Standard Test Methods for Application of Emulsion Floor Polishes to Substrates for Testing Purposes

SCOPE
1.1 These test methods cover procedures for application of emulsion floor polish films to suitable substrates for testing purposes. Five test methods are covered, as outlined in Section 3.  
1.2 These procedures are limited to use on flat, rigid substrates mounted, if necessary, on a nonabsorbent backing.
1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are provided for information only.  
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.>

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Status
Historical
Publication Date
09-Sep-1997
Technical Committee
Drafting Committee
Current Stage
Ref Project

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ASTM D1436-97 - Standard Test Methods for Application of Emulsion Floor Polishes to Substrates for Testing Purposes
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Designation: D 1436 – 97
Standard Test Methods for
Application of Emulsion Floor Polishes to Substrates for
1
Testing Purposes
This standard is issued under the fixed designation D 1436; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.2 Method B. Hand Applicator—This method simulates
use conditions and produces thin films of satisfactory unifor-
1.1 These test methods cover procedures for application of
mity for many test purposes where the area of the test panel is
emulsion floor polish films to suitable substrates for testing
small (304.8 by 304.8 mm (12 by 12 in.) or smaller). With large
purposes. Five test methods are covered, as outlined in Section
panels, considerable local nonuniformity of film thickness may
3.
result.
1.2 These procedures are limited to use on flat, rigid
3.1.3 Method C. Manual Dip Method—This method results
substrates mounted, if necessary, on a nonabsorbent backing.
in wedge-shaped films, of moderate thickness, that are thicker
1.3 The values stated in SI units are to be regarded as the
at the bottom than at the top of the panel. This method is rapid
standard. The values given in parentheses are provided for
and results in reproducible films in the center of the test panel
information only.
which are useful for comparison tests and for tests involving
1.4 This standard does not purport to address all of the
the surface properties of the wax film.
safety concerns, if any, associated with its use. It is the
3.1.4 Method D. Blade Applicator—This method merely
responsibility of the user of this standard to establish appro-
spreads a known volume of emulsion over a known surface
priate safety and health practices and determine the applica-
area. The uniformity of the resulting film depends on the
bility of regulatory limitations prior to use.
flatness of the substrate, the surface tension of the emulsion,
2. Significance and Use
and the interfacial tension between the emulsion and the
substrate. The method is satisfactory for producing thick to
2.1 All five of the test methods described will produce
moderately thin films. Some practice and familiarity with the
polish films from emulsion floor polishes which can be used for
method are necessary to produce uniform thin films.
various performance tests. The choice of test method is left up
3.1.5 Method E. Pour Surface—This method covers pour-
to the individual laboratory.
ing a small amount of polish over a tile held at a 45° angle and
3. Choice of Test Method
allowing it to flow uniformly down the tile and coating it. After
the polish is poured and the bottom bead forms, it is wiped off
3.1 Under actual use conditions, the thickness of the dried
and allowed to dry. The method is satisfactory for producing
film deposited from water emulsion floor polishes ranges from
thick films for slip resistance testing.
0.03 mil to 0.4 mil. No one laboratory method has been found
that will produce uniformly thick films throughout this range
4. Standard Conditions
on all substrates. In many cases, the surface roughness and
4.1 The materials and apparatus shall be permitted to come
porosity of the substrate is of the same order of magnitude as
to equilibrium in an atmosphere having a relative humidity of
the thickness of the deposited films. Therefore, several alter-
50 6 4 % and a temperature of 23.8 6 1.1°C (75 6 2°F).
native methods have been developed. Unless otherwise speci-
4.2 The application of the emulsion floor polish shall be
fied, the choice of method of application and substrate shall be
carried out under the conditions specified in 4.1.
mutually agreed upon by the purchaser and the seller. The
characteristics of the five methods are as follows:
TEST METHOD A. APPLICATION OF EMULSION
3.1.1 Method A. Automatic Dip Coater—This method pro-
FLOOR POLISH BY THE AUTOMATIC DIP COATER
duces thin films of excellent uniformity on the first coat with
substrates of low or moderate porosity. Two- or three-coat
5. Apparatus
applications may produce partial solubility of the earlier coats
5.1 Automatic Dip Coater—The automatic dip coater shall
with consequent loss of uniformity.
consist of a mechanism that will withdraw a panel from a tank
2
of the emulsion at a predetermined rate. A suitable apparatus
1
These test methods are under the jurisdiction of ASTM Committee D-21 on
consists of a constant-speed motor to which a pulley is
Polishes and are the direct responsibility of Subcommittee D21.04 on Performance
Tests.
Current edition approved Sept. 10, 1997. Published June 1998. Originally
2
published as D 1436 – 56 T. Last previous edition D 1436 – 93. On this equipment, the largest spindle is used.
Copyright © ASTM, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, United States.
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