EN 61837-1:2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240.

Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 1: Kunststoffgehäuse

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulées

La CEI 61837-1:2012 traite des encombrements normalisés et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence, applicables aux enveloppes en plastique moulées, et elle est basée sur la CEI 61240.

Površinsko nameščeni piezoelektrični elementi za regulacijo in izbiranje frekvence - Standardne mere in priključni izvodi - 1. del: Mere plastičnih okrovov

Ta del standarda IEC 61837 obravnava standardne mere in priključne izvode, ki se uporabljajo pri površinsko nameščenih piezoelektričnih elementih (SMD) za regulacijo in izbiranje frekvence na plastičnih okrovih, in temelji na standardu IEC 61240.

General Information

• Status: Published
• Publication Date: 16-Aug-2012
• Withdrawal Date: 24-May-2015
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: CLC/SR 49 - Piezoelectric and dielectric devices for frequency control and selection
• Drafting Committee: IEC/TC 49 - IEC_TC_49
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 17-Aug-2012
• Completion Date: 17-Aug-2012
• Ref Project: SIST EN 61837-1:2012 - Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 1 : Plastic moulded enclosure outlines

Relations

• Replaces: EN 61837-1:1999 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2012
3RYUãLQVNRQDPHãþHQLSLH]RHOHNWULþQLHOHPHQWL]DUHJXODFLMRLQL]ELUDQMHIUHNYHQFH
6WDQGDUGQHPHUHLQSULNOMXþQLL]YRGLGHO0HUHSODVWLþQLKRNURYRY
Surface mounted piezoelectric devices for frequency control and selection - Standard
outline and terminal lead connections - Part 1 : Plastic moulded enclosure outlines
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -
Selektion - Norm-Gehäusemaße und Anschlüsse -- Teil 1: Kunststoffgehäuse
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la
fréquence - Encombrements normalisés et connexions des sorties - Partie 1:
Encombrements des enveloppes en plastique moulées
Ta slovenski standard je istoveten z: EN 61837-1:2012
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61837-1
NORME EUROPÉENNE
August 2012
EUROPÄISCHE NORM
ICS 31.140 Supersedes EN 61837-1:1999

English version
Surface mounted piezoelectric devices for frequency control and
selection -
Standard outlines and terminal lead connections -
Part 1: Plastic moulded enclosure outlines
(IEC 61837-1:2012)
Dispositifs piézoélectriques à montage  Oberflächenmontierbare piezoelektrische
en surface pour la commande et le choix Bauteile zur Frequenzstabilisierung und -
de la fréquence - selektion -
Encombrements normalisés et connexions Norm-Gehäusemaße und Anschlüsse -
des sorties - Teil 1: Kunststoffgehäuse
Partie 1: Encombrements des enveloppes (IEC 61837-1:2012)
en plastique moulées
(CEI 61837-1:2012)
This European Standard was approved by CENELEC on 2012-05-25. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61837-1:2012 E
Foreword
The text of document 49/930/CDV, future edition 2 of IEC 61837-1, prepared by IEC/TC 49
"Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61837-1:2012.
The following dates are fixed:
(dop) 2013-02-25
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2015-05-25
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61837-1:1999.

EN 61837-1:1999:
- one enclosure type (SIP-L5/01) has been deleted;
- configuration symbol of enclosures is currently consolidated into one as DCC (dual chip carrier).

This standard shall be read in conjunction with EN 61240:1997.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61837-1:2012 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 61837-1:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 61240 1994 Piezoelectric devices - Preparation of outline EN 61240 1997
drawings of surface-mounted devices (SMD)
for frequency control and selection - General
rules
IEC 61837-1 ®
Edition 2.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 1: Encombrements des enveloppes en plastique moulées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.140 ISBN 978-2-8322-0078-0

– 2 – 61837-1 © IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Plastic moulded enclosure dimensions . 6
6 Lead connections . 6
7 Plastic moulded enclosures . 6

Table 1 – Designation of plastic moulded enclosures . 6

61837-1 © IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
lnternational Standard IEC 61837-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This second edition cancels and replaces the first edition published in 1999. It is a technical
revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• one enclosure type (SIP-L5/01) has been deleted;
• Configuration symbol of enclosures is currently consolidated into one as DCC (dual chip
carrier).
– 4 – 61837-1 © IEC:2012
The text of this standard is based on the following documents:
CDV Report on voting
49/930/CDV 49/969/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This lnternational Standard shall be read in conjunction with IEC 61240:1994. IEC 61240:1994
deals with standard outlines and terminal lead connections as they apply to SMDs for frequency
control and selection in plastic moulded enclosures.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC web site.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
61837-1 © IEC:2012 – 5 –
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply
to SMDs for frequency control and selection in plastic moulded enclosures and is based on
IEC 61240.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240: 1994, Piezoelectric devices – Preparation of outline drawings of surface-mounted
devices (SMD), for frequency control and selection – General rules
3 Configuration of enclosures
These enclosures are made of plastic moulded materials with the terminal leads based on the
descriptive designation system for semiconductors, devices package.
The configuration symbol
...