EN 60068-2-58:2004

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Okoljsko preskušanje – 2-58. del: Preskusi - Preskus Td: Preskusna metoda za spajkanje, odpornost površinsko montiranih komponent (SMD) proti razkrajanju pokovinjenja in vročini spajke

General Information

• Status: Withdrawn
• Publication Date: 30-Sep-2004
• Withdrawal Date: 31-Aug-2007
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-May-2018
• Completion Date: 01-May-2018
• Ref Project: SIST EN 60068-2-58:2005 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Relations

• Replaces: EN 60068-2-58:1999 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 28-Jan-2023
• Replaced By: EN 60068-2-58:2015 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60068-2-58:2005

STANDARD
september 2005
Okoljsko preskušanje – 2-58. del: Preskusi - Preskus Td: Preskusna metoda
za spajkanje, odpornost površinsko montiranih komponent (SMD) proti
razkrajanju pokovinjenja in vročini spajke
Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
ICS 19.040; 31.190 Referenčna številka
SIST EN 60068-2-58:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60068-2-58
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2004

ICS 19.040; 31.190 Supersedes EN 60068-2-58:1999


English version

Environmental testing
Part 2-58: Tests –
Test Td: Test methods for solderability,
resistance to dissolution of metallization and
to soldering heat of surface mounting devices (SMD)
(IEC 60068-2-58:2004)

Essais d'environnement Umweltprüfungen
Partie 2-58: Essais – Teil 2-58: Prüfungen –
Essai Td: Méthodes d'essai Prüfung Td: Prüfverfahren für
de la soudabilité, de la résistance Lötbarkeit, Widerstandsfähigkeit
de la métallisation à la dissolution gegenüber Auflösen der Metallisierung
et de la résistance à la chaleur und Lötwärmebeständigkeit
de soudage des composants bei oberflächenmontierbaren
pour montage en surface (CMS) Bauelementen (SMD)
(CEI 60068-2-58:2004) (IEC 60068-2-58:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60068-2-58:2004 E

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EN 60068-2-58:2004 - 2 -
Foreword
The text of document 91/447/FDIS, future edition 3 of IEC 60068-2-58, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 60068-2-58 on 2004-09-01.
This European Standard supersedes EN 60068-2-58:1999.
This European Standard includes the following significant technical changes with respect to
EN 60068-2-58:1999:
– expansion of the scope so that it includes lead-free solder alloy in addition to the existing tin-lead
eutectic or near eutectic solder alloy (the structure of the document has been changed
accordingly);
– addition of the definitions "solderability" and "resistance to soldering heat" for SMDs;
– specification of the re flow temperature profiles for the resistance to soldering heat using lead-free
solder;
– addition of an Annex C enabling a quick overview of the test conditions.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-58:2004 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-4 NOTE Harmonized as EN 60068-2-4:1995 (not modified).
IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54:1987 (not modified).
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69:1996 (not modified).
__________

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- 3 - EN 60068-2-58:2004
Annex ZA
(normative)

Norm
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