oSIST prEN IEC 61189-2-803:2022
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih podložnih materialov
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-803:2022
01-januar-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih
podložnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and
printed board
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la
dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
Ta slovenski standard je istoveten z: prEN IEC 61189-2-803:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-803:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN IEC 61189-2-803:2022
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oSIST prEN IEC 61189-2-803:2022
91/1760/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-803 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-11-05 2022-01-28
SUPERSEDES DOCUMENTS:
91/1545/CD, 91/1612A/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
TITLE:
Test methods for electrical materials, printed board and other interconnection structures and assemblies
– Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board
PROPOSED STABILITY DATE: 2027
NOTE FROM TC/SC OFFICERS:
Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
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oSIST prEN IEC 61189-2-803:2022
61189-2-803/Ed1/CD IEC – 2 – 91/1760/CDV
1
2 CONTENTS
3 FOREWORD . 3
4 1 Scope. 5
5 2 Normative References . 5
6 3 Terms and definitions . 5
7 4 Preparation of Test Specimens. 5
8 5 Test Specimens . 5
9 6 Test Apparatus . 6
10 7 Test Procedure. 6
11 8 Calculation . 6
12 9 Report . 7
13
14 Figure 1 – Example TMA Data Output . 6
15
16
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oSIST prEN IEC 61189-2-803:2022
61189-2-803/Ed1/CD IEC – 3 – 91/1760/CDV
17
18 INTERNATIONAL ELECTROTECHNICAL COMMISSION
19 ____________
20 Test methods for electrical materials, printed board and other interconnection
21 structures and assemblies -
22 Part 2-803: Test Methods for Z-Axis Expansion of Base Materials and Printed Board
23
24 FOREWORD
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