EN IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-301: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotpaste mit feinen Lotpartikeln

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-301: Méthodes d’essai générales pour les matériaux et les assemblages - Pâte à braser à fines particules de brasage

L'IEC 61189-5-301:2021 spécifie les méthodes pour soumettre à essai les caractéristiques de la pâte à braser à fines particules de brasage (ci-après désignée pâte à braser). Le présent document s’applique à la pâte à braser à fines particules de brasage, telle que le type 6 et le type 7 spécifiés dans l’IEC 61190-1-2, ou à une pâte à braser à particules plus fines. Ce type de pâte à braser est utilisé pour connecter des câblages et composants sur des cartes imprimées à haute densité employées dans les équipements électroniques ou de communication ou tout appareillage similaire équipé de câblage fin (par exemple des largeurs minimales de conducteurs et des espaces minimaux entre conducteurs de 60 µm ou moins). Les méthodes d’essai pour les caractéristiques de la pâte à braser présentées dans le présent document tiennent compte de la force d’activation de la surface due à la finesse des particules de brasage qui peut affecter les résultats d’essais effectués selon les méthodes existantes.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke

General Information

• Status: Published
• Publication Date: 29-Apr-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 30-Apr-2021
• Completion Date: 30-Apr-2021
• Ref Project: SIST EN IEC 61189-5-301:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

Standards Content (Sample)

SLOVENSKI STANDARD
01-julij-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave
tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering
paste using fine solder particles
Ta slovenski standard je istoveten z: EN IEC 61189-5-301:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-5-301

NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-301: General
test methods for materials and assemblies - Soldering paste
using fine solder particles
(IEC 61189-5-301:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-
ensembles - Partie 5-301: Méthodes d'essai générales pour 301: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Pâte à braser à fines Baugruppen - Lötpaste mit feinen Lötpartikeln
particules de brasage (IEC 61189-5-301:2021)
(IEC 61189-5-301:2021)
This European Standard was approved by CENELEC on 2021-04-21. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-5-301:2021 E

European foreword
The text of document 91/1655/CDV, future edition 1 of IEC 61189-5-301, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-301:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-01-21
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-04-21
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-301:2021 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61189-5-3 2015 Test methods for electrical materials, printed EN 61189-5-3 2015
boards and other interconnection structures
and assemblies - Part 5-3: General test
methods for materials and assemblies -
Soldering paste for printed board
assemblies
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly - Part 1-2: Requirements for
soldering pastes for high-quality
interconnects in electronics assembly
ISO 857-2 - Welding and allied processes - Vocabulary - - -
Part 2: Soldering and brazing processes
and related terms
IEC 61189-5-301 ®
Edition 1.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-301: General test methods for materials and assemblies – Soldering

paste using fine solder particles

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-301: Méthodes d’essai générales pour les matériaux et les

assemblages – Pâte à braser à fines particules de brasage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9534-2

– 2 – IEC 61189-5-301:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Powder particle size distribution measurement . 7
4.1 General . 7
4.2 Powder particle size distribution measurement – Scanning electron
microscope . 7
4.2.1 Object . 7
4.2.2 Equipment/apparatus . 7
4.2.3 Procedure . 7
4.2.4 Evaluation . 7
4.3 Powder particle size distribution measurement – Laser diffraction . 7
4.3.1 Object . 7
4.3.2 Equipment/apparatus . 7
4.3.3 Procedure . 7
4.3.4 Evaluation . 8
4.4 Powder particle size distribution measurement – Digital microscope . 8
4.4.1 Object . 8
4.4.2 Equipment/apparatus . 8
4.4.3 Procedure . 8
4.4.4 Evaluation . 8
5 Solder paste viscosity . 8
5.1 Method A:Trace spiral pump method . 8
5.1.1 Object . 8
5.1.2 Equipment/apparatus . 9
5.1.3 Procedure . 9
5.1.4 Evaluation . 10
5.2 Method B: Spiral pump method (IEC 61189-5-3, Test 5-3X06: Solder paste
viscosity – Spiral pump method (applicable to 300 Pa·s) . 10
5.2.1 Object . 10
5.2.2 Test specimen . 10
5.2.3 Equipment/apparatus . 10
5.2.4 Procedure . 10
5.2.5 Evaluation . 11
5.3 Additional information . 11
6 Printability test. 12
6.1 Object . 12
6.2 Equipment/apparatus . 12
6.3 Procedure . 14
6.4 Evaluation . 14
7 Slump test . 15
7.1 Object . 15
7.2 Equipment/apparatus . 15
7.3 Procedure . 15
7.4 Evaluation . 16
8 Reflow test . 16

IEC 61189-5-301:2021 © IEC 2021 – 3 –
8.1 Object . 16
8.2 Equipment/apparatus . 16
8.3 Procedure . 16
8.4 Evaluation . 17
9 High temperature observation test . 18
9.1 Object . 18
9.2 Equipment/apparatus . 18
9.3 Procedure . 20
9.4 Evaluation . 21
Annex A (informative)  Example of the test report on powder particle size distribution
measurement . 22
Annex B (informative) Example of the test report on viscosity characteristics . 23
Annex C (informative) Example of the test report on printability test . 24
C.1 Test report form . 24
C.2 Test report entry example .
...