ASTM F1995-00(2005)

Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch

SIGNIFICANCE AND USE
The different combinations of SMD types, attachment medias, circuit substrates, plating options, and process variation can account for significant variation in test outcome.
The SMD shear strength test is useful to manufacturers and users for determining the bond strength of the component to the membrane switch circuit.
SCOPE
1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 30-Apr-2005
• ICS: 31.220.20 - Switches
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.18 - Printed Electronics

Relations

• Replaces: ASTM F1995-00 - Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch
• Effective Date: 01-May-2005
• Replaced By: ASTM F1995-12 - Standard Test Method for Determining the Shear Force of a Surface Mount Device (SMD) in a Membrane Switch
• Effective Date: 01-Feb-2012

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F1995–00(Reapproved2005)
Standard Test Method for
Determining the Bond Strength of a Surface Mount Device
(SMD) on a Membrane Switch by Applying Shear Force
This standard is issued under the fixed designation F1995; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 4.1.1 Temperature and humidity, and
4.1.2 Substrate movement during test.
1.1 This test method covers the determination of the shear
integrity of materials and procedures used to attach surface
5. Apparatus
mount devices (SMD) to a membrane switch circuit.
5.1 Device, shall consist of a load-applying instrument with
1.2 This standard does not purport to address all of the
an accuracy of 6 5 % of full scale capable of indicating peak
safety concerns, if any, associated with its use. It is the
hold.
responsibility of the user of this standard to establish appro-
5.2 Mounting Fixture, method to secure specimen to insure
priate safety and health practices and determine the applica-
stability during test.
bility of regulatory limitations prior to use.
5.3 SMD Contact Tool, suitable to apply a uniform distri-
2. Terminology bution of force to an edge of the SMD.
5.4 Magnification Device, suitable to facilitate visual obser-
2.1 Definitions:
vation of the SMD and contact tool interface during testing
2.1.1 membrane switch—A momentary switching device in
(optional).
which at least one contact is on (or made of) a flexible
substrate.
6. Procedure
2.1.2 shear load—A force applied parallel to the mounting
6.1 Pretest Setup:
surface sufficient to shear the SMD from its mounting.
6.1.1 Attach specimen to the test base to minimize move-
2.1.3 SMD—Abbreviation for surface mount device (that is,
ment of the substrate during test. Ensure that no damage occurs
light emitting diode (LED), resistor)
during attachment to the test base that could affect bond
2.1.4 attachment media—A mounting adhesive used for
performance.
electrical or mechanical bonding, or both, of the SMD to the
6.1.2 Thedirectionofappliedforceshallbeparallelwiththe
substrate.
plane of the circuit substrate.
2.1.5 plating—A thin metallic coating (that is, gold, nickel)
6.1.3 TheSMDcontacttoolshallloadagainstanedgeofthe
covering the leads of the SMD or circuit, or both, in the
component, which most closely approximates a 90° angle with
electrical interface area.
the base of the circuit substrate. Contact tool should make
3. Significance and Use contacttoSMDatapointequaltoorlessthan ⁄2thetotalSMD
height, (see Fig. 1).
3.1 The different combinations of SMD types, attachment
6.2 In-Process Test:
medias, circuit substrates, plating options, and process varia-
6.2.1 Bring contact tool into contact with SMD specimen.
tion can account for significant variatio
...