ASTM F487-13(2018)

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

ABSTRACT
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
SCOPE
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.  
1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.  
1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
WITHDRAWN RATIONALE
This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in December 2023. This standard is being withdrawn without replacement because the committee has been disbanded.

General Information

• Status: Withdrawn
• Publication Date: 28-Feb-2018
• Withdrawal Date: 03-Jan-2024
• ICS: 29.060.10 - Wires
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.03 - Metallic Materials, Wire Bonding, and Flip Chip

Relations

• Replaces: ASTM F487-13 - Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
• Effective Date: 01-Mar-2018
• Refers: ASTM F219-96(2018) - Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023)
• Effective Date: 01-Mar-2018
• Refers: ASTM F219-96(2013) - Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
• Effective Date: 01-May-2013
• Refers: ASTM F16-12 - Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
• Effective Date: 01-Feb-2012
• Refers: ASTM F219-96(2009) - Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
• Effective Date: 01-May-2009
• Refers: ASTM F16-67(2006) - Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
• Effective Date: 01-Feb-2006
• Refers: ASTM F16-67(2000) - Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
• Effective Date: 01-Jan-2000
• Refers: ASTM F219-96(2002) - Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
• Effective Date: 10-Dec-1996

Standards Content (Sample)

This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation:F487 −13 (Reapproved 2018)
Standard Specification for
Fine Aluminum–1% Silicon Wire for Semiconductor Lead-
Bonding
ThisstandardisissuedunderthefixeddesignationF487;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.1 Quantity,
3.1.2 Size (see Section 5),
1.1 This specification covers aluminum–1 % silicon alloy
3.1.3 Breaking load and elongation (see Section 4),
wire for internal connections in semiconductor devices and is
3.1.4 Packaging and marking (see Section 11), and
limited to wire of diameter up to and including 76 µm (0.003
3.1.5 Special requirements, such as for certificate of com-
in.). For diameters larger than 76 µm (0.003 in.), the specifi-
pliance (see Section 10).
cations are to be agreed upon between the purchaser and the
supplier.
4. Physical Requirements
1.2 The values stated in SI units are to be regarded as the
4.1 Elongation and breaking-load ranges for the wire shall
standard, regardless of whether they appear first or second in a
table. Values given in parentheses are for information only. be specified by the purchaser. The maximum ranges of these
mechanical properties are listed in Table 1.
1.3 This international standard was developed in accor-
dance with internationally recognized principles on standard-
4.2 Mechanical property requirements in ranges smaller
ization established in the Decision on Principles for the
than those listed in Table 1 may be specified upon agreement
Development of International Standards, Guides and Recom-
between the purchaser and the supplier.
mendations issued by the World Trade Organization Technical
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
Barriers to Trade (TBT) Committee.
mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to alter the properties of hard wire by
2. Referenced Documents
varying the manufacturing parameters and procedures. For these reasons,
2 no distinction is made between the two types of wire in this specification.
2.1 ASTM Standards:
F16 Test Methods for Measuring Diameter or Thickness of
5. Dimensions, Weights, and Permissible Variations
Wire and Ribbon for Electronic Devices and Lamps
F219 Test Methods of Testing Fine Round and Flat Wire for
5.1 Wiresizeshallbeexpressedintermsofwirediameterin
Electron Devices and Lamps decimal fractions of millimetres (inches). Tolerances for vari-
ous size ranges are specified in Table 2.
2.2 Military Standard:
MIL-STD-105 Sampling Procedures and Tables for Inspec-
5.2 When wire size is expressed in terms of weight, the
tion by Attributes
following values shall be used:
5.2.1 Density of Aluminum–1% Silicon—2.7 g/cm .
3. Ordering Information
5.2.2 Weight of a 200-mm Length of Wire 25.4 µm in
3.1 Orders for material under this specification shall include
Diameter—0.274 mg.
the following information:
6. Surface Finish
1 6.1 The wire surface shall be clean and free of finger oils,
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic
lubricant residues, stains, and particulate matter.
Materials, Wire Bonding, and Flip Chip.
6.2 Mechanical damage to the wire surface, such as nicks,
Current edition approved March 1, 2018. Published April 2018. Originally
approved in 1977. Last previous edition approved in 2013 as F487 – 13. DOI:
scratches, and kinks, shall be held to a minimum.
10.1520/F0487-13R18.
6.3 Theinspectionshallbecarriedoutbyelectronic,optical,
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
or other inspection method is agreed upon between the
Standards volume information, refer to the standard’s Document Summary page on
purchaser and the supplier. The nature and extent of defects
the ASTM website.
permitted to be present on the surface of the wire shall be
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. agreed upon between the purchaser and the supplier.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F487−13 (2018)
TABLE 1 Typical Elongation and Breaking Load of
9.2.2 Measure the diameter by optical means agreed upon
Aluminum–1% Silicon Alloy Wire
between the purchaser and the supplier.
NOTE 1—Select the desired nominal breaking load and elongation for
NOTE 2—Optical methods for measuring wire diameter are under
the wire by specifying a range of mechanical properties that includes the
development by Committee F-1 on Electronics.
A
desired values.
9.3 Chemical Analysis—Verify that the chemical require-
Breaking Load, g Elongation, %
Nominal Diameter,
ments are satisfied by means of spectrographic analysis or
Max Max
in. (mm)
Min Max Min Max
B C
Range Range other means agreed upon between the purchaser and the
0.0007 (0.018) 3 12 2 0.5 3.0 2.0
supplier.
0.0010 (0.025) 12 22 3 0.5 4.0 2.5
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
10. Certification
0.00125 (0.032) 15 32 3 0.5 4.0 3.0
0.0015 (0.038) 20 50 4 0.5 4.0 3.0
10.1 When agreed upon in writing by the purchaser and the
0.0020 (0.051) 32 90 6 1.0 4.0 3.0
supplier,acertificationshallbemadethebasisofacceptanceof
A
Example: Wire of 25-µm (0.001-in.) diameter with a breaking load of 16 g and an
the material. This shall consist of a copy of the manufacturer’s
elongation of 2.0 % is desired. Specify a breaking-load range of 14 to 18 g (16 ±
test report or a statement by the supplier, accompanied by a
2 g) and an elongation range of 1.0 to 3.5 % (
...

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F487 − 13 (Reapproved 2018)
Standard Specification for
Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-
Bonding
This standard is issued under the fixed designation F487; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.1 Quantity,
3.1.2 Size (see Section 5),
1.1 This specification covers aluminum–1 % silicon alloy
3.1.3 Breaking load and elongation (see Section 4),
wire for internal connections in semiconductor devices and is
3.1.4 Packaging and marking (see Section 11), and
limited to wire of diameter up to and including 76 µm (0.003
3.1.5 Special requirements, such as for certificate of com-
in.). For diameters larger than 76 µm (0.003 in.), the specifi-
pliance (see Section 10).
cations are to be agreed upon between the purchaser and the
supplier.
4. Physical Requirements
1.2 The values stated in SI units are to be regarded as the
standard, regardless of whether they appear first or second in a 4.1 Elongation and breaking-load ranges for the wire shall
be specified by the purchaser. The maximum ranges of these
table. Values given in parentheses are for information only.
mechanical properties are listed in Table 1.
1.3 This international standard was developed in accor-
dance with internationally recognized principles on standard-
4.2 Mechanical property requirements in ranges smaller
ization established in the Decision on Principles for the
than those listed in Table 1 may be specified upon agreement
Development of International Standards, Guides and Recom-
between the purchaser and the supplier.
mendations issued by the World Trade Organization Technical
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
Barriers to Trade (TBT) Committee.
mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to alter the properties of hard wire by
2. Referenced Documents
varying the manufacturing parameters and procedures. For these reasons,
no distinction is made between the two types of wire in this specification.
2.1 ASTM Standards:
F16 Test Methods for Measuring Diameter or Thickness of
5. Dimensions, Weights, and Permissible Variations
Wire and Ribbon for Electronic Devices and Lamps
F219 Test Methods of Testing Fine Round and Flat Wire for 5.1 Wire size shall be expressed in terms of wire diameter in
Electron Devices and Lamps
decimal fractions of millimetres (inches). Tolerances for vari-
ous size ranges are specified in Table 2.
2.2 Military Standard:
MIL-STD-105 Sampling Procedures and Tables for Inspec-
5.2 When wire size is expressed in terms of weight, the
tion by Attributes
following values shall be used:
5.2.1 Density of Aluminum–1 % Silicon—2.7 g/cm .
3. Ordering Information
5.2.2 Weight of a 200-mm Length of Wire 25.4 µm in
3.1 Orders for material under this specification shall include
Diameter—0.274 mg.
the following information:
6. Surface Finish
6.1 The wire surface shall be clean and free of finger oils,
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic lubricant residues, stains, and particulate matter.
Materials, Wire Bonding, and Flip Chip.
6.2 Mechanical damage to the wire surface, such as nicks,
Current edition approved March 1, 2018. Published April 2018. Originally
approved in 1977. Last previous edition approved in 2013 as F487 – 13. DOI:
scratches, and kinks, shall be held to a minimum.
10.1520/F0487-13R18.
6.3 The inspection shall be carried out by electronic, optical,
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
or other inspection method is agreed upon between the
Standards volume information, refer to the standard’s Document Summary page on
purchaser and the supplier. The nature and extent of defects
the ASTM website.
3 permitted to be present on the surface of the wire shall be
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. agreed upon between the purchaser and the supplier.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F487 − 13 (2018)
TABLE 1 Typical Elongation and Breaking Load of
9.2.2 Measure the diameter by optical means agreed upon
Aluminum–1 % Silicon Alloy Wire
between the purchaser and the supplier.
NOTE 1—Select the desired nominal breaking load and elongation for
NOTE 2—Optical methods for measuring wire diameter are under
the wire by specifying a range of mechanical properties that includes the
development by Committee F-1 on Electronics.
A
desired values.
9.3 Chemical Analysis—Verify that the chemical require-
Breaking Load, g Elongation, %
Nominal Diameter,
ments are satisfied by means of spectrographic analysis or
Max Max
in. (mm)
Min Max Min Max
B C
Range Range
other means agreed upon between the purchaser and the
0.0007 (0.018) 3 12 2 0.5 3.0 2.0 supplier.
0.0010 (0.025) 12 22 3 0.5 4.0 2.5
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
10. Certification
0.00125 (0.032) 15 32 3 0.5 4.0 3.0
0.0015 (0.038) 20 50 4 0.5 4.0 3.0
10.1 When agreed upon in writing by the purchaser and the
0.0020 (0.051) 32 90 6 1.0 4.0 3.0
supplier, a certification shall be made the basis of acceptance of
A
Example: Wire of 25-µm (0.001-in.) diameter with a breaking load of 16 g and an
the material. This shall consist of a copy of the manufacturer’s
elongation of 2.0 % is desired. Specify a breaking-load range of 14 to 18 g (16 ±
test report or a statement by the supplier, accompanied by a
2 g) and an elongation range of 1.0 to 3.5 % (2.0 + 1.5 %, 2.0 − 1.0 %). (Note—
Smaller ranges are acceptable;
...