ASTM D5127-99
(Guide)Standard Guide for Ultra Pure Water Used in the Electronics and Semiconductor Industry
Standard Guide for Ultra Pure Water Used in the Electronics and Semiconductor Industry
SCOPE
1.1 This guide covers the recommendations for the purity of water suitable for use in the electronics and microelectronics industry for purposes such as the washing and rinsing of semiconductor components in cleaning and etching operations, making steam for oxidation of silicon surfaces, photomask preparation, luminescent material deposition, and similar applications relating to the development and fabrication of solid state, thin film, communication lasers, light emitting diodes, photodetector, printed circuit, memory, vacuum tube, or electrolytic devices.
1.2 The values stated in SI units are to be regarded as standard. The inch-pound units given in parentheses are for information only.
1.3 This standard does not purport to address the safety problems associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation:D5127–99
Standard Guide for
Ultra Pure Water Used in the Electronics and
Semiconductor Industry
This standard is issued under the fixed designation D 5127; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope Absorption Spectrophotometry
D 4327 Test Method for Anions by Chemically Suppressed
1.1 This guide provides recommendations for water quality
Ion Chromatography
related to current electronics and semiconductor industry
D 4453 Practice for Handling of Ultra Pure Water Samples
requirements.
D 4517 Test Method for Low-Level Total Silica in High-
1.2 Water is used for washing and rinsing of semiconductor
Purity Water by Flameless Atomic Absorption Spectros-
components during manufacture. It is also used for cleaning
copy (GFAAS)
and etching operations, making steam for oxidation of silicon
D 4779 Test Method forTotal, Organic or Inorganic Carbon
surfaces, photomask preparation and luminescent material
in High-Purity Water by Ultraviolet (UV) or Both, or by
deposition. Other applications are in the development and
High Temperature Combustion Followed by Gas Phase
fabrication of solid state, thin film, communication lasers, light
NDIR or Electrolytic Conductivity
emitting diodes, photo-detectors, printed circuits, memory,
D 5173 Test Method for On-Line Monitoring of Carbon
vacuum tube, or electrolytic devices.
CompoundsinWaterbyChemicalOxidation,byUVLight
1.3 Thisguidealsoprovidesrecommendationsforultrapure
Oxidation, by Both, or by High Temperature Combustion
waterqualityrelatedtoindustryrequirementsforproductionof
Followed by Gas Phase NDIR or Electrolytic Conductiv-
devices having line widths from 5 to 0.18 µm.
ity
1.4 This standard does not purport to address all of the
D 5391 Test Method for Electrical Conductivity and Resis-
safety concerns, if any, associated with its use. It is the
tivity of a Flowing High Purity Water Sample
responsibility of the user of this standard to establish appro-
D 5462 Test Method for On-Line Measurement of Dis-
priate safety and health practices and determine the applica-
solved Oxygen in Water
bility of regulatory limitations prior to use.
D 5542 TestMethodsforTraceAnionsinHighPurityWater
2. Referenced Documents
by Ion Chromatography
D 5544 Test Method for On-Line Measurement of Residue
2.1 ASTM Standards:
after Evaporation of High-Purity Water
D 1129 Terminology Relating to Water
D 5673 Test Method for Elements in Water by Inductively-
D 1193 Specification for Reagent Water
Coupled Argon Plasma Mass Spectrometry (ICP-MS)
D 1976 Test Method for Elements in Water by Inductively-
D 5996 Test Method for Measuring Anionic Contaminants
Coupled Argon Plasma Atomic Emission Spectroscopy
in High-Purity Water by On-Line Ion Chromatography
(ICP-AES)
D 5997 Test Method for On-Line Monitoring of Total Car-
D 2791 Test Method for Continuous Determination of So-
bon, Inorganic Carbon, in Water by Ultraviolet, Persulfate
dium in Water
Oxidation, and Membrane Conductivity Detection
D 3919 Practice for Measuring Trace Elements in Water by
F 1094 Test Methods for Microbiological Monitoring of
Graphite Furnace Atomic Absorption Spectrophotometry
Water Used for Processing Electron and Microelectronic
D 4191 Test Method for Sodium in Water by Atomic
Devices by Direct-PressureTap SamplingValve and by the
Absorption Spectrophotometry
Pre-Sterilized Plastic Bag Method
D 4192 Test Method for Potassium in Water by Atomic
3. Terminology
1 3.1 Definitions— For definitions of terms used in this guide
This guide is under the jurisdiction of ASTM Committee D19 on Water and is
the direct responsibility of Subcommittee D19.02 on General Specifications, refer to Terminology D 1129.
Technical Resources, and Statistical Methods.
Current edition approved June 10, 1999. Published September 1999. Originally
published as D 5127 – 90. Last previous edition D 5127 – 98. Annual Book of ASTM Standards, Vol 11.02.
2 4
Annual Book of ASTM Standards, Vol 11.01. Annual Book of ASTM Standards, Vol 10.04.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
D5127–99
3.2 Definitions of Terms Specific to This Standard: 4. Significance and Use
3.2.1 endotoxins, n—substances or by-products usually pro-
4.1 This guide recommends the water quality required for
duced by gram negative microorganisms that give a positive the electronic and microelectronic industry. High purity water
test for pyrogens, determined in accordance with the limulus is required to prevent contamination of products during manu-
facture, which would otherwise result in an unacceptable, low
lysate test (9.2).
yield of electronic devices.
3.2.2 total bacterial counts, n—total number of viable
4.2 The range of water purity is defined in accordance with
microorganisms present in the named sample, excluding
the manufacturing process. The types of ultra pure water are
anaerobic organisms, determined in accordance with Test
defined with respect to device line width.
Methods F 1094.
4.3 The limits on the impurities are related to current
3.2.3 total organic carbon (TOC), n—carbon measured
contamination specifications and to available analytical meth-
after inorganic carbon response has been eliminated by one of
ods performed in a suitable, clean laboratory or using on-line
the prescribed ASTM test methods (such as elimination in
methods. On-line and off-line methods are used in accordance
accordance with Test Method D 4779).
with current industry practice. Concentration of the sample
3.2.4 water, n—water prepared in accordance with Specifi-
may be required to measure the impurities at the levels
cation D 1193, reagent grade Type I. indicated in Table 1.
TABLE 1 Requirements for Water Used in the Electronics and Semiconductor Industry
Parameter Type E-1 Type E-1.1 Type E-1.2 Type E-2 Type E-3 Type E-4
Linewidth (microns) 1.0–0.5 0.5–0.25 0.25–0.18 5.0–1.0 > 5.0 —
Resistivity, 25°C 18.2 18.2 18.2 17.5 12 0.5
Endotoxin unit (EU/mL) 0.03 0.03 0.03 0.25 — —
TOC (µg/L) 5 2 1 50 300 1000
Dissolved oxygen (µg/L) 1 1 1 — — —
Residue after evaporation (µg/L) 1 0.5 0.1 — — —
SEM particles/L (micron range)
0.1–0.2 1000 1000 200 — — —
0.2–0.5 500 500 100 3000 — —
0.5–1 50 50 1 — 10 000 —
10 ————— 100000
On-line particles/L (micron range)
0.05–0.1 500 500 100 — — —
0.1–0.2 300 300 50 — — —
0.2–0.3 50 50 20 — — —
0.3–0.5 20 20 10 — — —
>0.5 4 4 1 — — —
Bacteria/100 mL
100 mL Sample 1 1 1 — — —
1 L Sample 1 1 0.1 10 10 000 100 000
Silica – total (µg/L) 3 0.5 0.5 10 50 1000
Silica – dissolved (µg/L) 1 0.1 0.05 — — —
Ions and metals (µg/L)
Ammonium 0.1 0.10 0.05 — — —
Bromide 0.1 0.05 0.02 — — —
Chloride 0.1 0.05 0.02 1 10 1000
Fluoride 0.1 0.05 0.03 — — —
Nitrate 0.1 0.05 0.02 1 5 500
Nitrite 0.1 0.05 0.02 — — —
Phosphate 0.1 0.05 0.02 1 5 500
Sulfate 0.1 0.05 0.02 1 5 500
Aluminum 0.05 0.02 0.005 — — —
Barium 0.05 0.02 0.001 — — —
Boron 0.05 0.02 0.005 — — —
Calcium 0.05 0.02 0.002 — — —
Chromium 0.05 0.02 0.002 — — —
Copper 0.05 0.02 0.002 1 2 500
Iron 0.05 0.02 0.002 — — —
Lead 0.05 0.02 0.005 — — —
Lithium 0.05 0.02 0.003 — — —
Magnesium 0.05 0.02 0.002 — — —
Manganese 0.05 0.02 0.002 — — —
Nickel 0.05 0.02 0.002 1 2 500
Potassium 0.05 0.02 0.005 2 5 500
Sodium 0.05 0.02 0.005 1 5 1000
Strontium 0.05 0.02 0.001 — — —
Zinc 0.05 0.02 0.002 1 5 500
D5127–99
5. Classification 5.2.3 Organic and Biological Removal Systems—Removal
of biological and organic contaminants is an important adjunct
5.1 Six types of electronic grade water are described in this
of any system used to prepare ultra pure water. Dissolved
guide.
organic compounds can accumulate in the system during the
5.1.1 Type E-1—This water is classified as microelectronic
process as well as being present in the original water. Methods
water to be used in the production of devices having line
of minimizing biological contamination include the addition of
widths between 0.5 and 1.0 µm.
active chlorine (sodium hypochlorite), hydrogen peroxide, and
5.1.2 Type E-1.1—This water is classified as microelec-
ozone. Ultraviolet irradiation at 254 nm significantly reduces
tronic water to be used in the production of devices having line
the growth of organisms. Ultraviolet irradiation at 185 nm
widths between 0.25 and 0.5 µm.
produces traces of ozone that break down organic compounds
5.1.3 Type E-1.2—This water is classified as microelec-
to carbon dioxide. Adsorptive beds such as strong base anion
tronic water to be used in the production of devices having line
resins as well as mixed resin beds may also be effective in
widths between 0.18 and 0.25 µm. It is the water of ultimate
removing biological contaminants. Membrane filters including
practical purity produced in large volumes and is intended for
reverse osmosis and ultrafilters may also remove biological
the most critical uses.
impurities as well as organic molecules. Synthetic adsorbent
5.1.4 Type E-2—This water is classified as microelectronic
columnsrangingfromporousresinstoactivatedcarbonmaybe
water to be used in the production of devices that have
effective in removing organics.
dimensions between 1 and 5 µm.
5.2.4 Particulate Removal—Particulate removal in the pro-
5.1.5 Type E-3—This grade of water is classified as macro-
duction of ultra pure water is differentiated from pretreatment
electronic water to be used in the production of devices having
to remove gross suspended substances. Particles of all types,
dimensions larger than 5 µm. This grade may be used to
biological,organic,orinorganic,significantlyinterferewiththe
produce larger components and some small components not
production of electronic components. Processes used to re-
affected by trace amounts of impurities.
move particulate matter generally consist of the use of a
5.1.6 Type E-4—This may be classified as electroplating
microporous membrane structure of flat, cylindrical, or pleated
water to be used in the preparation of plating solutions, the
configuration. In the case of ultrafilters and reverse osmosis
production of certain electronic grade chemicals, and other
units, they are of hollow fiber, tubular, or spiral wound. The
applications where the water being used is in constant contact
with the atmosphere because of tank storage. This water purity choice of the particular membrane depends upon the pore size,
is based upon the fact that the water may have had a characteristics of that membrane, and the size of particle to be
significantly higher purity, but that it becomes contaminated removed.As a general rule, particles of a size larger than 10 %
because of tank storage and handling. of the minimum dimension of the device being produced
should be removed. The measurement of these particles be-
5.2 Components of the water system for producing elec-
tronic grade water shall be grouped into five general process comes difficult at best and is generally dictated by the quality
sections for the purpose of simplifying the organization of the and pore size of the membrane used as the final filter.
components of the systems. These processes are described in
5.2.5 Storage and Distribution System—This guide for the
5.2.1-5.2.5.
storage of electronic grade water during production is very
5.2.1 Pretreatment—The processes in this category include
important because impurities are added to the water in propor-
the addition of various types of coagulants, precipitating
tion to the solubility, area of contact, and time of contact
agents, clarifiers, sedimentation tanks, particulate filtration
between the water and materials of containment. Because it is
systems, including sand filters, disposable filter elements,
important to minimize the contact with the materials of
ultrafilter membranes, and other particle removing systems.
containment of storage, the volume of storage should also be
Adsorbent or entrapment beds may include greensand, acti-
minimized. Particular emphasis must be placed upon the
vated carbon, and various synthetic materials specific for
atmosphere above the water that may contaminate the water
certain organic and inorganic impurities.
with biological, organic, inorganic, and particulate impurities.
5.2.2 Desalination—This process is fundamental to the
The storage of E-1, E-1.1, E-1.2, E-2, and E-3 waters is
production of ultrapure water of all grades and may include
impossible (if expecting to maintain purity); therefore, all
more than one of the processes of ion exchange, distillation,
storage should be before the final polishing, tertiary section.
reverseosmosis,electrodialysis,orcontinuouselectrodeioniza-
5.2.5.1 The distribution systems also present a large area of
tion or all of the above. The size of the system governs the
contact between the water and pipe or tubing and, therefore,
choice of the combination of desalination processes; for
must be of a pure insoluble substance. Once again, the degree
exampletheuseofdistillationinalaboratorythatwouldnotbe
of contamination depends upon the solubility of the materials
practical in a large production plant. Various configurations of
of contact as well as the time of contact. For that reason and
the different processes should be considered, including two-
because biological impurities tend to accumulate in stagnant
bed and mixed-bed demineralization, multi-stage reverse os-
water, the flow of water through the distribution system must
mosis employing various types of membranes, and electrodi-
be maintained on a continuous 24 hr basis. Contaminants
alysis that might employ periodic polarity reversal techniques
probably dissolve in the water at a constant rate; therefore an
aswellastheuseofresinsplacedbetweenthecationandanion
membranes. increase in the velocity through the pipe will give an apparent
D5127–99
reduction in the contamination. However the flow rate, particu- theAmerican Chemical Society , where such specifications are
larly through large pipes above 50 mm diameter that have a available. Other grades may be used, provided it is first
small surface to volume ratio, need not exceed 25 cm/s. ascertained that the reagent is of sufficiently high purity to
5.2.5.2 Plastic systems should be installed with care without permit its use without lessening the accuracy of the determi-
the use of oils of any kind. Generally, cleaning prior to use is nation.
best accomplished by rinsing for several days with pure water. 7.2 Purity of Water:
Ifthesystemhasbeenidleforaperiodoftimeorwasnotclean
...
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