31.190 - Electronic component assemblies
Electronic component assemblies
Elektronische Baugruppen
Assemblages de composants electroniques
Sestavljeni elektronski elementi
General Information
This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.
- Standard29 pagesEnglish language
sale 10% off- e-Library read for1 day
- Corrigendum3 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
- Technical report115 pagesEnglish language
sale 15% off
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.
- Standard48 pagesEnglish language
sale 10% off- e-Library read for1 day
- Corrigendum3 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
...view more
- Standard38 pagesEnglish and French language
sale 15% off
IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...view more
- Standard112 pagesEnglish and French language
sale 15% off
This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of
electric or electronic components and mechanical parts such as punched/stamped parts (for
example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit
pins and other mechanical parts used in electronic assemblies) representing the finished
stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds,
plastics and the like during the requi...view more
- Standard35 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press‑fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test...view more
- Standard35 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
- Technical report12 pagesEnglish language
sale 15% off
This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
- Standard10 pagesEnglish language
sale 10% off- e-Library read for1 day
- Standard10 pagesEnglish language
sale 10% off- e-Library read for1 day
NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. Th...view more
- Standard48 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processe...view more
- Standard89 pagesEnglish and French language
sale 15% off
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic ...view more
- Standard46 pagesEnglish language
sale 10% off- e-Library read for1 day
- Amendment9 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC corrigendum
- Corrigendum6 pagesEnglish language
sale 10% off- e-Library read for1 day
- Amendment7 pagesEnglish language
sale 10% off- e-Library read for1 day
- Amendment9 pagesEnglish language
sale 10% off- e-Library read for1 day
IEC corrigendum
- Corrigendum6 pagesEnglish language
sale 10% off- e-Library read for1 day