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EN 61189-2:1997/A1:2000

(Amendment)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

EN following parallel vote

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2: Méthodes d'essai des matériaux pour structures d'interconnexion

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

General Information

Status
Withdrawn
Publication Date
01-May-2000
ICS
31.180 - Printed circuits and boards
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
01-Sep-2009
Completion Date
01-Sep-2009
Ref Project
SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures

Relations

Amends
EN 61189-2:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Effective Date
29-Jan-2023
Replaced By
EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Effective Date
29-Jan-2023

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-2:2002 + A1:2002
01-maj-2002
1DGRPHãþD
SIST EN 60249-1:2001/A4:2001
SIST EN 60249-1:2002
SIST EN 61189-2:2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies - Part 2: Test methods for materials for interconnection
structures
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 2: Test methods for materials for interconnection structures
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen
Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 2: Méthodes d'essai des matériaux
pour structures d'interconnexion
Ta slovenski standard je istoveten z: EN 61189-2:1997/A1:2000
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-2:2002 + A1:2002 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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