EN IEC 60749-15:2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15: Résistance à la température de brasage pour dispositifs par trous traversants

IEC 60749-15:2020 est disponible sous forme de IEC 60749-15:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 60749-15:2020 décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague. Dans le but d'établir une procédure d'essai normalisée pour les méthodes les plus reproductibles, la méthode d'immersion dans la brasure est utilisée en raison de ses conditions plus contrôlables. Cette procédure détermine si les dispositifs sont capables de résister à la température de brasage rencontrée lors d'opérations de fabrication des cartes à câblage imprimé, sans endommager leurs caractéristiques électriques ou leurs connexions internes. Cet essai est destructif et il peut être utilisé en vue de la qualification, de l’acceptation de lots et pour contrôler les produits. La chaleur du brasage se propage dans le boîtier du dispositif par les broches de l'autre côté de la carte. Cette procédure ne simule pas l'exposition à la chaleur du brasage à la vague ou à la chaleur de refusion sur le même côté de la carte que le corps du boîtier. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout de l'Article 3, Termes et définitions; - clarification sur l'utilisation d'un fer à braser pour produire un effet thermique; - ajout d'une option relative à l'utilisation du vieillissement accéléré.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del: Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah (IEC 60749-15:2020)

General Information

• Status: Published
• Publication Date: 24-Sep-2020
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 25-Sep-2020
• Completion Date: 25-Sep-2020
• Ref Project: SIST EN IEC 60749-15:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)

Relations

• Replaces: EN 60749-15:2010/AC:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 24-Jan-2023
• Replaces: EN 60749-15:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 28-May-2019

Overview

EN IEC 60749-15:2020 (CLC adoption of IEC 60749-15:2020) specifies a reproducible test method to assess the resistance to soldering temperature of encapsulated solid‑state devices intended for through‑hole mounting. The standard defines a controlled solder dip procedure that determines whether devices can withstand the thermal stresses encountered during printed wiring board assembly (wave soldering conditions), without degradation of electrical characteristics or internal connections. The test is intentionally destructive and intended for qualification, lot acceptance and product monitoring.

Key topics and technical requirements

• Test method: Solder dip immersion is used because it provides more controllable and reproducible thermal exposure than full wave simulation. The heat is conducted through the leads into the package from solder on the reverse side of the board.
• Solder types and temperatures:
  • Sn–Pb solder: 260 ± 5 °C
  • Pb‑free solder: 270 ± 5 °C
• Immersion parameters (from Table 1):
  • Number of immersions: ≤ 2
  • Immersion/emersion rate: 25 ± 6 mm/s
  • Dwell time in solder: Sn–Pb: 10 s; Pb‑free: 7 s (tolerances typically +2 s / −1 s)
• Apparatus and materials:
  • Solder pot sized to contain ≥1 kg solder and permit full lead immersion without bottom contact.
  • Mechanical dipping device to control immersion/emersion rates and dwell time.
  • Specified solder alloys (e.g., Sn60Pb40 or Sn63Pb37 for Sn–Pb) and appropriate flux.
  • Optional heatsinks or shielding attached as required by product specification.
• Additional procedural elements:
  • Pre‑conditioning and optional accelerated ageing may be used.
  • Clarified allowance for use of a soldering iron to produce heating effects where applicable.
  • Pass/fail criteria based on degradation of electrical characteristics or internal connections (see relevant clauses).

Applications and users

• Target users:
  • Semiconductor device manufacturers performing qualification and lot acceptance testing.
  • PCB assembly and reliability engineers evaluating device robustness to soldering heat.
  • Test laboratories offering standardized mechanical/climatic tests for through‑hole components.
• Practical uses:
  • Verifying thermal robustness for legacy through‑hole parts and mixed‑technology boards.
  • Supporting reliability claims for devices supplied to aerospace, industrial, automotive and consumer electronics sectors where through‑hole assembly is used.
  • Comparing performance of Sn–Pb vs. Pb‑free solder processes during product design and process validation.

Related standards

• IEC 60068‑2‑20 (Test T: solderability and resistance to soldering heat)
• IEC 60749‑3 (External visual examination)
• IEC 60749‑8 (Sealing)

Keywords: EN IEC 60749‑15:2020, resistance to soldering temperature, through‑hole mounted devices, solder dip test, solderability, Pb‑free solder, semiconductor test methods.

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2020
Nadomešča:
SIST EN 60749-15:2011
SIST EN 60749-15:2011/AC:2011
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del:
Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah
(IEC 60749-15:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to
soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15:
Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC
60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15:
Résistance à la température de soudage pour dispositifs par trous traversants (IEC
60749-15:2020)
Ta slovenski standard je istoveten z: EN IEC 60749-15:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60749-15

NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2020
ICS 31.080.01 Supersedes EN 60749-15:2010 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 15: Resistance to soldering temperature for through-hole
mounted devices
(IEC 60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 15: Résistance à la Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur
température de brasage pour dispositifs par trous bei Bauelementen zur Durchsteckmontage
traversants (IEC 60749-15:2020)
(IEC 60749-15:2020)
This European Standard was approved by CENELEC on 2020-08-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-15:2020 E

European foreword
The text of document 47/2630/FDIS, future edition 3 of IEC 60749-15, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-15:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-05-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-08-18
document have to be withdrawn
This document supersedes EN 60749-15:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 60749-15:2020 was approved by CENELEC as a European
Standard without any modification.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - - -
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60749-3 - Semiconductor devices - Mechanical and EN 60749-3 -
climatic test methods - Part 3: External
visual examination
IEC 60749-8 - Semiconductor devices - Mechanical and EN 60749-8 -
climatic test methods - Part 8: Sealing

IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques

et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous

traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8604-3

– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9

Table 1 – Parameters for solder dipping. 6

IEC 60749-15:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
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