Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.

Umgebungseinflüsse - Teil 2-82: Prüfungen - Prüfung XW1: Whisker-Prüfverfahren für elektronische und elektrische Bauelemente

Essais d’environnement - Partie 2-82: Essais – Essai XW1: Méthodes de vérification des trichites pour les composants électroniques et électriques

La CEI 60068-2-82:2007 spécifie des essais de vérification de la présence de trichites pour les composants électriques ou électroniques qui représentent la phase de finition, avec un fini en étain ou en alliage d'étain. Toutefois, la norme ne spécifie aucun essai pour les trichites susceptibles de se développer du fait d'une contrainte mécanique externe. L'utilisation de la présente méthode d'essai relève d'une spécification correspondante (spécification de composants ou d'application internationale) avec transfert des sévérités d'essai à appliquer et avec des critères d'acceptation définis. Lorsqu'il est prévu d'effectuer les essais décrits dans la présente norme pour d'autres composants, par exemple les pièces mécaniques utilisées dans les équipements électriques ou électroniques, il convient de s'assurer que le matériau constitutif et les mécanismes de développement des trichites sont comparables.

Okoljsko preskušanje – 2-82. del: Preskusi - Preskus Tx: Preskusna metoda za nitke pri elektronskih in električnih komponentah (IEC 60068-2-82:2007)

General Information

Status
Withdrawn
Publication Date
21-Jun-2007
Withdrawal Date
31-May-2010
Drafting Committee
Parallel Committee
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
18-Jun-2022
Completion Date
18-Jun-2022

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SLOVENSKI STANDARD
01-oktober-2007
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Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic
and electric components
Umgebungseinflüsse – Teil 2-82: Prüfungen – Prüfung Tx: Whisker-Prüfverfahren für
elektronische und elektrische Bauelemente
Essais d'environnement - Partie 2-82 : Essais - Essai Tx : Méthodes d'essai des trichites
("moustaches/whiskers") pour les composants électriques et électroniques
Ta slovenski standard je istoveten z: EN 60068-2-82:2007
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60068-2-82
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 19.040; 31.190
English version
Environmental testing -
Part 2-82: Tests -
Test Tx: Whisker test methods for electronic
and electric components
(IEC 60068-2-82:2007)
Essais d'environnement -  Umgebungseinflüsse -
Partie 2-82: Essais - Teil 2-82: Prüfungen -
Essai Tx: Méthodes d'essai Prüfung Tx: Whisker-Prüfverfahren
des trichites ("moustaches/whiskers") für elektronische
pour les composants électriques und elektrische Bauelemente
et électroniques (IEC 60068-2-82:2007)
(CEI 60068-2-82:2007)
This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-82:2007 E
Foreword
The text of document 91/651/FDIS, future edition 1 of IEC 60068-2-82, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60068-2-82 on 2007-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-82:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60068-3-4 NOTE  Harmonized as EN 60068-3-4:2001 (not modified).
__________
- 3 - EN 60068-2-82:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
Part 1: General and guidance
2) 3)
IEC 60068-2-14 - Environmental testing - EN 60068-2-14 1999
Part 2: Tests - Test N: Change of temperature

4)
IEC 60068-2-20 1979 Environmental testing - HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering

IEC 60068-2-58 2004 Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
2) 3)
IEC 60068-2-78 - Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
IEC 61192-3 2002 Workmanship requirements for soldered EN 61192-3 2003
electronic assemblies -
Part 3: Through-hole mount assemblies

IEC 61760-1 2006 Surface mounting technology - EN 61760-1 2006
Part 1: Standard method for the specification
of surface mounting components (SMDs)

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.
4)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.

INTERNATIONAL IEC
STANDARD 60068-2-82
First edition
2007-05
Environmental testing –
Part 2-82:
Tests – Test Tx: Whisker test methods for
electronic and electric components
PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60068-2-82 © IEC:2007(E)
CONTENTS
FOREWORD.4

1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Test equipment.7
4.1 Desiccator .7
4.2 Humidity chamber .7
4.3 Thermal cycling chamber.7
4.4 Optical microscope.7
4.5 Scanning electron microscope microscopy .7
4.6 Fixing jig .8
5 Preparation for test.8
5.1 General .8
5.2 Selection of test methods .8
5.3 Storage conditions prior to testing .8
5.4 Handling of the specimen .8
5.5 Preconditioning by heat treatment .8
5.6 Specimen preparation by leads forming.9
6 Test condition.10
6.1 Ambient test .10
6.2 Damp heat test.10
6.3 Temperature cycling test .10
7 Test schedule.11
7.1 Procedure for test method selection .11
7.2 Initial measurement .12
7.3 Test.12
7.4 Recovery.12
7.5 Intermediate or final assessment .12
8 Information to be given in the relevant specification .12
9 Minimum requirements for a test report .13

Annex A (normative) Measurement of the whisker length .14
Annex B (informative) Examples of whiskers.15
Annex C (informative) Guidance on the sample lots and test schedules .17
Annex D (informative) Guidance on acceptance criteria .19
Annex E (informative) Background on whisker growth.21
Annex F (informative) Background on ambient test .22
Annex G (informative) Background on damp heat test.24
Annex H (informative) Background on temperature cycling test.27

Bibliography.32

60068-2-82 © IEC:2007(E) – 3 –

Figure A.1 – Definition of the whisker length .14
Figure B.1 – Nodule.15
Figure B.2 – Column whisker .15
Figure B.3 – Filament whisker.15
Figure B.4 – Kinked whisker .16
Figure B.5 – Spiral whisker .16
Figure D.1 – Smallest distance of components and circuit boards .19
Figure F.1 – Whisker growth of tin plating in ambient test condition .23
Figure G.1 – Growth of the oxide layer in damp heat conditions.25
Figure G.2a – Growth of whiskers in damp heat conditions .25
Figure G.2b – Growth of whiskers in damp heat conditions .26
Figure G.2 – Growth of whiskers.26
Figure H.1 – Distribution of whisker length grown on FeNi (Alloy42) base material.28
Figure H.2 – Whisker grown on FeNi (Alloy42) base material.29
Figure H.3 – Relationship of Δϑ and number of cycles for whisker growth on FeNi
(Alloy 42) base material .29
Figure H.4 – Whisker growth on Cu based leadframes (QFP) in temperature cycling
tests .31

Table 1 – Methods of preconditioning: Soldering simulation .
Table 2 – Methods of preconditioning: Soldering.9
Table 3 – Severities of the ambient test .10
Table 4 – Severities of the temperature cycling test: temperature .10
Table 5 – Severities of the temperature cycling test: cycles .11
Table 6 – Suitability of test methods for different plating situations .11
Table H.1 – Example for a relationship between realistic application conditions and
test conditions .30

– 4 – 60068-2-82 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2–82: Tests – Test Tx: Whisker test methods
for electronic and electric components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-oper
...

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