EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

Werkstoffe für Leiterplatten und andere Verbindungsstrukturen - Teil 2-51: Kaschierte und unkaschierte verstärkte Basismaterialien - Basismaterial als Chipträger, nicht kaschiert

Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués

L’IEC 61249-2-51:2023 spécifie les exigences relatives à la construction, aux matériaux et aux propriétés, ainsi qu’à l’assurance qualité, à l’emballage, au marquage et au stockage des matériaux de base pour bande support de carte à circuit intégré, non plaqués (ici désignés par matériaux de base pour bande support de CI). Le présent document s’applique aux matériaux de base pour bande support de CI ; il s’agit d’un matériau recouvert de colle, un côté étant composé d’une sous-couche époxy renforcée en tissu de verre de type E, l’autre côté étant recouvert d’un adhésif et protégé par une pellicule antiadhésive.

Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del: Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove kartic integriranih vezij, neprevlečeni

Standard IEC 61249-2-51:2023 določa zasnovo, materiale, zahteve glede lastnosti, zagotavljanje kakovosti, pakiranje, označevanje in shranjevanje osnovnih materialov za nosilne trakove kartic integriranih vezij, in sicer neprevlečene.
Ta dokument se uporablja za osnovne materiale za nosilne trakove kartic integriranih vezij, tj. za spodnjo plast iz epoksidne smole, ojačano s tkanim E-steklom, ki sestavlja eno stran, druga stran pa je prekrita z lepilom in zaščitena z zaščitno folijo.

General Information

• Status: Published
• Publication Date: 15-Jun-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 16-Jun-2023
• Due Date: 24-Nov-2023
• Completion Date: 16-Jun-2023
• Ref Project: SIST EN IEC 61249-2-51:2023 - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61249-2-51:2023
01-september-2023
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del:
Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove
kartic integriranih vezij, neprevlečeni
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced
base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,
unclad
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen – Teil 2-51: Verstärkte
Basismaterialien, kaschiert und nicht kaschiert – Basismaterialien für Trägerbänder für
integrierte Schaltungen, nicht kaschiert
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51:
Matériaux de base renforcés, recouverts ou non - Matériaux de base pour bande support
de carte à circuit intégré, non recouverts
Ta slovenski standard je istoveten z: EN IEC 61249-2-51:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
SIST EN IEC 61249-2-51:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61249-2-51:2023

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SIST EN IEC 61249-2-51:2023


EUROPEAN STANDARD EN IEC 61249-2-51

NORME EUROPÉENNE

EUROPÄISCHE NORM June 2023
ICS 31.180

English Version
Materials for printed boards and other interconnecting structures
- Part 2-51: Reinforced base materials, clad and unclad - Base
materials for integrated circuit card carrier tape, unclad
(IEC 61249-2-51:2023)
Matériaux pour circuits imprimés et autres structures Werkstoffe für Leiterplatten und andere
d'interconnexion - Partie 2-51: Matériaux de base renforcés, Verbindungsstrukturen - Teil 2-51: Kaschierte und
plaqués et non plaqués - Matériaux de base pour bande unkaschierte verstärkte Basismaterialien - Basismaterial als
support de carte à circuit intégré, non plaqués Chipträger, nicht kaschiert
(IEC 61249-2-51:2023) (IEC 61249-2-51:2023)
This European Standard was approved by CENELEC on 2023-06-15. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61249-2-51:2023 E

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SIST EN IEC 61249-2-51:2023
EN IEC 61249-2-51:2023 (E)
European foreword
The text of document 91/1847/FDIS, future edition 1 of IEC 61249-2-51, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61249-2-51:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-15
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-15
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61249-2-51:2023 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated
...