EN 60068-2-69:2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows: - Inclusion of lead-free alloy test conditions; - Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; - Inclusion of new component types, and updating test parameters for the whole component list.

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage

Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage

La CEI 60068-2-69:2007 spécifie l'essai Te, la méthode de la balance de mouillage en bain d'alliage et méthode de la balance de mouillage à la goutte d'alliage, applicables aux composants de montage en surface. Ces méthodes permettent de déterminer quantitativement la brasabilité des sorties sur les composants de montage en surface. La CEI 60068-2-54, qu'il convient de consulter le cas échéant, est également disponible pour les composants de montage en surface. Les modes opératoires décrivent la méthode de la balance de mouillage en bain d'alliage ainsi que la méthode de la balance de mouillage à la goutte d'alliage, ces deux méthodes étant par ailleurs applicables aux composants munis de sorties métalliques et plots de soudage métallisés. La présente norme fournit les modes opératoires normalisés pour les alliages de brasage tendre contenant du plomb (Pb) et pour les alliages de brasage sans plomb. Cette deuxième édition annule et remplace la première édition parue en 1995, dont elle constitue une révision technique. Les principales modifications apportées par rapport à l'édition précédente sont les suivantes: - Intégration des conditions d'essai des alliages sans plomb; - Intégration de nouveaux flux à des fins d'essai, avec description de l'évolution des flux développés dans l'industrie au cours des 20 dernières années; - Intégration de nouveaux types de composants, et actualisation des paramètres d'essai pour la liste complète des composants.

Okoljski preskusi - 2. del: Preskusi - Preskus Te: Preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za določanje omočljivosti (IEC 60068-2-69:2007)

General Information

• Status: Withdrawn
• Publication Date: 21-Jun-2007
• Withdrawal Date: 31-May-2010
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 11-Apr-2020
• Completion Date: 11-Apr-2020
• Ref Project: SIST EN 60068-2-69:2008 - Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Relations

• Replaces: EN 60068-2-69:1996 - Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
• Effective Date: 29-Jan-2023
• Replaced By: EN 60068-2-69:2017 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• Effective Date: 06-Jun-2017

Standards Content (Sample)

SLOVENSKI STANDARD
01-februar-2008
1DGRPHãþD
SIST EN 60068-2-69:2001
2NROMVNLSUHVNXVLGHO3UHVNXVL3UHVNXV7H3UHVNXVVSDMNDQMDHOHNWURQVNLK
NRPSRQHQW]DSRYUãLQVNRPRQWDåR60']PHWRGR]DGRORþDQMHRPRþOMLYRVWL,(&

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method
Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage
Ta slovenski standard je istoveten z: EN 60068-2-69:2007
ICS:
19.040
31.190
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60068-2-69
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 19.040; 31.190 Supersedes EN 60068-2-69:1996

English version
Environmental testing -
Part 2-69: Tests -
Test Te: Solderability testing of electronic components
for surface mounting devices (SMD) by the wetting balance method
(IEC 60068-2-69:2007)
Essais d'environnement -  Umgebungseinflüsse -
Partie 2-69: Essais - Teil 2-69: Prüfungen -
Essai Te: Essai de brasabilité Prüfung Te: Prüfung der Lötbarkeit
des composants électroniques von Bauelementen der Elektronik
pour les composants pour montage für Oberflächenmontage (SMD)
en surface (CMS) par la méthode mit der Benetzungswaage
de la balance de mouillage (IEC 60068-2-69:2007)
(CEI 60068-2-69:2007)
This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-69:2007 E
Foreword
The text of document 91/648/FDIS, future edition 2 of IEC 60068-2-69, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60068-2-69 on 2007-06-01.
This European Standard supersedes EN 60068-2-69:1996.
The main changes from EN 60068-2-69:1996 are as follows:
– inclusion of lead-free alloy test conditions;
– inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry
in the past 20 years;
– inclusion of new component types, and updating test parameters for the whole component list.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-69:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-44 NOTE  Harmonized as EN 60068-2-44:1995 (not modified).
IEC 61190-1-1 NOTE  Harmonized as EN 61190-1-1:2002 (not modified).
ISO 9453 NOTE  Harmonized as EN ISO 9453:2006 (not modified).
ISO 9454-1 NOTE  Harmonized as EN 29454-1:1993 (not modified).
__________
- 3 - EN 60068-2-69:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 60068-1 - Environmental testing - EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-20 1979 Environmental testing -
+ A2 1987 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988

IEC 60068-2-54 2006 Environmental testing - EN 60068-2-54 2006
Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the
wetting balance method
IEC 61190-1-3 2002 Attachment materials for electronic EN 61190-1-3 2002
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

ISO 683 Series Heat-treatable steels, alloy steels and - -
free-cutting steels
ISO 6362 Series Wrought aluminium and aluminium alloy - -
extruded rods/bars, tubes and profiles

1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 60068-2-69
Second edition
2007-05
Environmental testing –
Part 2-69:
Tests – Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
PRICE CODE
Commission Electrotechnique Internationale T
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60068-2-69 © IEC:2007(E)
CONTENTS
FOREWORD.3

1 Scope.5
2 Normative references .5
3 Terms and definitions .6
4 General description of the method .6
5 Description of the test apparatus .6
6 Preconditioning .7
6.1 Preparation of specimens .7
6.2 Ageing.7
7 Materials .7
7.1 Solder .7
7.2 Flux.8
8 Procedures.8
8.1 Test temperature.8
8.2 Solder bath wetting balance procedure.8
8.3 Solder globule wetting balance procedure .11
9 Presentation of results.14
9.1 Form of force versus time trace .14
9.2 Test requirements .15
10 Information to be given in the relevant specification .15

Annex A (normative) Equipment specification .16
Annex B (informative) Use of the wetting balance for SMD solderability testing .18

Bibliography.25

Figure 1 – Test apparatus.6
Figure 2 – Typical wetting balance trace .14

Table 1 – Recommended solder bath wetting balance test conditions .10
Table 2 – Time sequence of the test (solder bath) .11
Table 3 – Recommended solder globule wetting balance test conditions.12
Table 4 – Time sequence of the test (Solder globule) .13

60068-2-69 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1995 and constitutes a
technical revision. The main changes from the previous edition are as follows:
– Inclusion of lead-free alloy test conditions;
– Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in
the industry in the past 20 years;
– Inclusion of new component types, and updating test parameters for the whole component
list.
– 4 – 60068-2-69 © IEC:2007(E)
The text of this standard is based on the following documents:
FDIS Report on voting
91/648/FDIS 91/680/RVD
Full information on the voting for the approval of
...