ASTM E1161-09(2014)

Standard Practice for Radiologic Examination of Semiconductors and Electronic Components

SIGNIFICANCE AND USE
4.1 This practice establishes the basic minimum parameters and controls for the application of radiological examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see 9.1).  
4.2 This practice does not set limits on radiation dose, but does list requirements to limit and document radiation dose to devices. When radiation dose limits are an issue, the requestor of radiological examinations must be cognizant of this issue and state any maximum radiation dose limitations that are required in the contractual agreement between the using parties.
SCOPE
1.1 This practice provides the minimum requirements for nondestructive radiologic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items.  
1.2 This practice covers the radiologic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used) or physical damage.  
1.3 The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice.  
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 31-May-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: E07 - Nondestructive Testing
• Drafting Committee: E07.01 - Radiology (X and Gamma) Method

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: E1161 − 09 (Reapproved 2014)
Standard Practice for
Radiologic Examination of Semiconductors and Electronic
Components
This standard is issued under the fixed designation E1161; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope E801Practice for Controlling Quality of Radiological Ex-
amination of Electronic Devices
1.1 This practice provides the minimum requirements for
E666Practice for CalculatingAbsorbed Dose From Gamma
nondestructive radiologic examination of semiconductor
or X Radiation
devices, microelectronic devices, electromagnetic devices,
E999Guide for Controlling the Quality of Industrial Radio-
electronic and electrical devices, and the materials used for
graphic Film Processing
construction of these items.
E1000Guide for Radioscopy
1.2 Thispracticecoverstheradiologicexaminationofthese
E1079Practice for Calibration of Transmission Densitom-
items to detect possible defective conditions within the sealed
eters
case,especiallythoseresultingfromsealingthelidtothecase,
E1254Guide for Storage of Radiographs and Unexposed
and internal defects such as extraneous material (foreign
Industrial Radiographic Films
objects), improper interconnecting wires, voids in the die
E1255Practice for Radioscopy
attach material or in the glass (when sealing glass is used) or
E1316Terminology for Nondestructive Examinations
physical damage.
E1390Specification for Illuminators Used for Viewing In-
1.3 Thevaluesstatedininch-poundunitsaretoberegarded dustrial Radiographs
E1411Practice for Qualification of Radioscopic Systems
asstandard.Nootherunitsofmeasurementareincludedinthis
practice. E1453Guide for Storage of Magnetic Tape Media that
Contains Analog or Digital Radioscopic Data
1.4 This standard does not purport to address all of the
E1475Guide for Data Fields for Computerized Transfer of
safety concerns, if any, associated with its use. It is the
Digital Radiological Examination Data
responsibility of the user of this standard to establish appro-
E1742Practice for Radiographic Examination
priate safety and health practices and determine the applica-
E1815Test Method for Classification of Film Systems for
bility of regulatory limitations prior to use.
Industrial Radiography
2. Referenced Documents
E1817Practice for Controlling Quality of Radiological Ex-
amination by Using Representative Quality Indicators
2.1 ASTM Standards:
(RQIs)
E94Guide for Radiographic Examination
E2339Practice for Digital Imaging and Communication in
E431Guide to Interpretation of Radiographs of Semicon-
Nondestructive Evaluation (DICONDE)
ductors and Related Devices
E2597Practice for Manufacturing Characterization of Digi-
E543Specification forAgencies Performing Nondestructive
tal Detector Arrays
Testing
2.2 ANSI Standards:
ANSI/ESDS20.20ESDAssociationStandardfortheDevel-
This practice is under the jurisdiction of ASTM Committee E07 on Nonde-
opmentofanElectrostaticDischargeControlProgramfor
structive Testing and is the direct responsibility of Subcommittee E07.01 on
Radiology (X and Gamma) Method.
Protection of Electrical and Electronic Parts, Assemblies
CurrenteditionapprovedJune1,2014.PublishedJuly2014.Originallyapproved
and Equipment (Excluding Electrically Initiated Explo-
in 1987. Last previous edition approved in 2009 as E1161–09. DOI: 10.1520/
sive Devices)
E1161-09R14.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on Available fromAmerican National Standards Institute (ANSI), 25 W. 43rd St.,
the ASTM website. 4th Floor, New York, NY 10036, http://www.ansi.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
E1161 − 09 (2014)
2.3 ASNT Standard: components include such items as capacitors, resistors,
ANSI/ASNT CP-189Standard for Qualification and Certifi- switches and relays. This is not an all inclusive list, therefore,
cation of Nondestructive Testing Personnel the term “device” or “devices” will be used throughout this
SNT-TC-1APersonnel Qualification and Certification practice to refer to the items which are the subject of the
2.4 AIA Documents: radiological examination process.
NAS-410Certification and Qualification of Nondestructive
3.2.3 micro-bubbles—A film defect where tiny bubbles in
Test Personnel
the film’s emulsion create white dots on the processed radio-
2.5 Department of Defense (DOD) Documents:
graph. Micro-bubbles are unacceptable when they show up in
MIL-PRF-28861 Performance Specification—General
the area of interest of a device because they can be interpreted
Specification for Filters, Capacitors, Radio Frequency/
as extraneous matter (foreign material).
Electromagnetic Interference Suppression
3.2.4 parallax error effect—Forthepurposeofthispractice,
MIL-STD-202 Test Method Standard Electronic and Elec-
the term “parallax error effect” will refer to a double image on
trical Component Parts
theradiographofthedevice’sinternalfeaturessuchaswiresor
MIL-STD-202, Method 209Radiographic Inspection
ball bonds.This is caused by the device being too far from the
MIL-STD-750 Test Method Standard Test Methods for
central X-ray beam where the angle of the X-rays creates a
Semiconductor Devices
double image on double emulsion film.
MIL-STD-750, Method 2076Radiography
3.2.5 pick-off—An automatic film processing artifact where
MIL-STD-883 Test Method Standard Microcircuits
tiny spots of emulsion are “picked off” of the radiograph as it
MIL-STD-883, Method 2012Radiography
ismovingthroughthedryer.Pick-offartifactsareunacceptable
MIL-STD-981 Design, Manufacturing and Quality Stan-
when they show up in the area of interest of a device because
dards for Custom Electromagnetic Devices for Space
theycanbeinterpretedasextraneousmatter(foreignmaterial).
Applications
2.6 Federal Standard:
3.2.6 pre-cap—Prior to capping or encapsulation.
FED-STD-595Color (Requirements for Individual Color
3.3 Abbreviations:
Chits)
3.3.1 AWG—American Wire Gauge
2.7 NCRP Documents:
3.3.2 CEO—Cognizant Engineering Organization. The
NCRP 116Limitation of Exposure to Ionizing Radiation
company, government agency, or other authority responsible
NCRP 144Radiation Protection for Particle Accelerator
for the design, or end use, of the device(s) for which radio-
Facilities
logical examination is required. This, in addition to design
personnel, may include personnel from electrical engineering,
3. Terminology
material and process engineering, nondestructive testing (usu-
3.1 Definitions—Definitions relating to radiological
ally the certified Radiographic Level 3), or quality groups, as
examination, which appear in Terminology E1316, shall apply
appropriate.
to the terms used in this practice.
3.3.3 DDA—Digital DetectorArray. DDAs are described in
3.2 Abbreviations:
Practice E2597.
3.2.1 controlling documentation —The document or stan-
3.3.4 DPA—Destructive Physical Analysis
dard that is specified by contractual agreement and lists such
items as the examination requirements, number of views, and
3.3.5 ESD—Electrostatic Discharge
acceptance criteria. Controlling documentation may be in the
3.3.6 ESDS—Electrostatic Discharge Sensitive
form of a purchase order, engineering drawing, Military
3.3.7 FDD—Focal spot to Detector Distance
Standard, etc. or a combination thereof.
3.3.8 FFD—Focal spot to Film Distance
3.2.2 device(s)—For the purpose of this practice, the term
3.3.9 FOD—Focal spot to Object Distance (always mea-
“device”and“devices”shallbeusedtodescribemicrocircuits,
sured to the “source side” of the object)
semiconductors, electromagnetic devices, electronic and elec-
trical component parts. Microcircuits include such items as,
3.3.10 PIND—Particle Impact Noise Detection
monolithic, multichip and hybrid microcircuits, microcircuit
3.3.11 RAD—Radiation Absorbed Dose, the dose causing
arrays, and the elements from which these circuits are made.
100 ergs of energy to be absorbed by one gram of matter
Semiconductors include such items as diodes, transistors,
3.3.12 TLD—Thermoluminescence Dosimetry
voltage regulators, rectifiers, tunnel diodes and other related
parts. Electromagnetic devices include such items as
4. Significance and Use
transformers, inductors and coils. Electronic and electrical
4.1 This practice establishes the basic minimum parameters
4 and controls for the application of radiological examination of
AvailablefromAmericanSocietyforNondestructiveTesting(ASNT),P.O.Box
electronicdevices.Factorssuchasdevicehandling,equipment,
28518, 1711 Arlingate Ln., Columbus, OH 43228-0518, http://www.asnt.org.
Available fromAerospace IndustriesAssociation ofAmerica, Inc. (AIA), 1000
ESDS, materials, personnel qualification, procedure and qual-
WilsonBlvd.,Suite1700,Arlington,VA22209-3928,http://www.aia-aerospace.org.
ity requirements, reporting, records and radiation sensitivity
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,
are addressed.This practice is written so it can be specified on
Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://
www.dodssp.daps.mil. the engineering drawing, specification or contract. It is not a
E1161 − 09 (2014)
detailed how-to procedure and must be supplemented by a E1411. Other types of non-film systems operaating procedures
detailed examination technique/procedure (see 9.1). and qualification procedures shall be agreed upon between the
using parties.
4.2 This practice does not set limits on radiation dose, but
6.2.3 X-raysystemsshallbecharacterizedfortheirradiation
does list requirements to limit and document radiation dose to
dose rate using a calibrated dosimeter. The dose rate shall be
devices. When radiation dose limits are an issue, the requestor
identified at distances to be used during examination so safe
of radiological examinations must be cognizant of this issue
limits can be established to ensure devices under examination
and state any maximum radiation dose limitations that are
are not subject to excessive levels of radiation. Dose rate
required in the contractual agreement between the using
characterization shall be performed with and without filters
parties.
(see 6.13) to establish best practices between radiological
quality levels and total dose during examination.All exposure
5. Qualification
information shall be tracked and recorded in the examination
5.1 Personnel Qualification—If specified in the contractual record (see 11.1).
agreement, personnel performing examinations to this practice
6.3 Film Viewers—Viewers used for film interpretations
shall be qualified in accordance with a nationally or interna-
shall meet the following minimum requirements:
tionally recognized NDT personnel qualification practice or
6.3.1 The light source shall have sufficient intensity to
standardsuchasANSI/ANSTCP-189,SNT-TC-1A,NAS-410,
enable viewing of film densities in the area of interest.
orsimilardocumentandcertifiedbytheemployerorcertifying
6.3.2 Film viewers procured to or meeting the requirements
agency, as applicable. The practice or standard used and its
of Guide E1390 are acceptable for use.
applicable revision shall be identified in the contractual agree-
6.3.3 Low intensity film viewers such as fluorescent 14 by
ment between the using parties. When examining devices to
17-in.illuminators,shallbeequippedwithdaylightfluorescent
DOD requirements (see 2.5), NAS-410 shall be the required
bulbs.
standard.
6.3.4 Allfilmviewersshallbetestedforandpostedwiththe
5.2 Qualification of Nondestructive Testing (NDT) maximumreadabledensityinaccordancewithPracticeE1742,
Figure 2 and subsection 6.27.4.
Agencies—When specified in the contractual agreement, Non-
destructiveTestingagenciesshallbequalifiedandevaluatedas 6.3.5 Film viewers shall be kept clean and viewing surfaces
shall be free of scratches or other defects that will interfere
described in Practice E543.
with proper film interpretation.
5.2.1 Safety—The NDT facility shall present no hazards to
the safety of personnel and property. NCRP 144, NCRP 116
6.4 Holding Fixtures—Holding fixtures shall be capable of
may be used as guides to ensure that radiological procedures
holdingspecimensintherequiredpositionswithoutinterfering
are performed so that personnel shall not receive a radiation
with the accuracy or ease of image interpretation. Holding
dose exceeding the maximum safe limits as permitted by city,
fixtures shall not be made of materials that will create
state, or national codes.
undesirable secondary radiation that will reduce image clarity.
Holding fixtures shall be clean of debris that can interfere with
6. Equipment
image interpretation by appearing on the radiograph or radio-
logicalimageandbeconfusedwiththatofanydefect.Holding
6.1 Radiation Source—Only X-ray generating equipment
fixtures shall not cause damage to the devices under examina-
shallbeused.Suchfactorsasfocalspotsize,inherentfiltration,
tion and shall be compliant with any special handling require-
acceleratingvoltageandtubecurrentshallbeconsideredwhen
ments including ESD precautions.
choosing the proper X-ray source. The X-ray source and
exposure parameters shall not cause damage to the device(s)
6.5 Lead-Topped Tables—When performing film
under examination. The suitability of these exposure param-
radiography, a lead-topped table with at least 0.062 in. of lead
eters shall be demonstrated by attainment of the required
shall be used. The lead shall be smooth, and with out any
radiological quality level and compliance with all other re-
gougesorscratchesthatwillcauseundesirableimageartifacts.
quirements stipulated in this practice.
Lead vinyl or lead rubber may be used in lieu of lead. Tape or
6.1.1 Focal Spot—The focal spot size shall be such that the other low density materials used to cover the lead topped table
radiological quality level specified in 10.3 can be achieved. shall not be allowed unless directly related to ESD protection.
6.6 Film Holders—Film holders and cassettes shall be light
6.2 Non-Film Systems—Radioscopy systems designed spe-
tight. They may be flexible vinyl, plastic, or other durable
cificallyfortheexaminationofelectronicdevicesaregenerally
material. Vacuum cassettes are preferred in order to keep the
thealternativetofilmbasedradiography.However,DDAbased
device(s)asclosetothefilmaspossible.Thesuitabilityofany
systems may also
...

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: E1161 − 09 E1161 − 09 (Reapproved 2014)
Standard Practice for
Radiologic Examination of Semiconductors and Electronic
Components
This standard is issued under the fixed designation E1161; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope
1.1 This practice provides the minimum requirements for nondestructive radiologic examination of semiconductor devices,
microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these
items.
1.2 This practice covers the radiologic examination of these items to detect possible defective conditions within the sealed case,
especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects),
improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used) or physical damage.
1.3 The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this
practice.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
2.1 ASTM Standards:
E94 Guide for Radiographic Examination
E431 Guide to Interpretation of Radiographs of Semiconductors and Related Devices
E543 Specification for Agencies Performing Nondestructive Testing
E801 Practice for Controlling Quality of Radiological Examination of Electronic Devices
E666 Practice for Calculating Absorbed Dose From Gamma or X Radiation
E999 Guide for Controlling the Quality of Industrial Radiographic Film Processing
E1000 Guide for Radioscopy
E1079 Practice for Calibration of Transmission Densitometers
E1254 Guide for Storage of Radiographs and Unexposed Industrial Radiographic Films
E1255 Practice for Radioscopy
E1316 Terminology for Nondestructive Examinations
E1390 Specification for Illuminators Used for Viewing Industrial Radiographs
E1411 Practice for Qualification of Radioscopic Systems
E1453 Guide for Storage of Magnetic Tape Media that Contains Analog or Digital Radioscopic Data
E1475 Guide for Data Fields for Computerized Transfer of Digital Radiological Examination Data
E1742 Practice for Radiographic Examination
E1815 Test Method for Classification of Film Systems for Industrial Radiography
E1817 Practice for Controlling Quality of Radiological Examination by Using Representative Quality Indicators (RQIs)
E2339 Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE)
E2597 Practice for Manufacturing Characterization of Digital Detector Arrays
This practice is under the jurisdiction of ASTM Committee E07 on Nondestructive Testing and is the direct responsibility of Subcommittee E07.01 on Radiology (X and
Gamma) Method.
Current edition approved June 1, 2009June 1, 2014. Published July 2009 July 2014. Originally approved in 1987. Last previous edition approved in 20032009 as
E1161 – 03.E1161 – 09. DOI: 10.1520/E1161-09.10.1520/E1161-09R14.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
E1161 − 09 (2014)
2.2 ANSI Standards:
ANSI/ESD S20.20 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for Protection
of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
2.3 ASNT Standard:
ANSI/ASNT CP-189 Standard for Qualification and Certification of Nondestructive Testing Personnel
SNT-TC-1A Personnel Qualification and Certification
2.4 AIA Documents:
NAS-410 Certification and Qualification of Nondestructive Test Personnel
2.5 Department of Defense (DOD) Documents:
MIL-PRF-28861 Performance Specification—General Specification for Filters, Capacitors, Radio Frequency/Electromagnetic
Interference Suppression
MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts
MIL-STD-202, Method 209 Radiographic Inspection
MIL-STD-750 Test Method Standard Test Methods for Semiconductor Devices
MIL-STD-750, Method 2076 Radiography
MIL-STD-883 Test Method Standard Microcircuits
MIL-STD-883, Method 2012 Radiography
MIL-STD-981 Design, Manufacturing and Quality Standards for Custom Electromagnetic Devices for Space Applications
2.6 Federal Standard:
FED-STD-595 Color (Requirements for Individual Color Chits)
2.7 NCRP Documents:
NCRP 116 Limitation of Exposure to Ionizing Radiation
NCRP 144 Radiation Protection for Particle Accelerator Facilities
3. Terminology
3.1 Definitions—Definitions relating to radiological examination, which appear in Terminology E1316, shall apply to the terms
used in this practice.
3.2 Abbreviations:
3.2.1 controlling documentation —The document or standard that is specified by contractual agreement and lists such items as
the examination requirements, number of views, and acceptance criteria. Controlling documentation may be in the form of a
purchase order, engineering drawing, Military Standard, etc. or a combination thereof.
3.2.2 device(s)—For the purpose of this practice, the term “device” and “devices” shall be used to describe microcircuits,
semiconductors, electromagnetic devices, electronic and electrical component parts. Microcircuits include such items as,
monolithic, multichip and hybrid microcircuits, microcircuit arrays, and the elements from which these circuits are made.
Semiconductors include such items as diodes, transistors, voltage regulators, rectifiers, tunnel diodes and other related parts.
Electromagnetic devices include such items as transformers, inductors and coils. Electronic and electrical components include such
items as capacitors, resistors, switches and relays. This is not an all inclusive list, therefore, the term “device” or “devices” will
be used throughout this practice to refer to the items which are the subject of the radiological examination process.
3.2.3 micro-bubbles—A film defect where tiny bubbles in the film’s emulsion create white dots on the processed radiograph.
Micro-bubbles are unacceptable when they show up in the area of interest of a device because they can be interpreted as extraneous
matter (foreign material).
3.2.4 parallax error effect—For the purpose of this practice, the term “parallax error effect” will refer to a double image on the
radiograph of the device’s internal features such as wires or ball bonds. This is caused by the device being too far from the central
X-ray beam where the angle of the X-rays creates a double image on double emulsion film.
3.2.5 pick-off—An automatic film processing artifact where tiny spots of emulsion are “picked off” of the radiograph as it is
moving through the dryer. Pick-off artifacts are unacceptable when they show up in the area of interest of a device because they
can be interpreted as extraneous matter (foreign material).
3.2.6 pre-cap—Prior to capping or encapsulation.
3.3 Abbreviations:
3.3.1 AWG—American Wire Gauge
Available from American National Standards Institute (ANSI), 25 W. 43rd St., 4th Floor, New York, NY 10036, http://www.ansi.org.
Available from American Society for Nondestructive Testing (ASNT), P.O. Box 28518, 1711 Arlingate Ln., Columbus, OH 43228-0518, http://www.asnt.org.
Available from Aerospace Industries Association of America, Inc. (AIA), 1000 Wilson Blvd., Suite 1700, Arlington, VA 22209-3928, http://www.aia-aerospace.org.
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://www.dodssp.daps.mil.
E1161 − 09 (2014)
3.3.2 CEO—Cognizant Engineering Organization. The company, government agency, or other authority responsible for the
design, or end use, of the device(s) for which radiological examination is required. This, in addition to design personnel, may
include personnel from electrical engineering, material and process engineering, nondestructive testing (usually the certified
Radiographic Level 3), or quality groups, as appropriate.
3.3.3 DDA—Digital Detector Array. DDAs are described in Practice E2597.
3.3.4 DPA—Destructive Physical Analysis
3.3.5 ESD—Electrostatic Discharge
3.3.6 ESDS—Electrostatic Discharge Sensitive
3.3.7 FDD—Focal spot to Detector Distance
3.3.8 FFD—Focal spot to Film Distance
3.3.9 FOD—Focal spot to Object Distance (always measured to the “source side” of the object)
3.3.10 PIND—Particle Impact Noise Detection
3.3.11 RAD—Radiation Absorbed Dose, the dose causing 100 ergs of energy to be absorbed by one gram of matter
3.3.12 TLD—Thermoluminescence Dosimetry
4. Significance and Use
4.1 This practice establishes the basic minimum parameters and controls for the application of radiological examination of
electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality
requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the
engineering drawing, specification or contract. It is not a detailed how-to procedure and must be supplemented by a detailed
examination technique/procedure (see 9.1).
4.2 This practice does not set limits on radiation dose, but does list requirements to limit and document radiation dose to devices.
When radiation dose limits are an issue, the requestor of radiological examinations must be cognizant of this issue and state any
maximum radiation dose limitations that are required in the contractual agreement between the using parties.
5. Qualification
5.1 Personnel Qualification—If specified in the contractual agreement, personnel performing examinations to this practice shall
be qualified in accordance with a nationally or internationally recognized NDT personnel qualification practice or standard such
as ANSI/ANST CP-189, SNT-TC-1A, NAS-410, or similar document and certified by the employer or certifying agency, as
applicable. The practice or standard used and its applicable revision shall be identified in the contractual agreement between the
using parties. When examining devices to DOD requirements (see 2.5), NAS-410 shall be the required standard.
5.2 Qualification of Nondestructive Testing (NDT) Agencies—When specified in the contractual agreement, Nondestructive
Testing agencies shall be qualified and evaluated as described in Practice E543.
5.2.1 Safety—The NDT facility shall present no hazards to the safety of personnel and property. NCRP 144, NCRP 116 may
be used as guides to ensure that radiological procedures are performed so that personnel shall not receive a radiation dose
exceeding the maximum safe limits as permitted by city, state, or national codes.
6. Equipment
6.1 Radiation Source—Only X-ray generating equipment shall be used. Such factors as focal spot size, inherent filtration,
accelerating voltage and tube current shall be considered when choosing the proper X-ray source. The X-ray source and exposure
parameters shall not cause damage to the device(s) under examination. The suitability of these exposure parameters shall be
demonstrated by attainment of the required radiological quality level and compliance with all other requirements stipulated in this
practice.
6.1.1 Focal Spot—The focal spot size shall be such that the radiological quality level specified in 10.3 can be achieved.
6.2 Non-Film Systems—Radioscopy systems designed specifically for the examination of electronic devices are generally the
alternative to film based radiography. However, DDA based systems may also be used.
6.2.1 The suitability of any non-film radiological system shall be demonstrated by attainment of the required radiological quality
level and compliance with all other applicable requirements stipulated in this practice.
6.2.2 When specified in the controlling documentation, non-film radioscopy systems shall be operated in accordance with
Practice E1255 and qualified in accordance with Practice E1411. Other types of non-film systems operaating procedures and
qualification procedures shall be agreed upon between the using parties.
6.2.3 X-ray systems shall be characterized for their radiation dose rate using a calibrated dosimeter. The dose rate shall be
identified at distances to be used during examination so safe limits can be established to ensure devices under examination are not
subject to excessive levels of radiation. Dose rate characterization shall be performed with and without filters (see 6.13) to establish
E1161 − 09 (2014)
best practices between radiological quality levels and total dose during examination. All exposure information shall be tracked and
recorded in the examination record (see 11.1).
6.3 Film Viewers—Viewers used for film interpretations shall meet the following minimum requirements:
6.3.1 The light source shall have sufficient intensity to enable viewing of film densities in the area of interest.
6.3.2 Film viewers procured to or meeting the requirements of Guide E1390 are acceptable for use.
6.3.3 Low intensity film viewers such as fluorescent 14 by 17-in. illuminators, shall be equipped with daylight fluorescent bulbs.
6.3.4 All film viewers shall be tested for and posted with the maximum readable density in accordance with Practice E1742,
Figure 2 and subsection 6.27.4.
6.3.5 Film viewers shall be kept clean and viewing surfaces shall be free of scratches or other defects that will interfere with
proper film interpretation.
6.4 Holding Fixtures—Holding fixtures shall be capable of holding specimens in the required positions without interfering with
the accuracy or ease of image interpretation. Holding fixtures shall not be made of materials that will create undesirable secondary
ra
...