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ASTM F239-81(1987)

(Specification)

Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)

Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)

General Information

Status
Withdrawn
Withdrawal Date
14-May-1991
ICS
31.020 - Electronic components in general
Technical Committee
F01 - Electronics
Drafting Committee
F01.03 - Metallic Materials, Wire Bonding, and Flip Chip
Current Stage
Ref Project

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ASTM F239-81(1987) - Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)ASTM F239-81(1987) - Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)
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ASTM F239-81(1987) - Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)
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Standards Content (Sample)

~ ~~
= 9009276 0038225 221
Designation: F 239 - 81 (Reapproved 1987)
ab
Standard Specification for
NICKEL ALLOY CATHODE SLEEVES FOR ELECTRON
DEVICES’
This standard is issued under the fixed designation F 239: the number immediately following the designation indicates the year of
original adoption or. in the case of revision, the year of last revision. A number in parenthaes indicates the year of last reapproval.
A superscript epsilon (e) indicates an editorial change sina the last revision or reapproval.
1. scope
3.1.6 Bead diameter,
3.1.7 Bead location, and
1.1 This specification covers nickel alloy
3.1.8 Number of cathode sleeves required.
cathode sleeves, seamless, welded-and-drawn,
lockseam, or lapseam, for use as indirectly
4. hlateriaìsandManufacîure
heated oxide-coated cathodes in electron de-
4. i The cathode sleeves shall be of such quai-
vices.
ity, purity, and surface cleanness (Section 10)
1.2 The values sîated in inch-pound units are
that the finished product shali have the properties
to be regarded as the standard. The values in
and characteristics prescribed in this dca-
parentheses are for information only.
tion.
2. Referenced Documents
4.2 The cathode sleeves shali be manufac-
tured by hot working and cold drawing or cold
2.1 ASTM Standards:
roliing, welding and drawing, or seaming as
E39 Methods for Chemical Analysis of
may be required.
Nickel*
E 107 Methods for Chemical Analysis ofElec-
5. Chemicai Composition
tronic Nickel2
5.1 Chemical Composition-The cathode
E 129 Method for Spectrographic Analysis of
sleeves shall conform to the requirements as to
Thermionic Nickel Alloys by the Powder
chemical composition for the particular grade
Techniques3
ordered, as prescribed in Table 1.
E 383 Method for X-Ray Emission Spectro-
5.2 Cert@cation-The manufacturer of the
metric Determination of Tungsten in
cathode sleeves shall, upon request, furnish a
Nickel-Tungsten Alloys4
certified analysis covering the elements, except
F I28 Methods of Testing Sleeves and Tubing
carbon, listed in Table 1 for the particular grade
for Electron Tube Cathodes)
specified. The carbon content will vary slightly
3. ordering information
from lot to lot of a heat and for different
3.1 Orders for cathode sleeves furnished to
thicknesses of cathode sleeves. The certificate
this specification shall include the following
shail state whether the carbon content is within
information, ali dimensions being expressed in
the limits prescribed for the particular grade
inches and decimal parts with metric equiva-
specified.
lents:
3.1.1 Method of fabrication,
’ This specification is under the jurisdiaion of ASTM Com-
3.1.2 Alloy grade (Table i), mim F-1 on Electronics, and U the direct responsibility of
Subcommittee Foi .O3 on Metallic Materials.
3.1.3 Diameter (either outside diameter or
Current edition approved May 29, 1981. Publied August
inside diameter),
l98i.Onginallypublishedin 1949asB239; rodesignatedF239
in 1955. Last previous edition F 239 - 68.
3.1.4 Wali thickness,
Annual Book ofASTM Standard& Vol 03.05.
3.1.5 Length (expressed in inches and di-
’Annual Book ofASTM Standards. Vol 10.04.
metres), ‘Annual Book ofASTM Standards, Vol 03.06.
356

---------------------- Page: 1 ----------------------
-
~-
~
m 900927b 0038226 Lb8 m
F 239
5.3 Chemical Analyses-A chemical analysis 1.6 Integral Tabs-The basic sizes and tol-
emces for integral tabs are as shown in Table
shall be made for each heat of cathode nickel.
The chemical composition thus determined 6. Special requirements shall be as agreed upon
shali be reported to the purchaser or his rep- between the manufacturer and the purchaser.
7.7 St@ne*The minimum cold collapse
resentative and SU conform to the require-
strength of round seamless and lockseam
ments prescribed in Table 1 for the designated
grade. in the event of disagreement, chemical sleeves, measured in grams of collapsing load
analysis shall be performed in accordance with for a designated span, shall be in accordance
one of the following methods: with the values listed in Table 7.
5.3.1 Methods E 39,
NOn-It is intended that limits for minimum
5.3.2 Methods E 107, collapse strength will be developed.
5.3.3 Method E 129,
7.8 Sem-The seam dimensions shall be in
5.3.4 Method E 383, or
accordance with the values listed in Table 8.
5.3.5 X-ray fluorescent or emission heat
analyses using standards analyzed by Methods
8. NumberofTests
1, 2, or 3.
8.1 When a stiffness test is required, the
number of samples tested shall be as agreed
ó. Heat Approval (sermless or Welded-and-
upon between the manufacturer and the pur-
Dram Cathode Sleeves)
chaser.
6.1 When requested by the purchaser, and
9. Test Methods
agreed to by the manufacturer the litter shall
advise the purchaser each time a new heat is
9.1 The dimensions and physical properties
available. The purchaser shall then advise lhe
prescribed in this
...

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For semiconductors other than silicon and gallium arsenide, this guide provides a method that can improve consistency in the measurements and assurance that data from various facilities can be compared on the same equivalence fluence scale when the applicable validated 1-MeV damage functions are codified in National standards. In the absence of a validated 1-MeV damage function, the non-ionizing energy loss (NIEL) as a function incident neutron energy, normalized to the NIEL at 1 MeV, may be used as an approximation. See Practice E 722 for a description of the method.
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1.1 This guide strictly applies only to the exposure of unbiased silicon (SI) or gallium arsenide (GaAs) semiconductor components (integrated circuits, transistors, and diodes) to neutron radiation from a nuclear reactor source to determine the permanent damage in the components. Validated 1-MeV damage functions codified in National Standards are not currently available for other semiconductor materials.
1.2 Elements of this guide with the deviations noted may also be applicable to the exposure of semiconductors comprised of other materials except that validated 1-MeV damage functions codified in National standards are not currently available.
1.3 Only the conditions of exposure are addressed in this guide. The effects of radiation on the test sample should be determined using appropriate electrical test methods.
1.4 This guide addresses those issues and concerns pertaining to irradiations with reactor spectrum neutrons.
1.5 System and subsystem exposures and test methods are not included in this guide.
1.6 This guide is applicable to irradiations conducted with the reactor operating in either the pulsed or steady-state mode. The range of interest for neutron fluence in displacement damage semiconductor testing range from approximately 109  to 1016  n/cm 2.
1.7 This guide does not address neutron-induced single or multiple neutron event effects or transient annealing.
1.8 This guide provides an alternative to Test Method 1017.3, Neutron Displacement Testing, a component of MIL-STD-883 and MIL-STD-750. The Department of Defense has restricted use of these MIL-STDs to programs existing in 1995 and earlier.
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1.2 System and subsystem exposures and test methods are not included in this practice.
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1.4 This practice addresses those issues and concerns pertaining to irradiations with neutrons of energies greater than 10 keV.
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