EN 60749-20-1:2009

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage

La CEI 60749-20-1:2009 s'applique aux boîtiers CMS non hermétiques qui sont soumis aux procédés de brasage par refusion et qui sont exposés à l'air ambiant. L'objet de ce document est de fournir aux fabricants et aux utilisateurs de CMS des méthodes normalisées pour la manipulation, l'emballage, le transport et l'utilisation des CMS sensibles à l'humidité/la refusion qui sont classés selon les niveaux définis dans la CEI 60749-20. Ces méthodes sont fournies pour éviter les dommages provoqués par l'absorption d'humidité et l'exposition aux températures de brasage par refusion pouvant donner lieu à une dégradation de rendement et de fiabilité. L'utilisation de ces procédures permet une refusion sûre et ne causant pas de dommages, avec le procédé d'emballage avec dessiccant, ce qui permet une durée minimale de stockage dans des sacs scellés avec dessiccant à compter de la date de scellement.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 20-1. del: Obdelava, pakiranje, označevanje in pošiljanje elementov za površinsko montažo (SMD), občutljivih na učinkovanje vlage in spajkalne vročine (IEC 60749-20-1:2009)

General Information

• Status: Published
• Publication Date: 04-Jun-2009
• Withdrawal Date: 30-Apr-2012
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 05-Jun-2009
• Completion Date: 05-Jun-2009
• Ref Project: SIST EN 60749-20-1:2009 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-20-1:2009
01-september-2009
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2EGHODYDSDNLUDQMHR]QDþHYDQMHLQSRãLOMDQMHHOHPHQWRY]DSRYUãLQVNRPRQWDåR
60'REþXWOMLYLKQDXþLQNRYDQMHYODJHLQVSDMNDOQHYURþLQH,(&
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling,
packing, labelling and shipping of surface mount devices sensitive to the combined effect
of moisture and soldering heat (IEC 60749-20-1:2009)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1:
Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer
Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind
(IEC 60749-20-1:2009)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20
-1: Manipulation, emballage, étiquetage et transport des composants pour montage en
surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage (CEI 60749-
20-1:2009)
Ta slovenski standard je istoveten z: EN 60749-20-1:2009
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-20-1:2009 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-20-1:2009

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SIST EN 60749-20-1:2009

EUROPEAN STANDARD
EN 60749-20-1

NORME EUROPÉENNE
June 2009
EUROPÄISCHE NORM

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 20-1: Handling, packing, labelling and shipping
of surface-mount devices sensitive to the combined effect
of moisture and soldering heat
(IEC 60749-20-1:2009)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques - Prüfverfahren -
Partie 20-1: Manipulation, emballage, Teil 20-1: Handhabung, Verpackung,
étiquetage et transport des composants Kennzeichnung und Transport
pour montage en surface sensibles oberflächenmontierbarer Bauelemente,
à l'effet combiné de l'humidité die empfindlich gegen die Kombination
et de la chaleur de brasage von Feuchte und Lötwärme sind
(CEI 60749-20-1:2009) (IEC 60749-20-1:2009)


This European Standard was approved by CENELEC on 2009-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels


© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-20-1:2009 E

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SIST EN 60749-20-1:2009
EN 60749-20-1:2009 - 2 -
Foreword
The text of document 47/2010/FDIS, future edition 1 of IEC 60749-20-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-20-1 on 2009-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2010-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-20-1:2009 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60749-37 NOTE  Harmonized as EN 60749-37:2008 (not modified).
IEC 60749-39 NOTE  Harmonized as E
...