This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.

    • sale 10% off
    • Standard
      29 pages
      English language
    • e-Library read for
      1 day

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

    • sale 15% off
    • Technical report
      115 pages
      English language

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

    • sale 10% off
    • Standard
      48 pages
      English language
    • e-Library read for
      1 day

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
...
view more

    • sale 15% off
    • Standard
      38 pages
      English and French language

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...
view more

    • sale 15% off
    • Standard
      112 pages
      English and French language

This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of
electric or electronic components and mechanical parts such as punched/stamped parts (for
example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit
pins and other mechanical parts used in electronic assemblies) representing the finished
stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds,
plastics and the like during the requi...
view more

    • sale 10% off
    • Standard
      35 pages
      English language
    • e-Library read for
      1 day

IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press‑fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test...view more

    • sale 10% off
    • Standard
      35 pages
      English language
    • e-Library read for
      1 day

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

    • sale 15% off
    • Technical report
      12 pages
      English language

This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

    • sale 10% off
    • Standard
      10 pages
      English language
    • e-Library read for
      1 day
    • sale 10% off
    • Standard
      10 pages
      English language
    • e-Library read for
      1 day

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. Th...view more

    • sale 10% off
    • Standard
      48 pages
      English language
    • e-Library read for
      1 day

IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processe...
view more

    • sale 15% off
    • Standard
      89 pages
      English and French language

This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic ...
view more

    • sale 10% off
    • Standard
      46 pages
      English language
    • e-Library read for
      1 day