mezzanine board system to support test and
measurement of devices based on micro-optical and micro-photonic technologies, including but
not limited to photonic integrated circuit (PIC) devices.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-731, International Electrotechnical Vocabulary – Part 731: Optical fibre
communication (available at www.electropedia.org)
IEC 62150-1, Fibre optic active components and devices – Test and measurement procedures
– Part 1: General and guidance
IEC TR 63072-1, Photonic integrated circuits – Part 1: Introduction and roadmap for
standardization
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-731,
IEC 62150-1, IEC TR 63072-1 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
mezzanine board
electronic, optical, or electro-optical printed circuit board designed to be docked onto a larger
board such that the surfaces of the mezzanine board and larger board are parallel
3.2
photonic integrated circuit
PIC
integrated circuit that contains optical structures to guide and process optical signals
Note 1 to entry: See IEC TR 63072-1.

IEC 62150-6:2022 © IEC 2022 – 7 –
3.3
device under test
DUT
single component or combination of components as defined to be tested
4 Mezzanine board requirements
4.1 Functional description
This document specifies three categories of mezzanine boards:
• half-width mezzanine test board 1 (M1);
• full-width mezzanine test board 2 (M2);
• power distribution and sensor board (PDS).
Figure 1 shows the outline shapes of these three mezzanine boards with electric power and
other low-speed electric connectors on the top and bottom surfaces.
This document defines the outline boundary of the three boards, as shown by the solid thick
line in Figure 1, but the designer is free to adopt any shape within the defined boundary, as
long as it does not interfere with the positions of the power and low-speed connectors on the
top and/or bottom surfaces. M2 is shown with optional example cut-outs along the edges. The
purpose of such cut-outs typically is to allow the user to access components on the underlying
host board over which the mezzanine board is attached
...