Aerospace series - Modular and Open Avionics Architectures - Part 004: Packaging

The purpose of this standard is to establish uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC. It comprises the module physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMA rack and the operational environment.
The characteristics addressed by the Packaging Standard are:
Interchangeability:
   For a given cooling method all modules conforming to the packaging standard will function correctly when inserted into any rack slot conforming to the standard for the cooling method.
-   All modules conforming to the Module Physical Interface (MPI) definitions for connector, IED and cooling interface will function correctly when inserted into any rack slot conforming to the same MPI definition.
Maintainability:
-   All modules are easily removable at first line.
-   No special tools required at first line.
-   No manual adjustment is necessary when installing modules. No tool is required for installation or removal of the modules.
-   Mechanical keying is provided that prevents insertion of a module into a rack slot that may cause an unsafe condition.
The Module Physical Interface definition, contained within this standard, does not include the properties of the signalling used in the optical interface (e.g. wavelength). These are covered in EN 4660-003.

Luft- und Raumfahrt - Modulare und offene Avionikarchitekturen - Teil 004: Paketierung

Zweck der vorliegenden Norm ist die Festlegung einheitlicher Anforderungen an die Paketierung der Stan-dardfunktionsmodule (CFM) innerhalb eines IMA-Systems entsprechend der ASAAC-Definition. Dieses Dokument umfasst die physikalischen Moduleigenschaften und die physikalische Modulschnittstelle (MPI) und gibt Empfehlungen für das IMA-Gestell und die Betriebsumgebung. Die behandelten Paketierungsmerkmale sind: Austauschbarkeit: ⎯ Bei einem gegebenen Kühlverfahren funktionieren alle Module nach der vorliegenden Norm ordnungs-gemäß, wenn sie in einen beliebigen Gestellsteckplatz eingesetzt sind, der den Vorgaben für das Kühlver-fahren entspricht; ⎯ Alle den MPI-Definitionen für Steckverbinder, IED und Kühlschnittstelle entsprechenden Module funktio-nieren ordnungsgemäß, wenn sie in einen beliebigen Gestellsteckplatz eingesetzt sind, der derselben MPI-Definition entspricht. Wartbarkeit: ⎯ Alle Module sind vor Ort leicht auszubauen. ⎯ Vor Ort sind keine speziellen Werkzeuge erforderlich. ⎯ Beim Einbau von Modulen ist keine manuelle Anpassung notwendig. Zum Ein- und Ausbau der Module ist kein Werkzeug erforderlich. ⎯ Es ist eine mechanische Sicherung vorgesehen, die verhindert, dass das Modul in einen Steckplatz ein-gesetzt wird, der einen unsicheren Zustand bewirken könnte. Die in dieser Norm enthaltene Definition der physikalischen Modulschnittstelle umfasst nicht die Signalisie-rungseigenschaften der optischen Schnittstelle (z. B. Wellenlänge). Diese sind in EN 4660-003 behandelt.

Série aérospatiale - Architectures Avioniques Modulaires et Ouvertes - Partie 004: Packaging

Le but de la présente norme est d'établir des exigences uniformes pour le Packaging relative aux Modules Fonctionnels Communs (CFM) dans le cadre d'un système avionique modulaire intégré (IMA) tel que défini par l'ASAAC. Il comprend les propriétés physiques de modules et les définitions de l'interface physique des modules (MPI) conjointement avec les lignes directrices pour rack IMA et l'environnement opérationnel
Les caractéristiques traitées par la norme pour le Packaging sont :
Interchangeabilité :
- Pour une méthode de refroidissement donnée, tous les modules conformes à la norme pour le packaging fonctionneront correctement après insertion dans une fente de rack conforme à la norme de la méthode de refroidissement.
- Tous les modules conformes aux définitions de l'interface physique du module (MPI) pour le connecteur, l'IED et l'interface de refroidissement fonctionneront correctement après insertion dans une fente de rack conforme à la même définition de la MPI.
Maintenabilité :
- Tous les modules doivent être facilement démontables en première ligne.
- Aucun outil spécial n’est exigé en première ligne.
- Aucun réglage manuel n'est nécessaire lors de l'installation des modules. Aucun outil n'est exigé pour l'installation ou la dépose des modules.
- Une manipulation mécanique est prévue de façon à empêcher l'insertion d'un module dans une fente de rack susceptible de provoquer une situation dangereuse.
La définition de l'interface physique de modules incluse dans la présente norme ne comprend pas les propriétés de signalisation utilisées dans l'interface optique (par exemple, longueur d'onde). Celles-ci sont couvertes dans l'EN 4660-003.

Aeronavtika - Modularne in odprte letalske elektronske arhitekture - 004. del: Pakiranje

Namen tega standarda je vzpostaviti enotne zahteve za pakiranje splošnih funkcionalnih modulov (CFM) znotraj integriranega modularnega letalskega (IMA) sistema, kot je določeno z ASAAC. Obsega fizične lastnosti modula in definicije fizičnega vmesnika modula (MPI), skupaj s smernicami za stojalo IMA in delovno okolje.
Značilnosti, obravnavane v standardu za pakiranje, so:
a) zamenljivost:
1) Za dano metodo hlajenja bodo vsi moduli, ki so v skladu s standardom za pakiranje, delovali pravilno, če bodo vstavljeni v katero koli odprtino stojala, ki je v skladu s standardom za metodo hlajenja.
2) Vsi moduli, ki so v skladu z definicijami konektorja fizičnega vmesnika modula (MPI), IED in hladilne vmesnike, bodo delovali pravilno, če bodo vstavljeni v kakršno koli odprtino stojala, ki je v skladu z isto definicijo MPI.
b) Vzdrževalno-tehnične zahteve:
1) Vsi moduli se zlahka odstranijo pri prvi liniji.
2) Ni potrebno posebno orodje pri prvi liniji.
3) Ni potrebna ročna prilagoditev pri vgradnji modulov. Nobeno orodje ni potrebno pri vgradnji ali odstranitvi modulov.
4) Zagotovljeno je mehansko odpiranje, ki preprečuje vstavitev modula v odprtino stojala, kar lahko povzroči nevarne pogoje.
Definicija fizičnega vmesnika modula, ki jo vključuje ta standard, ne vključuje lastnosti signalizacije, uporabljenih pri optičnem vmesniku (npr. valovna dolžina). Ti so zajeti v EN 4660-003.

General Information

Status
Withdrawn
Publication Date
22-Feb-2011
Withdrawal Date
20-Aug-2019
Technical Committee
Drafting Committee
Current Stage
9960 - Withdrawal effective - Withdrawal
Completion Date
21-Aug-2019

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Aeronavtika - Modularne in odprte letalske elektronske arhitekture - 004. del: PakiranjeLuft- und Raumfahrt - Modulare und offene Avionikarchitekturen - Teil 004: PaketierungSérie aérospatiale - Architectures Avioniques Modulaires et Ouvertes - Partie 004: PackagingAerospace series - Modular and Open Avionics Architectures - Part 004: Packaging49.090On-board equipment and instrumentsICS:Ta slovenski standard je istoveten z:EN 4660-004:2011SIST EN 4660-004:2011en01-december-2011SIST EN 4660-004:2011SLOVENSKI

STANDARD
SIST EN 4660-004:2011
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 4660-004
February 2011 ICS 49.090 English Version
Aerospace series - Modular and Open Avionics Architectures - Part 004: Packaging

Série aérospatiale - Architectures Avioniques Modulaires et Ouvertes - Partie 004: Packaging

Luft- und Raumfahrt - Modulare und offene Avionikarchitekturen - Teil 004: Packaging This European Standard was approved by CEN on 26 June 2010.

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.

CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.

EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION EUROPÄISCHES KOMITEE FÜR NORMUNG
Management Centre:
Avenue Marnix 17,

B-1000 Brussels © 2011 CEN All rights of exploitation in any form and by any means reserved worldwide for CEN national Members. Ref. No. EN 4660-004:2011: ESIST EN 4660-004:2011

EN 4660-004:2011 (E) 2 Contents Page Foreword ............................................................................................................................................................. 40Introduction ........................................................................................................................................... 50.1Purpose .................................................................................................................................................. 50.2Document structure .............................................................................................................................. 61Scope ..................................................................................................................................................... 62Normative references ........................................................................................................................... 73Terms, definitions and abbreviations ................................................................................................. 83.1Terms and definitions........................................................................................................................... 83.2Abbreviations ........................................................................................................................................ 83.3Precedence ............................................................................................................................................ 93.4Definition of terms ................................................................................................................................ 94Generic module specification ............................................................................................................ 114.1Introduction ......................................................................................................................................... 114.2Module description ............................................................................................................................. 124.3Module Physical Specification .......................................................................................................... 124.4Module Physical Interface - Connector ............................................................................................ 164.5Module Physical Interface - Cooling ................................................................................................. 204.6Module Physical Interface – Insertion Extraction Device ............................................................... 235Module Mechanical Tests .................................................................................................................. 255.1Master gauge test ............................................................................................................................... 255.2Module insertion and extraction ....................................................................................................... 256Guidelines for a rack slot ................................................................................................................... 276.1Introduction ......................................................................................................................................... 276.2Interchangeability ............................................................................................................................... 276.3Rack Slot Design Requirements ....................................................................................................... 276.4Connector interface ............................................................................................................................ 286.5Conduction Cooled Interface ............................................................................................................. 296.6Air Flow Cooled Interface .................................................................................................................. 306.7Relationship between Cooling, Connector and IED Rack Interfaces ............................................ 327Typical modular avionics environment ............................................................................................ 337.1Ambient pressure (altitude) ............................................................................................................... 347.2Humidity ............................................................................................................................................... 347.3High and low temperatures ................................................................................................................ 347.4Thermal shocks ................................................................................................................................... 357.5Salt spray ............................................................................................................................................. 367.6Vibrations ............................................................................................................................................ 367.7Accelerations ...................................................................................................................................... 377.8Mechanical shocks ............................................................................................................................. 387.9Contamination resistance .................................................................................................................. 397.10Flame resistance ................................................................................................................................. 397.11Fungus resistance .............................................................................................................................. 397.12Rain ...................................................................................................................................................... 397.13Acoustic noise .................................................................................................................................... 407.14Electromagnetic environment ........................................................................................................... 407.15Explosive atmosphere ........................................................................................................................ 407.16Nuclear, Biological and Chemical (NBC) Hazards ........................................................................... 407.17Sand and dust ..................................................................................................................................... 427.18Single Event Upset / Multiple Bit Upset ............................................................................................ 427.19Module Tempest .................................................................................................................................. 42SIST EN 4660-004:2011

EN 4660-004:2011 (E) 3 Figures Page Figure 1 — ASAAC Standard Documentation Hierarchy ............................................................................... 5 Figure 2 — Module definitions ........................................................................................................................ 10 Figure 3 — CFM dimensions ........................................................................................................................... 13 Figure 4 — Module Connector Interface Definition and Identification (connector inserts shown for example only) ................................................................................... 16 Figure 5 — Preferred Contact Identification (viewed from outside module, lowest numbered contact is towards Side C of the cassette) ......................................................... 17 Figure 6 — Contact Identification – MT Ferrule ............................................................................................. 18 Figure 7 — Polarisation Key identification .................................................................................................... 19 Figure 8 — Conduction Cooled Module – Cooling Interface Definition ...................................................... 20 Figure 9 — Air cooled module – Cooling interface definition ...................................................................... 22 Figure 10 — IED Hook characteristics ........................................................................................................... 24 Figure 11 — IED Implementation example ..................................................................................................... 25 Figure 12 — Rack Connector Physical Interface ........................................................................................... 28 Figure 13 — Conduction Cooled rack guide rail ........................................................................................... 29 Figure 14 — Air Flow Through and Direct Air Flow cooled rack guide rail ................................................ 30 Figure 15 — Air Flow Around cooled rack guide rail .................................................................................... 31

Tables

Page Table 1 — Allowed aluminium protective treatments ................................................................................... 14 Table 2 — Ambient pressure in relation to altitude ...................................................................................... 34 Table 3 — Temperature environmental conditions - Conditioned bay ....................................................... 35 Table 4 — Temperature environmental conditions - Unconditioned bay ................................................... 35 Table 5 — Temperature environmental conditions - Storage ...................................................................... 35 Table 6 — Thermal shocks .............................................................................................................................. 36 Table 7 — Sinusoidal vibrations ..................................................................................................................... 36 Table 8 — Rotational accelerations ................................................................................................................ 37 Table 9 — Transversal accelerations ............................................................................................................. 38 Table 10 — Functional Shocks ........................................................................................................................ 38 Table 11 — Summary of environment and bonding environmental Conditions ........................................ 40 Table 12 — Initial Nuclear radiation conditions ............................................................................................ 41 Table 13 — Nuclear hardening conditions ..................................................................................................... 41

SIST EN 4660-004:2011

EN 4660-004:2011 (E) 4 Foreword This document (EN 4660-004:2011) has been prepared by the Aerospace and Defence Industries Association of Europe - Standardization (ASD-STAN). After enquiries and votes carried out in accordance with the rules of this Association, this Standard has received the approval of the National Associations and the Official Services of the member countries of ASD, prior to its presentation to CEN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by August 2011, and conflicting national standards shall be withdrawn at the latest by August 2011. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights. According to the CEN/CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

SIST EN 4660-004:2011

EN 4660-004:2011 (E) 5 0 Introduction 0.1 Purpose This document is produced under contract ASAAC Phase II Contract n°97/86.028.

The purpose of the ASAAC Programme is to define and validate a set of open architecture standards, concepts and guidelines for Advanced Avionics Architectures (A3) in order to meet the three main ASAAC drivers. The standards, concepts and guidelines produced by the Programme are to be applicable to both new aircraft and update programmes from 2005. The three main goals for the ASAAC Programme are: 1.

Reduced life cycle costs. 2.
Improved mission performance. 3.

Improved operational performance. The ASAAC standards are organised as a set of documents including: A set of agreed standards that describe, using a top down approach, the Architecture overview to all interfaces required to implement the core within avionics system. The guidelines for system implementation through application of the standards. The document hierarchy is given hereafter: (in this figure the document is highlighted)

Guidelines for System Issues • System Management • Fault Management • Initialisation / Shutdown • Configuration / Reconfiguration • Time Management • Security • Safety Standard for Architecture Standard for Common Functional ModulesStandard for Communications and Network Standard for Packaging Standard for Software

Figure 1 — ASAAC Standard Documentation Hierarchy SIST EN 4660-004:2011

EN 4660-004:2011 (E) 6 0.2 Document structure The document contains the following clauses: Clause 1, Scope. Clause 2, Normative references. Clause 3, Terms, definitions and abbreviation. Clause 4, Generic module specification. Clause 5, Module Mechanical Tests. Clause 6, Guidelines for a rack slot. Clause 7, Typical modular avionics environment. 1 Scope The purpose of this standard is to establish uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC. It comprises the module physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMA rack and the operational environment.

The characteristics addressed by the Packaging Standard are: Interchangeability:  For a given cooling method all modules conforming to the packaging standard will function correctly when inserted into any rack slot conforming to the standard for the cooling method.  All modules conforming to the Module Physical Interface (MPI) definitions for connector, IED and cooling interface will function correctly when inserted into any rack slot conforming to the same MPI definition. Maintainability:  All modules are easily removable at first line.  No special tools required at first line.  No manual adjustment is necessary when installing modules. No tool is required for installation or removal of the modules.  Mechanical keying is provided that prevents insertion of a module into a rack slot that may cause an unsafe condition. The Module Physical Interface definition, contained within this standard, does not include the properties of the signalling used in the optical interface (e.g. wavelength). These are covered in EN 4660-003. SIST EN 4660-004:2011

EN 4660-004:2011 (E) 7 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. EN 2101, Aerospace series — Chromic acid anodizing of aluminium and wrought aluminium alloys EN 2284, Aerospace series — Sulphuric acid anodizing of aluminium and wrought aluminium alloys EN 2437, Aerospace series — Chromate conversion coatings (yellow) for aluminium and aluminium alloys EN 4660-001, Aerospace series — Modular and Open Avionics Architectures — Part 001: Architecture EN 4660-002, Aerospace series — Modular and Open Avionics Architectures — Part 002: Common Functional Modules EN 4660-003, Aerospace series — Modular and Open Avionics Architectures — Part 003: Communications/Network EN 4660-005, Aerospace series — Modular and Open Avionics Architectures — Part 005: Software ASAAC2-GUI-32450-001-CPG Issue 01, Final Draft of Guidelines for System Issues 1)

— Volume 1 — System Management. — Volume 2 — Fault Management. — Volume 3 — Initialisation and Shutdown. — Volume 4 — Configuration / Reconfiguration. — Volume 5 — Time Management. — Volume 6 — Security. — Volume 7 — Safety. ARINC 600, Air transport avionics — Equipment interfaces. Def Stan 03-18, Chromate Conversion Coatings (Chromate Filming Treatments) Grades: Standard and Brushing for Aluminium and Aluminium Alloys. Def Stan 03-24, Chromic Acid Anodizing of Aluminium and Aluminium Alloys. Def Stan 03-25, Sulphuric Acid Anodizing of Aluminium and Aluminium Alloys.

1) In preparation at the date of publication of this standard. SIST EN 4660-004:2011

EN 4660-004:2011 (E) 8 BS 5599, Specification for hard anodic oxidation coatings on aluminium and its alloys for engineering purposes. 2)

MIL-C-26074E, Coatings, Electroless Nickel Requirements. MIL-A-8625E, Anodic Coatings for Aluminium and Aluminium Alloys. MIL-C-81706, Chemical Conversion Materials for Coating Aluminium and Aluminium Alloys. MIL-C-5541, Chemical Conversion Coatings on Aluminium and Aluminium Alloys. 3 Terms, definitions and abbreviations 3.1 Terms and definitions Use of “shall”, “should” and “may” within the standards observe the following rules:  The word SHALL in the text express a mandatory requirement of the standard.  The word SHOULD in the text expresses a recommendation or advice on implementing such a requirement of the standard. It is expected that such recommendations or advice will be followed unless good reasons are stated for not doing so.  The word MAY in the text expresses a permissible practice or action. It does not express a requirement of the standard. 3.2 Abbreviations AFA Air Flow Around AFT Air Flow Through ARINC Aeronautical Radio Inc ASAAC Allied Standard Avionics Architecture Council CC Conduction Cooled CFM Common Functional Module DAF Direct Air Flow EMC ElectroMagnetic Compatibility IED

Insertion Extraction Device IMA Integrated Modular Avionics MBU
Multiple Bit Upset
2) Replaces Def Stan 03-26. SIST EN 4660-004:2011

EN 4660-004:2011 (E) 9 MPI Module Physical Interface MT Mechanical Transfer NBC Nuclear, Biological and Chemical PSD Power Spectral Density SEU

Single Event Upset 3.3 Precedence Figures in this document have precedence over text. 3.4 Definition of terms 3.4.1 General terms Backplane A structure containing optical and electrical communication paths and electrical power supply wiring between modules. This shall be a removable structure or integrated into the rack. Cassette Mechanical frame enclosing the electrical components of the module. Connector A device to provide all of the electrical and optical connections between the cassette and the backplane. The connector fixed to the module cassette plugs into the corresponding connector of the backplane. It comprises a shell, inserts contacts and ferrules. Contact A single signal connection, either an electrical pin/socket or a single fibre. In the case of fibre optic contacts this does not necessarily imply the mating parts are in mechanical contact. Cooling Interface Surface which contributes to the removal of heat from the module. Ferrule A housing and alignment device for one or more optical fibres. Insert A section of a connector containing a number of ferrules or contacts. Insertion Extraction Device

(IED) A device to aid the insertion and extraction of the module from the rack and give mechanical advantage over the mating forces associated with the connector.

It also provides the retention system for the module within the rack such that the module connector remains mated under all conditions specified. Module

The module is a grouping of electronic devices, assembled together to perform a specific function, into a flight-line protected hardware assembly. This is the Common Functional Module. The CFM is replaceable at first line. Rack

A mechanical arrangement for housing avionics equipment. This provides physical support, environmental protection and cooling for the modules. Shell The outer mating parts of the connector that provide the structure of the connector, fixings to the module and backplane parts and the support for the Inserts.

SIST EN 4660-004:2011

EN 4660-004:2011 (E) 10 3.4.2 Module mechanical items A Common Functional Module comprises:  A cassette.  A connector.  An insertion extraction device. The volume of the cassette is delimited by a cuboid. The module is referenced against a Cartesian Reference System as represented on Figure 2. Volume for Insertion/ Extraction DeviceConnector Side BSide AModule HeaderSide DInsertion DirectionZXYGuide EdgeReference PlaneSide CVolume for Insertion/ Extraction DeviceConnector Side BSide AModule HeaderSide DInsertion DirectionZXYGuide EdgeReference PlaneSide C Figure 2 — Module definitions SIST EN 4660-004:2011

EN 4660-004:2011 (E) 11 Guide Edge Edge of the CFM running along the X axis. It defines the location of the module within the rack.

Height The cassette dimension in the Z-axis. It is measured from cassette Side C to cassette Side D. Length

The cassette dimension in the X-axis measured from the Reference Plane to the module header (this excludes the Insertion Extraction Device and the connector). Module header The surface of the cassette parallel to the Reference Plane, and opposite to the cassette surface contained within the Reference Plane The IED shall be mounted on this surface.

Side A Surface of the cassette contained within the X, Z plane. Viewing the module in the direction of insertion, with the cassette Side C at the top, Side A is to the left. Side B Surface of the cassette parallel to and furthest from the X, Z plane. Viewing the module in the direction of insertion, with the cassette Side C at the top, Side B is to the right. Side C Surface of the cassette parallel to and furthest from the X, Y plane.It contains one of the two cassette cooling interfaces, the other being within Side D. Side D Surface of the cassette contained within the X, Y plane. It contains one of the two cassette cooling interfaces, the other being within Side C. Reference Plane Plane defined by the Y and Z axis. It is perpendicular to the direction of insertion of the module and passes through the mating surface between the cassette and the connector. Width The cassette dimension in the Y-axis of the module, measured from Side A to Side B.

3.4.3 Tolerances Unless otherwise stated, tolerances shall be ± 0,2 mm. 4 Generic module specification 4.1 Introduction This clause specifies the physical properties and the principle physical interfaces for ASAAC Common Functional Modules, i.e. the Module Physical Interface (MPI). The MPI comprises:  The Connector Interface between Common Functional Module and Backplane.  The Cooling Interface.  The Insertion Extraction Device (IED). SIST EN 4660-004:2011

EN 4660-004:2011 (E) 12 The ASAAC Common Functional Module supports four cooling techniques detailed in 4.5. These being:  Conduction Cooling (CC).  Direct Air Flow Cooling (DAF).  Air Flow Around Cooling (AFA).  Air Flow Through Cooling (AFT). This clause specifies those parameters that shall apply to all module types. In addition, Guidelines for the Module guide to rack slot interfaces compatible with the MPI is provided in Clause 6. It is assumed that a System Design Specification will be raised for each specific project implementation. It will define the CFM characteristics which are not imposed by the standard. 4.2 Module description A module consists of an enclosed component mounting area, a connector and an insertion extraction device. The module shall have the following attributes:  Provision for the protection of electronic devices, contained within the CFM, from the typical environment requirements identified in the Clause 7, both during use and during handling, storage and transportation,  Provision for a connector which mates with the backplane assembly and provides all power and data links to the rest of the avionics system,

 Provision for a keying method to positively bulk the incorrect insertion of any CFM into a rack and to ensure that an incorrectly fitted CFM shall be prevented from making any electrical connection,  Provision for a mechanism that retains the module within the rack under the mechanical and environmental conditions specified herein and yet allows for easy insertion and removal of the module,  Provision for a cooling interface that provides for the removal of heat from the CFM,  Provision for easy identification. 4.3 Module Physical Specification 4.3.1 Module envelope: height, length, width The module envelope comprises the IED, the cassette and the connector. The principle dimensions for the cassette are as shown in Figure 3. These dimensions shall be:  Width: 24 mm +0.0 / -0.2 mm.

 Height: 160 mm +0.0 / -0.2 mm.  Length: 233.4 mm +0.0 / -0.2 mm.  Length + Connector: 262.9 mm +0.0 / -0.2 mm. Detailed dimensions of the connector, IED and mating structure parts are given in 4.4 and 4.6. The modules shall be capable of being mounted on a pitch of 26 mm (modular). SIST EN 4660-004:2011

EN 4660-004:2011 (E) 13 Length + ConnectorLengthMax. Area for Insertion / Extraction DeviceHeightWidthHeightConnectorLength + ConnectorLengthMax. Area for Insertion / Extraction DeviceHeightWidthHeightConnector Figure 3 — CFM dimensions 4.3.2 Module Distortion All warp, twist and surface contour tolerance shall not violate the module envelope defined in 4.3.1. 4.3.3 Module mass NOTE It is an objective of the IMA concept to reduce the overall weight of the packaging associated with the avionics. The module construction should aim to minimise the total weight of the module. 4.3.4 Module insertion and extraction

The modules shall be able to be installed and removed from the rack without the need for special tools nor for manual adjustment of the module once installed in order for it to function. It shall also be possible to perform maintenance in the flight line environment (temperature, humidity etc.). Maintenance shall be possible whilst wearing Nuclear, Biological and Chemical (NBC) protective clothing. Module insertion and extraction shall also be compliant with the tests specified in Clause 5. 4.3.5 Electrical safety Modules containing hazardous voltage shall have exposed surfaces connected to the safety ground. 4.3.6 Materials 4.3.6.1 Use of flammable materials The equipment shall be designed/constructed from materials that do not support combustion. No material used in the co

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