EN 62496-2:2017

Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards

IEC 62496-2:2017(E) specifies a method of defining the conditions for measurements of optical characteristics of optical circuit boards. The method comprises the use of code reference look-up tables to identify different critical aspects of the measurement environment. The values extracted from the tables are used to construct a measurement identification code, which, in itself, captures sufficient information about the measurement conditions, so as to ensure consistency of independently measured results within an acceptable margin. Recommended measurement conditions are specified to minimise further variation in independently measured results. Keywords: bandwidth density, optical characteristics of optical circuit boards

Optische Leiterplatten - Grundlegende Prüf- und Messverfahren - Teil 2: Allgemeiner Leitfaden zur Festlegung der Bedingungen für die Messung der optischen Eigenschaften von optischen Leiterplatten

Cartes à circuits optiques - Procédures fondamentales d'essais et de mesures - Partie 2: Recommandations générales relatives à la détermination des conditions de mesure des caractéristiques optiques des cartes à circuits optiques

IEC 62496-2:2017 spécifie une méthode pour définir les conditions de mesure des caractéristiques optiques des cartes à circuits optiques. La méthode inclut l'utilisation de tableaux présentant des références à des codes pour identifier différents aspects critiques de l'environnement de mesure. Les valeurs extraites des tableaux sont utilisées pour construire un code d'identification des mesures qui contient suffisamment d'informations sur les conditions de mesure, afin d'assurer la cohérence des résultats mesurés de manière indépendante avec une marge acceptable. Des conditions de mesure recommandées sont spécifiées pour réduire le plus possible les variations des résultats mesurés de manière indépendante. Mots clés: densités de largeur de bande, caractéristiques optiques des cartes à circuits optiques

Plošče z optičnimi vezji - Osnovni preskusni in merilni postopki - 2. del: Splošno navodilo za definiranje pogojev za določanje optičnih značilnosti plošč z optičnimi vezji (IEC 62496-2:2017)

Ta del standarda IEC 62496 določa metodo za definiranje pogojev za določanje optičnih značilnosti plošč z optičnimi vezji. Metoda vključuje uporabo referenčnih tabel za iskanje kode za identifikacijo različnih kritičnih vidikov merilnega okolja.
Vrednosti, pridobljene iz tabel, se uporabljajo za izdelavo merilne identifikacijske kode, ki sama po sebi zajema zadostne informacije o pogojih merjenja, da se zagotovi skladnost neodvisno izmerjenih rezultatov znotraj sprejemljivih omejitev. Priporočeni pogoji merjenja so določeni, da se zmanjšajo nadaljnje razlike v neodvisno izmerjenih rezultatih.

General Information

• Status: Published
• Publication Date: 21-Sep-2017
• Withdrawal Date: 27-Jun-2020
• ICS: 33.180.01 - Fibre optic systems in general
• Technical Committee: CLC/SR 86 - Fibre optics
• Drafting Committee: IEC/TC 86 - IEC_TC_86
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 22-Sep-2017
• Completion Date: 22-Sep-2017
• Ref Project: SIST EN 62496-2:2017 - Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (IEC 62496-2:2017)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62496-2:2017
01-november-2017

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Optical circuit boards - Basic test and measurement procedures - Part 2: General

guidance for definition of measurement conditions for optical characteristics of optical

circuit boards (IEC 62496-2:2017)
Ta slovenski standard je istoveten z: EN 62496-2:2017
ICS:
33.180.01 6LVWHPL]RSWLþQLPLYODNQLQD Fibre optic systems in
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SIST EN 62496-2:2017 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62496-2:2017
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SIST EN 62496-2:2017
EUROPEAN STANDARD EN 62496-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2017
ICS 33.180.01
English Version
Optical circuit boards -
Basic test and measurement procedures -
Part 2: General guidance for definition of measurement
conditions for optical characteristics of optical circuit boards
(IEC 62496-2:2017)
Cartes à circuits optiques - Optische Leiterplatten -

Procédures fondamentales d'essais et de mesures - Grundlegende Prüf- und Messverfahren -

Partie 2: Recommandations générales relatives à la Teil 2: Allgemeiner Leitfaden zur Festlegung der

détermination des conditions de mesure des Bedingungen für die Messung der optischen Eigenschaften

caractéristiques optiques des cartes à circuits optiques von optischen Leiterplatten

(IEC 62496-2:2017) (IEC 62496-2:2017)

This European Standard was approved by CENELEC on 2017-06-28. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 62496-2:2017 E
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SIST EN 62496-2:2017
EN 62496-2:2017
European foreword

The text of document 86/509/CDV, future edition 1 of IEC 62496-2, prepared by IEC/TC 86 "Fibre

optics" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as

EN 62496-2:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-03-28
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-06-28
the document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62496-2:2017 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60793-2 NOTE Harmonized as EN 60793-2.
IEC 60793-1-43 NOTE Harmonized as EN 60793-1-43.
IEC 60825-1 NOTE Harmonized as EN 60825-1.
IEC 61280-4-1 NOTE Harmonized as EN 61280-4-1.
IEC 61745 NOTE Harmonized as EN 61745.
IEC 62496-1 NOTE Harmonized as EN 62496-1.
IEC 62496-2-4 NOTE Harmonized as EN 62496-2-4.
1) 2)
IEC 62496-4-1 NOTE Harmonized as EN 62496-4-1 .
1) Under preparation. Stage at the time of publication: IEC PCC 62496-4-1:2017.
2) Under preparation. Stage at the time of publication: prEN 62496-4-1.
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SIST EN 62496-2:2017
EN 62496-2:2017
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is

available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61300-1 - Fibre optic interconnecting devices and EN 61300-1 -
passive components - Basic test and
measurement procedures - Part 1:
General and guidance
IEC 61300-3-53 - Fibre optic interconnecting devices and EN 61300-3-53 -
passive components - Basic test and
measurement procedures - Part 3-53:
Examinations and measurements -
Encircled angular flux (EAF)
measurement method based on two-
dimensional far field data from step
index multimode waveguide (including
fibre)
IEC 62496-2-1 2011 Optical circuit boards - Part 2-1: EN 62496-2-1 2011
Measurements - Optical attenuation and
isolation
IEC 62614 - Fibre optics - Launch condition EN 62614 -
requirements for measuring multimode
attenuation
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SIST EN 62496-2:2017
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SIST EN 62496-2:2017
IEC 62496-2
Edition 1.0 2017-05
INTERNATIONAL
STANDARD
colour
inside
Optical circuit boards – Basic test and measurement procedures –
Part 2: General guidance for definition of measurement conditions for optical
characteristics of optical circuit boards
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.01 ISBN 978-2-8322-4404-3

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
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SIST EN 62496-2:2017
– 2 – IEC 62496-2:2017  IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 7

4 Measurement definition system for optical circuit boards ................................................. 9

4.1 General ................................................................................................................... 9

4.2 Measurement definition system requirements.......................................................... 9

4.2.1 Accuracy ......................................................................................................... 9

4.2.2 Accountability .................................................................................................. 9

4.2.3 Efficiency ....................................................................................................... 10

4.2.4 Convenience ................................................................................................. 10

4.2.5 Independent .................................................................................................. 10

4.2.6 Scalable ........................................................................................................ 10

4.2.7 Customised requirements .............................................................................. 10

4.2.8 Prioritised structure ....................................................................................... 10

4.3 Measurement definition criteria ............................................................................. 10

4.3.1 General ......................................................................................................... 10

4.3.2 Source characteristics ................................................................................... 11

4.3.3 Launch conditions .......................................................................................... 11

4.3.4 Input coupling conditions ............................................................................... 14

4.3.5 Output coupling conditions ............................................................................ 15

4.3.6 Capturing conditions ...................................................................................... 16

4.4 Launch and capturing position .............................................................................. 16

4.5 Launch and capture direction ................................................................................ 17

5 Measurement identification code ................................................................................... 19

5.1 General ................................................................................................................. 19

5.2 Measurement identification code construction ....................................................... 19

5.2.1 General ......................................................................................................... 19

5.2.2 AAA – Source characteristics......................................................................... 19

5.2.3 BBB(b1) – Launch conditions ......................................................................... 19

5.2.4 CCC – Input coupling conditions .................................................................... 20

5.2.5 DDD – Output coupling conditions ................................................................. 20

5.2.6 EEE – Capturing conditions ........................................................................... 20

5.3 Extended measurement identification code with customisation parameters ........... 20

5.3.1 General ......................................................................................................... 20

5.3.2 Customisation parameters with placeholders ................................................. 20

5.4 Reference measurements ..................................................................................... 21

5.5 Coordinate table AAA – Source characteristics ..................................................... 21

5.5.1 Mandatory parameters ................................................................................... 21

5.5.2 Customisation parameters ............................................................................. 21

5.6 Coordinate table BBB – Launch conditions............................................................ 24

5.6.1 Mandatory parameter..................................................................................... 24

5.6.2 Customisation parameters ............................................................................. 24

5.7 Coordinate table CCC – Input coupling conditions................................................. 27

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SIST EN 62496-2:2017
IEC 62496-2:2017  IEC 2017 – 3 –

5.7.1 Mandatory parameters ................................................................................... 27

5.7.2 Customisation parameters ............................................................................. 27

5.8 Coordinate table DDD – Output coupling conditions .............................................. 29

5.8.1 Mandatory parameters ................................................................................... 29

5.8.2 Customisation parameters ............................................................................. 29

5.9 Coordinate table EEE – Capturing conditions ........................................................ 31

5.9.1 Mandatory parameters ................................................................................... 31

5.9.2 Customisation parameters ............................................................................. 31

5.10 Examples of deployment ....................................................................................... 34

5.10.1 General ......................................................................................................... 34

5.10.2 MIC-042-113(400)-001-001-112 (integrating sphere device details

including supplier and model number)............................................................ 34

5.10.3 MIC-072-123(205)-053(1.56, X,X)-001-042 (integrating sphere device

details including supplier and model number) ................................................ 34

5.10.4 Fast polarisation axis: MIC-091-072(150)-042(1.53, 25, -30)-051-004;

slow polarisation axis: MIC-091-072(75)-042(1.53, 25, -120)-051-004 ........... 35

Annex A (informative) State of the art in optical interconnect technologies ........................... 36

A.1 Diversity of optical interconnect technologies ........................................................ 36

A.2 Fibre-optic circuit laminates .................................................................................. 36

A.3 Polymer waveguides ............................................................................................. 36

A.4 Planar glass waveguides ...................................................................................... 36

A.5 Free space optics ................................................................................................. 37

A.6 Target applications ............................................................................................... 37

Bibliography .......................................................................................................................... 38

Figure 1 – Optical circuit board varieties ................................................................................. 6

Figure 2 – Recommended test setup for single-mode fibre launch conditions ........................ 13

Figure 3 – Recommended test setup for multimode fibre launch conditions ........................... 13

Figure 4 – Cross-sectional views of channel under test at input ............................................ 15

Figure 5 – Cross-sectional views of the channel under test at output .................................... 16

Figure 6 – Measurement setup with collinear launch and capture direction ........................... 17

Figure 7 – Measurement setup with orthogonal launch and capture direction ........................ 18

Figure 8 – Measurement setup with oblique launch and capture direction ............................. 18

Figure 9 – Measurement identification code construction ...................................................... 19

Figure 10 – Reference measurements with the same MIC ..................................................... 21

Table 1 – Recommended modal launch profiles .................................................................... 12

Table 2 – AAA coordinate reference for source characteristics ............................................. 22

Table 3 – BBB coordinate reference for launch conditions .................................................... 25

Table 4 – CCC coordinate reference for input coupling conditions ........................................ 28

Table 5 – DDD coordinate reference for output coupling conditions ...................................... 30

Table 6 – EEE coordinate reference for capturing conditions ................................................ 32

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SIST EN 62496-2:2017
– 4 – IEC 62496-2:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
OPTICAL CIRCUIT BOARDS –
BASIC TEST AND MEASUREMENT PROCEDURES –
Part 2: General guidance for definition of measurement conditions for
optical characteristics of optical circuit boards
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC

Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62496-2 has been prepared by IEC technical committee 86: Fibre

optics.
The text of this document is based on the following documents:
CDV Report on voting
86/509/CDV 86/515/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62496-2:2017
IEC 62496-2:2017  IEC 2017 – 5 –

A list of all parts in the IEC 62496 series, published under the general title Optical circuit

boards – Basic test and measurement procedures, can be found on the IEC website.

Future standards in this series will carry the new general title as cited above. Titles of existing

standards in this series will be updated at the time of the next edition.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
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SIST EN 62496-2:2017
– 6 – IEC 62496-2:2017  IEC 2017
INTRODUCTION

Bandwidth densities in modern data communication systems are driven by interconnect

speeds and scalable input/output (I/O) and will continue to increase over the coming years,

thereby severely impacting cost and performance in future data communication systems,

bringing increased demands in terms of signal integrity and power consumption.

The projected increase in capacity, processing power and bandwidth density in future

information communication systems will need to be addressed by the migration of embedded

optical interconnects into system enclosures. In particular, this would necessitate the

deployment of optical circuit board technologies on some or all key system cards, such as the

backplane, motherboard and peripheral circuit boards.

Many varieties of optical circuit board technology exist today, which differ strongly from each

other in terms of their intrinsic waveguide technology. As shown in Figure 1, these varieties

include, but are not limited to: a) fibre-optic laminate, b) polymer waveguides and c) planar

glass waveguides. Annex A provides a detailed overview of the state of the art of such optical

interconnect technologies.
IEC IEC IEC
a) Fibre-optic laminate b) Polymer waveguides c) Planar glass waveguides
Figure 1 – Optical circuit board varieties

One important prerequisite to the commercial adoption of optical circuit boards is a reliable

test and measurement definition system that is agnostic to the type of waveguide system

under test and, therefore, can be applied to different optical circuit board technologies as well

as being adaptable to future variants. A serious and common problem with the measurement

of optical waveguide systems has been lack of proper definition of the measurement

conditions for a given test regime, and consequently strong inconsistencies ensue in the

results of measurements by different parties on the same test sample. To date, no

methodology has been established to ensure that test and measurement conditions for such

optical waveguide systems are properly identified.

This document specifies a method of capturing sufficient information about the measurement

conditions for a given optical circuit board to ensure consistency of measurement results

within an acceptable margin.

Given the substantial variety in properties and requirements for different optical circuit board

types, some test environments and conditions are more appropriate than others for a given

optical circuit board. It is, therefore, crucial that this measurement identification standard

encompass a comprehensive range of test and measurement scenarios for all known types of

optical circuit boards and their waveguide systems, while also being sufficiently adaptable and

extendable to accommodate future waveguide technologies. In addition, a degree of

customisation is possible to account for arbitrary test parameters.
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SIST EN 62496-2:2017
IEC 62496-2:2017  IEC 2017 – 7 –
OPTICAL CIRCUIT BOARDS –
BASIC TEST AND MEASUREMENT PROCEDURES –
Part 2: General guidance for definition of measurement conditions for
optical characteristics of optical circuit boards
1 Scope

This part of IEC 62496 specifies a method of defining the conditions for measurements of

optical characteristics of optical circuit boards. The method comprises the use of code

reference look-up tables to identify different critical aspects of the measurement environment.

The values extracted from the tables are used to construct a measurement identification code,

which, in itself, captures sufficient information about the measurement conditions, so as to

ensure consistency of independently measured results within an acceptable margin.

Recommended measurement conditions are specified to minimise further variation in

independently measured results.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 61300-1, Fibre optic interconnecting devices and passive components – Basic test and

measurement procedures – Part 1: General and guidance

IEC 61300-3-53, Fibre optic interconnecting devices and passive components – Basic test

and measurement procedures – Part 3-53: Examinations and measurements – Encircled

angular flux (EAF) measurement method based on two-dimensional far field data from step

index multimode waveguide (including fibre)
IEC 62614, Fibre optics – Launch condition requirements for measuring multimode
attenuation

IEC 62496-2-1:2011, Optical circuit boards – Part 2-1: Measurements – Optical attenuation

and isolation
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 62496-2-1 and the

following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
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SIST EN 62496-2:2017
– 8 – IEC 62496-2:2017  IEC 2017
3.1
optical channel measurement identification code
MIC

numerical code used to capture sufficient information about the measurement conditions on a

waveguide under test in an optical circuit board, such as to ensure independent repeatability

of the measurement and consistency of measured results on an identical sample
3.2
optical channel under test
optical circuit board channel subjected to test and measurement regime
3.3
parabolic profile parameter

parameter which describes the refractive index profile of waveguide according to the following

equation
 g 
 r
 
n 1− 2∆ r< a
   
n(r)=
 
 
 
n 1− 2∆ r> a
 
where
g is the parabolic profile parameter;
a is the core radius;
r is the radial distance from core centre;
n is the refractive index at r = 0;
2 2 2

Δ is given by the relation ∆=(n − n )/ 2n , where n again is the refractive index at r = 0,

1 2 1 1

i.e. at the axis, and n is the refractive index at the outer edge of the core, i.e. at r = a

3.4
launch conduit

structure or mechanism which guides light from the measurement test source to the input

facet of the optical channel under test

Note 1 to entry: Examples include optical fibres, optical waveguides or optical trains.

3.5
capturing conduit

structure or mechanism which guides light from the output facet of the optical channel under

test to a measurement device
3.6
top input axis of channel under test

axis defined by the tester within the plane of the input facet used as a reference, against

which the polarisation axis of the launch conduit can be defined
3.7
top output axis of channel under test

axis defined by the tester within the plane of the output facet used as a reference, against

which the polarisation axis of the capturing conduit can be defined
3.8
polarisation maintaining optical fibre

single-mode optical fibre in which linearly polarized light, if properly launched into the fibre,

maintains a linear polarisation during propagation, exiting the fibre in a specific

...