ASTM F1262M-95(2008)
(Guide)Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
SIGNIFICANCE AND USE
Digital logic circuits are used in system applications where they are exposed to pulses of radiation. It is important to know the minimum radiation level at which transient failures can be induced, since this affects system operation.
SCOPE
1.1 This guide is to assist experimenters in measuring the transient radiation upset threshold of silicon digital integrated circuits exposed to pulses of ionizing radiation greater than 103 Gy (Si)/s.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F1262M − 95(Reapproved 2008)
Standard Guide for
Transient Radiation Upset Threshold Testing of Digital
Integrated Circuits (Metric)
This standard is issued under the fixed designation F1262M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.1 combinational logic—A digital logic system with the
property that its output state at a given time is solely deter-
1.1 This guide is to assist experimenters in measuring the
mined by the logic signals at its inputs at the same time (except
transient radiation upset threshold of silicon digital integrated
3 for small time delays caused by the propagation delay of
circuits exposed to pulses of ionizing radiation greater than 10
internal logic elements).
Gy (Si)/s.
3.1.1.1 Discussion—Combinational circuits contain no in-
1.2 This standard does not purport to address all of the
ternal storage elements. Hence, the output signals are not a
safety concerns, if any, associated with its use. It is the
functionofanysignalsthatoccurredatpasttimes.Examplesof
responsibility of the user of this standard to establish appro-
combinational circuits include gates, adders, multiplexers and
priate safety and health practices and determine the applica-
decoders.
bility of regulatory limitations prior to use.
3.1.2 complex circuit response mechanisms—For medium
scale integration (MSI) and higher devices it is useful to define
2. Referenced Documents
three different categories of devices in terms of their internal
2.1 ASTM Standards:
design and radiation response mechanisms.
E666 Practice for CalculatingAbsorbed Dose From Gamma
3.1.3 over-stressed device—A device that has conducted
or X Radiation
more than the manufacturer’s specified maximum current, or
E668 Practice for Application of Thermoluminescence-
dissipated more than the manufacturer’s specified maximum
Dosimetry (TLD) Systems for Determining Absorbed
power.
Dose in Radiation-HardnessTesting of Electronic Devices
3.1.3.1 Discussion—In this case the DUT is considered to
F867M Guide or Ionizing Radiation Effects (Total Dose)
be overstressed even if it still meets all of the manufacturer’s
Testing of Semiconductor Devices [Metric] (Withdrawn
specifications. Because of the overstress, the device should be
1998)
evaluated before using it in any high reliability application.
2.2 Military Standards:
3.1.4 sequential logic—A digital logic system with the
Method 1019 in MIL-STD-883. Steady-State Total Dose
property that its output state at a given time depends on the
Irradiation Procedure
sequence and time relationship of logic signals that were
Method 1021 in MIL-STD-883. Dose Rate Threshold for
previously applied to its inputs.
Upset of Digital Microcircuits.
3.1.4.1 Discussion—Examples of sequential logic circuits
3. Terminology include flip-flops, shift registers, counters, and arithmetic logic
units.
3.1 Definitions:
3.1.5 state vector—A state vector completely specifies the
logic condition of all elements within a logic circuit.
This guide is under the jurisdiction of ASTM Committee F01 on Electronics
3.1.5.1 Discussion—For combinational circuits, the state
and is the direct responsibility of Subcommittee F01.11 on Nuclear and Space
vector includes the logic signals that are applied to all inputs:
Radiation Effects.
for sequential circuits, the state vector must also include the
Current edition approved June 15, 2008. Published July 2008. Originally
approved in 1995. Last previous edition approved in 2002 as F1262M – 95(2002).
sequence and time relationship of all input signals. In this
DOI: 10.1520/F1262M-95R08.
guide the output states will also be considered part of the state
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
vector definition. For example, an elementary 4-input NAND
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
gate has 16 possible state vectors, 15 of which result in the
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website.
same output condition (“1” state). A 4-bit counter has 16
Withdrawn. The last approved version of this historical standard is referenced
possible output conditions, but many more state vectors be-
on www.astm.org.
cause of its dependence on the dynamic relationship of various
Available from Standardization Documents Order Desk, Bldg. 4, Section D,
700 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. input signals.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F1262M − 95 (2008)
3.1.6 upset response—The electrical response of a circuit (7) Power supply and operating frequency requirements,
when it is exposed to a pulse of transient ionizing radiation. (8) State vectors used for testing,
3.1.6.1 Discussion—Two types of upset response can occur:
(9) Radiation levels to use for transient response measure-
(1) transient output error, for which the instantaneous ments,
output voltage of an operating digital circuit is greater than
(10) Recommendedradiationlevelatwhichtobeginthetest
a predetermined value (for a low output condition) or less
sequence, and
thanapredeterminedvalue(forahighoutputcondition),and
(11) Procedure to adjust the dose rate during testing.
the circuit spontaneously recovers to its pre-irradiation
(12) Device temperature during test.
condition after the radiation pulse subsides. The predeter-
4.3 The state vectors in which the device is to be irradiated
mined values mentioned above are agreed to by all parties
are determined from the basic (see 8.2.1) and topological
participating in the test and should be included in the test
analysis, (see 8.2.2) or both.
plan.
(2) stored logic state error, for which there is a change in
5. Significance and Use
the state of one or more internal logic elements that does not
5.1 Digital logic circuits are used in system applications
recover spontaneously after the radiation pulse. Because the
where they are exposed to pulses of radiation. It is important to
radiation changes the state vector, the circuit spontaneously
know the minimum radiation level at which transient failures
recovers to a different logic state. This does not imply the
can be induced, since this affects system operation.
change will always be immediately observable on a circuit
output. However, the circuit can be restored to its original
state vector by re-initializing it afterwards. 6. Interferences
3.1.6.2 Discussion—Although the term upset response is
6.1 Accumulated Ionizing Dose—Many devices may be
usually used to describe output voltage responses, some
permanently damaged by the accumulated ionizing dose they
devices, such as open collector gates, are better characterized
are exposed to during upset testing. This limits the number of
by measuring the output current. Upset response also includes
radiation pulses that can be applied during transient upset
thetransientcurrentsthatareinducedinthepowersupplyleads
testing. Accumulated ionizing dose sensitivity depends on
(sometimes very large) as well as the response of the device
fabrication techniques and device technology. Metal oxide
inputs, although in most applications the input response is not
semiconductor (MOS) devices are especially sensitive to
significant.
accumulated ionizing dose damage. Newer bipolar devices
with oxide-isolated sidewalls may also be affected by low
4. Summary of Guide
levels of accumulated ionizing dose. The maximum ionizing
dose to which devices are exposed must not exceed 10 % (see
4.1 Fortransientradiationupsetthresholdtests,thetransient
8.4.5) of the typical ionizing dose failure level of the specific
output voltage and the condition of internal storage elements,
part type.
or both, is measured at a succession of radiation levels to
determine the radiation level for which transient voltage or
6.2 Dosimetry Accuracy—Since this guide ultimately deter-
functional test errors first occur. An oscilloscope, digital
mines the dose rate at which upset occurs, dosimetry accuracy
storage oscilloscope, transient digitizer or similar instrument is
inherently limits the accuracy of the guide.
used to measure the output transient voltage. Functional tests
6.3 Latchup—Some types of integrated circuits may be
are made immediately after irradiation to detect internal
drivenintoalatchupconditionbytransientradiation.Iflatchup
changesinstateinducedbytheradiation.Thedeviceisinitially
occurs, the device will not function properly until power is
biased and set up in a predetermined condition. The test
temporarily removed and reapplied. Permanent damage may
conditions are determined from topological analyses or by
also occur.Although latchup is an important transient response
testing the device in all possible logic state combinations.
mechanism, this procedure is not applicable to latchup testing.
4.2 A number of factors are not defined in this guide and
Functional testing after irradiation is required to detect internal
must be agreed upon beforehand by the parties to the test.
changes of state, and this will also detect latchup.
These factors are described in the test plan.As a minimum the
6.4 Package Response—At dose rates above 10 Gy (Si)/s
test plan must specify the following:
the response may be dominated by the package response rather
(1) Pulse width, energy spectrum, and type of radiation
than the response of the integrated circuit device being tested.
source,
For high speed devices, this may include lead/bondwire effects
(2) Voltage and electrical loading conditions on each pin of
with upsets caused solely by the radiation pulse’s rise and fall
the device during testing,
rates rather than dose rate. Package effects can be minimized
(3) Resolution and accuracy required for the upset response
by adequately decoupling the power supply with appropriate
threshold of individual devices, along with the method used to
high-speed capacitors.
vary the radiation level,
(4) Failure criterion for transient voltage upset, output 6.5 Steps Between Radiation Levels—The size of the steps
current, and power supply current as applicable,
between successive radiation levels limits the accuracy with
(5) Measuring and reporting I , transient output voltage which the dose rate upset threshold is determined. Cost
pp
and transient output current levels,
considerations and ionizing dose damage limit the number of
(6) Functional test to be made after irradiation, radiation levels that can be used to test a given device.
F1262M − 95 (2008)
6.6 Limited Number of State Vectors—Cost, testing time, 7.3.1 Radiation Test Fixture—A test fixture that allows the
and cumulative ionizing radiation usually make it necessary to device to be placed in the radiation beam with convenient
restrict upset testing to a small number of state vectors. These connection to external equipment (pulse generators, power
state vectors must include the most sensitive conditions in supplies, line drivers etc.) is required for testing.
order to avoid misleading results. An analysis is required to
7.3.2 Line Drivers—Line drivers that provide high imped-
select the state vectors used for radiation testing to make sure
ance to the device under test and can drive the low impedance
that circuit and geometrical factors that affect the upset
of terminated output cables with adequate signal fidelity are
response are taken into account.
required. The line drivers must be designed so that their own
response to transient ionizing radiation is much smaller than
7. Apparatus
that of the circuit being measured (see Note 4).
7.1 The equipment and information required for this guide
NOTE 4—Although line drivers are normally not placed in the direct
includes an electrical schematic of the test circuit, a logic
radiation beam, there is always some stray radiation that may affect the
line driver. Furthermore, replacement currents in the wiring that connects
diagram of the device to be tested, a transient radiation
the line driver to the circuit under test may also introduce a spurious
simulation source, dosimetry equipment, and electrical equip-
response.
ment for the measurement of the device response and func-
tional testing. If the alternate topological analysis approach is 7.3.3 General Purpose Test Equipment—Power supplies,
pulse generators, cables and termination resistors that are
to be used, (see 8.2.2) then a photomicrograph or composite
mask drawing of the device is also needed. required to bias the device and establish its internal operating
conditions are needed.
7.2 Radiation Simulation and Dosimetry Apparatus:
7.3.4 Transient Response Measuring Device—An oscillo-
7.2.1 Transient Radiation Source—A pulsed high energy
scope, transient digitizer or similar device shall be used to
electron or bremsstrahlung source that can provide a dose rate
measure the transient response of the device under test. The
in excess of the upset response threshold level of the device
bandwidth and sensitivity of this equipment must be compat-
being tested at the pulse width specified in the test plan is
ible with the pulse width and measurement criteria in the test
needed.Alinear accelerator (LINAC) with electron energies of
plan.
10 to 25 MeV is preferred (see Note 1), although in some
7.3.5 Functional Test System—Asystem that is set up to test
instances a flash X ray with end point energy above 2.0 MeV
the functional operation of the device under test while it is in
may be utilized (see Note 2 and Note 3). It is usually much
the radiation test fixture is required. This may consist of (1)
more difficult to synchronize a flash X-ray pulse with circuit
general purpose equipment such as pulse generators,
operation, which limits the applicability of a flash X ray.
oscilloscopes/transient digitizers, or logic analyzers, (2)a
NOTE 1—Linac radiation pulses are made from a train of discrete
commercial integrated circuit test system, or (3) a custom test
“micropulses” occurring at the linac radio frequency (RF). This high
circuit/fixture. The specific requirements of the functional test
frequencypulsestructurecouldcauseerroneousresultsforhighfrequency
system depend on the specifications and requirements of the
devices under test such as gallium arsenide. This has not yet been directly
observed. device under test and are included in the test plan.
NOTE2—Theabsorptioncoefficientofphotonsinsiliconandpackaging
7.3.6 Temperature Measuring Equipment—A thermometer,
materials is relatively flat at energi
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