ASTM F1689-05(2012)
(Test Method)Standard Test Method for Determining the Insulation Resistance of a Membrane Switch
Standard Test Method for Determining the Insulation Resistance of a Membrane Switch
SIGNIFICANCE AND USE
Insulation resistance is useful for design verification, quality control of materials, and workmanship.
Low insulation resistance can cause high leakage currents.
High leakage currents can lead to deterioration of the insulation or false triggering of the associated input device, or both.
Specific areas of testing are, but not limited to:
Conductor/dielectric/conductor crossing point.
Close proximity of conductors, and
Any other conductive surface such as shielding or metal backing panel.
Insulation resistance measurement may be destructive and units that have been tested should be considered unreliable for future use.
SCOPE
1.1 This test method covers the determination of the insulation resistance of a membrane switch.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
General Information
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Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
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Designation: F1689 − 05 (Reapproved 2012)
Standard Test Method for
Determining the Insulation Resistance of a Membrane
Switch
This standard is issued under the fixed designation F1689; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.5 Insulation resistance measurement may be destructive
and units that have been tested should be considered unreliable
1.1 This test method covers the determination of the insu-
for future use.
lation resistance of a membrane switch.
1.2 This standard does not purport to address all of the
4. Interferences
safety concerns, if any, associated with its use. It is the
4.1 The following parameters may affect the result of this
responsibility of the user of this standard to establish appro-
test:
priate safety and health practices and determine the applica-
4.1.1 Humidity,
bility of regulatory limitations prior to use.
4.1.2 Contamination,
4.1.3 Barometric pressure, and
2. Terminology
4.1.4 Temperature.
2.1 Definitions:
2.1.1 insulation resistance—the electrical resistance be-
5. Apparatus
tween test points.
5.1 Electric Device, suitable to provide a constant prese-
2.1.2 leakage current—current flow through the insulation
lected dc voltage and suitable electronic monitoring device to
between test points.
measure very small current levels (micro-ampere range), or
2.1.3 membrane switch—a momentary switching device in
5.2 Resistance Measuring Device, such as a megohm-meter,
which at least one contact is on, or made of, a flexible
or equivalent that can provide a specified voltage. (This would
substrate.
replace 5.1.)
2.1.4 test points—two preselected conductive points in a
circuit loop, possibly including a switch.
6. Procedure—Voltage Source Method (Fig. 1)
6.1 Pretest Setup:
3. Significance and Use
6.1.1 Connect test points of the switch assembly to the
3.1 Insulation resistance is useful for design verification,
voltage source.
quality control of materials, and workmanship.
6.1.2 Connect leakage current measuring device in series
3.2 Low insulation resistance can cause high leakage cur-
with the voltage source.
rents.
6.2 In-Process Test:
3.3 High leakage currents can lead to deterioration of the
6.2.1 Adjust voltage source to 100 VDC 6 10%oras
insulation or false triggering of the associated input device, or
specified.
both.
6.2.2 Dwell for 60 s.
6.2.3 Record leakage current.
3.4 Specific areas of testing are, but not limited to:
3.4.1 Conductor/dielectric/conductor crossing point.
7. Procedure—Megohm Method (Fig. 2)
3.4.2 Close proximity of conductors, and
3.4.3 Any other conductive surface such as shielding or 7.1 Pretest Setup:
metal
...
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