ASTM D2739-97

Standard Test Method for Volume Resistivity of Conductive Adhesives

SCOPE
1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.
1.2 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
1.3 The values stated in either SI or other units shall be regarded separately as standard. SI equivalents to screw threads are shown in the figures.

General Information

• Status: Historical
• Publication Date: 09-Mar-1997
• ICS: 83.180 - Adhesives
• Technical Committee: D14 - Adhesives
• Drafting Committee: D14.80 - Metal Bonding Adhesives

Relations

• Replaced By: ASTM D2739-97(2004) - Standard Test Method for Volume Resistivity of Conductive Adhesives
• Effective Date: 01-Apr-2004

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D 2739 – 97
Standard Test Method for
Volume Resistivity of Conductive Adhesives
This standard is issued under the fixed designation D 2739; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.2 resistivity, volume, n—the ratio of the electric poten-
tial gradient to the current density when the gradient is parallel
1.1 This test method covers the determination of the volume
to the current in the material. D 1566, D-11
resistivity of resin-based conductive adhesives in the cured
condition. The test is made on a thin adhesive layer as prepared
4. Summary of Test Method
in a bonded specimen. This test method is used for conductive
4.1 The volume resistivity of adhesive layers cured between
adhesives that are cured either at room temperature or at
metal adherends is measured on a resistance bridge. Tensile
elevated temperatures.
adhesion plugs (Fig. 1) are described in this test method. Any
1.2 This standard does not purport to address the safety
other test specimens and materials can be used as long as
concerns, if any, associated with its use. It is the responsibility
similar precautions (see Section 7) are observed regarding
of the user of this standard to establish appropriate safety and
preparation and tolerances.
health practices and determine the applicability of regulatory
limitations prior to use.
5. Significance and Use
1.3 The values stated in either SI or other units shall be
5.1 Accurate measurement of the volume resistivity of
regarded separately as standard. SI equivalents to screw
conductive adhesives is important, particularly with respect to
threads are shown in the figures.
applications in electronic packaging techniques. This method
2. Referenced Documents measures the resistance of conductive adhesives used in thin
films as part of a bonded assembly. This does not imply that the
2.1 ASTM Standards:
measured results are applicable to different configurations with
D 618 Practice for Conditioning Plastics and Electrical
2 different metals. This method may be used for acceptance
Insulating Materials for Testing
testing and for screening materials.
D 907 Terminology of Adhesives
2.2 Federal Specification:
6. Apparatus
QQ-B-626 Composition 22
6.1 Kelvin (Resistance) Bridge, calibrated to 1 % accuracy.
3. Terminology 6.2 With the agreement of the interested parties, any metal
tensile adhesion plugs (Fig. 1) can be used to prepare the
3.1 Definitions—Many terms in this test method are defined
tensile adhesion specimens.
in Terminology D 907.
3.1.1 conductivity, n—the ratio of the current density car-
NOTE 1—Different metals will inherently provide different resistance
ried through a specimen to the potential gradient paralleling the values. The measured resistance is dependent on resistance at the
adhesive-adherend interface due to metal oxide formation. The extent of
current. This is numerically equal to the conductance between
oxide formation varies with locality and laboratory conditions. Brass,
opposite faces of a unit cube of liquid. It is the reciprocal of
conforming to Federal Specification QQ-B-626 Composition 22, is a
resistivity. D 2864, D-27
convenient metal. However, in order to minimize oxide formation,
especially where measurements are critical, as in referee measurements, it
is recommended that the metal plugs be plated with either gold or silver
This test method is under the jurisdiction of ASTM Committee D-14 on
to a thickness of not less than 1 μm (0.000040 in.). Any size plug up to 30
Adhesives and is the direct responsibility of Subcommittee D14.80 on Metal
Bonding Adhesives.
Current edition approved March 10, 1997. Published April 1998. Originally
published as D 2739 – 68 T. Last previous edition D 2739 – 90(1995). Plugs to accommodate banana plug—No. 192, Herman H. Smith, Inc., or
Annual Book of ASTM Standards, Vol 08.01. equivalent.
3 6
Annual Book of ASTM Standards, Vol 15.06. Satisfactory resistance bridges are made by: Leads and Northup Co. Bridge
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700 Catalog No. 4306, Minneapolis Honeywell Division Catalog No. 1622, and Biddle
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. Instruments Catalog No. 603282.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
D2739–97
FIG. 1 Brass Tensile Adhesion Specimens with Electrical Connections
mm in diameter can be used with the aid of an alignment jig.
remaining shims, screws, or devices of this nature, so that the
adhesive layer cools in an unrestrained condition.
7. Test Specimen
9. Conditioning
7.1 Thoroughly abrade the face of the specimen to be
bonded (other than gold- or silver-plated) with crocus cloth
9.1 Condition the cured test specimens at 23 6 1°C (73.4 6
452 or equivalent, and wipe with clean solvent, such as
1.8°F) and 50 6 5 % relative humidity for at least 88 h prior to
reagent-grade methyl ethyl ket
...