ASTM F487-88(2006)

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding

ABSTRACT
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
SCOPE
1.1 This specification covers aluminum-1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

General Information

• Status: Historical
• Publication Date: 31-Dec-2005
• ICS: 29.060.10 - Wires
• Technical Committee: F01 - Electronics

Relations

• Replaces: ASTM F487-88(2001) - Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
• Effective Date: 01-Jan-2006
• Replaced By: ASTM F487-13 - Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
• Effective Date: 01-Jan-2013

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F487 −88(Reapproved2006)
Standard Specification for
Fine Aluminum–1% Silicon Wire for Semiconductor Lead-
1
Bonding
ThisstandardisissuedunderthefixeddesignationF487;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.2 Size (see Section 5),
3.1.3 Breaking load and elongation (see Section 4),
1.1 This specification covers aluminum–1 % silicon alloy
3.1.4 Packaging and marking (see Section 11), and
wire for internal connections in semiconductor devices and is
3.1.5 Special requirements, such as for certificate of com-
limited to wire of diameter up to and including 0.0020 in.
pliance (see Section 10).
(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),
the specifications are to be agreed upon between the purchaser
4. Physical Requirements
and the supplier.
4.1 Elongation and breaking-load ranges for the wire shall
1.2 The values stated in inch-pound units are to be regarded
be specified by the purchaser. The maximum ranges of these
as the standard. The values given in parentheses are for
mechanical properties are listed in Table 1.
information only.
4.2 Mechanical property requirements in ranges smaller
2. Referenced Documents
than those listed in Table 1 may be specified upon agreement
2
between the purchaser and the supplier.
2.1 ASTM Standards:
F16 Test Methods for Measuring Diameter or Thickness of
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
Wire and Ribbon for Electronic Devices and Lamps
mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to alter the properties of hard wire by
F72 Specification for Gold Wire for Semiconductor Lead
varying the manufacturing parameters and procedures. For these reasons,
Bonding
no distinction is made between the two types of wire in this specification.
F205 Test Method for Measuring Diameter of Fine Wire by
Weighing
5. Dimensions, Weights, and Permissible Variations
F219 Test Methods of Testing Fine Round and Flat Wire for
5.1 Wiresizeshallbeexpressedintermsofwirediameterin
Electron Devices and Lamps
decimal fractions of an inch (or millimetre) or in weight per
F584 Practice for Visual Inspection of Semiconductor Lead-
unit length. Tolerances for various size ranges are specified in
Bonding Wire
3
Table 2.
2.2 Military Standard:
MIL-STD-105 Sampling Procedures and Tables for Inspec-
5.2 When wire size is expressed in terms of weight, the
tion by Attributes
following values shall be used:
3
5.2.1 Density of Aluminum–1% Silicon—2.7 g/cm .
3. Ordering Information
5.2.2 Weight of a 200-mm Length of Wire 0.0254 mm in
3.1 Orders for material under this specification shall include
Diameter—0.274 mg.
the following information:
3.1.1 Quantity, 6. Surface Finish
6.1 The wire surface shall be clean and free of finger oils,
1
lubricant residues, stains, and particulate matter.
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.07 on Wire
6.2 Mechanical damage to the wire surface, such as nicks,
Bonding, Flip Chip, and Tape Automated Bonding.
scratches, and kinks, shall be held to a minimum.
Current edition approved Jan. 1, 2006. Published January 2006. Originally
approved in 1977. Last previous edition approved in 2001 as F487 – 88 (2001).
6.3 The inspection shall be carried out under conditions
DOI: 10.1520/F0487-88R06.
2
prescribed in Practice F584 unless some other inspection
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
method is agreed upon between the purchaser and the supplier.
Standards volume information, refer to the standard’s Document Summary page on
The nature and extent of defects permitted to be present on the
the ASTM website.
3
surface of the wire shall be agreed upon between the purchaser
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. and the supplier.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F487−88(2006)
TABLE 1 Elongation and Breaking Load of Aluminum–1% Silicon
9.2.3 Measure the diameter by optical means agreed upon
Alloy Wire
between the purchaser and the supplier.
NOTE 1—Select the desired nominal breaking load and elongation for
NOTE 2—Optical methods for measuring wire diameter are under
the wire by specifying a range of mechanical properties that includes the
development by Committee F-1
...