ASTM F1995-13(2021)

Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch (Withdrawn 2023)

SIGNIFICANCE AND USE
3.1 The different combinations of SMD types, attachment medias, circuit substrates, plating options, and process variation can account for significant variation in test outcome.  
3.2 The SMD shear strength test is useful to manufacturers and users for determining the bond strength of the component to the membrane switch circuit.
SCOPE
1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.  
1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both. In general, this test method should be used prior to encapsulant. This test may also be used to demonstrate the Shear Force with encapsulation.  
1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
WITHDRAWN RATIONALE
This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.
Formerly under the jurisdiction of Committee F01 on Electronics, this test method was withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.

General Information

• Status: Withdrawn
• Publication Date: 28-Feb-2021
• Withdrawal Date: 28-Nov-2023
• ICS: 31.220.20 - Switches
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.18 - Printed Electronics

Standards Content (Sample)

This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: F1995 − 13 (Reapproved 2021)
Standard Test Method for
Determining the Shear Strength of the Bond between a
Surface Mount Device (SMD) and Substrate in a Membrane
Switch
This standard is issued under the fixed designation F1995; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2.1.3 plating—a thin metallic coating (that is, gold, nickel)
covering the leads of the SMD or circuit, or both, in the
1.1 This test method covers the determination of the shear
electrical interface area.
integrity of materials and procedures used to attach surface
2.1.4 shear load—a force applied parallel to the mounting
mount devices (SMD) to a membrane switch circuit.
surface sufficient to shear the SMD from its mounting.
1.2 This test method is typically used to indicate the
2.1.5 SMD—abbreviation for surface mount device (for
sufficient cure of conductive adhesive or underfill, or both. In
example, light emitting diode (LED), resistor).
general, this test method should be used prior to encapsulant.
This test may also be used to demonstrate the Shear Force with
3. Significance and Use
encapsulation.
3.1 The different combinations of SMD types, attachment
1.3 The values stated in SI units are to be regarded as
medias, circuit substrates, plating options, and process varia-
standard. No other units of measurement are included in this
tion can account for significant variation in test outcome.
standard.
3.2 The SMD shear strength test is useful to manufacturers
1.4 This standard does not purport to address all of the
and users for determining the bond strength of the component
safety concerns, if any, associated with its use. It is the
to the membrane switch circuit.
responsibility of the user of this standard to establish appro-
4. Interferences
priate safety, health, and environmental practices and deter-
mine the applicability of regulatory limitations prior to use.
4.1 The following parameters may affect the results of this
1.5 This international standard was developed in accor-
test:
dance with internationally recognized principles on standard-
4.1.1 Temperature and humidity, and
ization established in the Decision on Principles for the
4.1.2 Substrate movement during test.
Development of International Standards, Guides and Recom-
5. Apparatus
mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
5.1 Device, shall consist of a load-applying instrument with
an accuracy of 65 % of full scale capable of indicating peak
2. Terminology
hold.
2.1 Definitions: 5.2 Mounting Fixture, method to secure specimen to insure
2.1.1 attachment media—a mounting adhesive used for stability during test.
electrical or mechanical bonding, or both, of the SMD to the
5.3 SMD Contact Tool, suitable to apply a uniform distri-
substrate.
bution of force to an edge of the SMD.
2.1.2 membrane switch—a momentary switching device in
5.4 Magnification Device, suitable to facilitate visual obser-
which at least one contact is on (or made of) a flexible
vation of the SMD and contact tool interface during testing
substrate.
(optional).
6. Procedure
6.1 Pretest Setup:
This test method is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.18 on Printed
...

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F1995 − 13 (Reapproved 2021)
Standard Test Method for
Determining the Shear Strength of the Bond between a
Surface Mount Device (SMD) and Substrate in a Membrane
Switch
This standard is issued under the fixed designation F1995; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2.1.3 plating—a thin metallic coating (that is, gold, nickel)
covering the leads of the SMD or circuit, or both, in the
1.1 This test method covers the determination of the shear
electrical interface area.
integrity of materials and procedures used to attach surface
2.1.4 shear load—a force applied parallel to the mounting
mount devices (SMD) to a membrane switch circuit.
surface sufficient to shear the SMD from its mounting.
1.2 This test method is typically used to indicate the
2.1.5 SMD—abbreviation for surface mount device (for
sufficient cure of conductive adhesive or underfill, or both. In
example, light emitting diode (LED), resistor).
general, this test method should be used prior to encapsulant.
This test may also be used to demonstrate the Shear Force with
3. Significance and Use
encapsulation.
3.1 The different combinations of SMD types, attachment
1.3 The values stated in SI units are to be regarded as
medias, circuit substrates, plating options, and process varia-
standard. No other units of measurement are included in this
tion can account for significant variation in test outcome.
standard.
3.2 The SMD shear strength test is useful to manufacturers
1.4 This standard does not purport to address all of the
and users for determining the bond strength of the component
safety concerns, if any, associated with its use. It is the
to the membrane switch circuit.
responsibility of the user of this standard to establish appro-
4. Interferences
priate safety, health, and environmental practices and deter-
mine the applicability of regulatory limitations prior to use.
4.1 The following parameters may affect the results of this
1.5 This international standard was developed in accor-
test:
dance with internationally recognized principles on standard-
4.1.1 Temperature and humidity, and
ization established in the Decision on Principles for the
4.1.2 Substrate movement during test.
Development of International Standards, Guides and Recom-
5. Apparatus
mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
5.1 Device, shall consist of a load-applying instrument with
an accuracy of 65 % of full scale capable of indicating peak
2. Terminology hold.
2.1 Definitions:
5.2 Mounting Fixture, method to secure specimen to insure
2.1.1 attachment media—a mounting adhesive used for stability during test.
electrical or mechanical bonding, or both, of the SMD to the
5.3 SMD Contact Tool, suitable to apply a uniform distri-
substrate.
bution of force to an edge of the SMD.
2.1.2 membrane switch—a momentary switching device in
5.4 Magnification Device, suitable to facilitate visual obser-
which at least one contact is on (or made of) a flexible
vation of the SMD and contact tool interface during testing
substrate.
(optional).
6. Procedure
6.1 Pretest Setup:
This test method is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.18 on Printed
6.1.1 Attach specimen to the test base to minimize move-
Electronics.
ment of the substrate during te
...