WG 5 - TC 107/WG 5

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).
This first edition cancels and replaces IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition:
a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008;
b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/ subclauses for guidance purposes only;
c) added the analysis of component technical erratum
d) updated Bibliography and reference documents

IEC TS 62239-2:2017(E) applies to the development of COTS assembly management plans for the integration and management of electronic COTS assemblies in electronic systems used in the ADHP markets where reliability is generally critical. Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans could consider tailoring the requirements of this document. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.