prEN IEC 60068-2-83:2024
(Main)Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Essais d’environnement - Partie 2-83: Essais - Essai tf: Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
Okoljsko preskušanje - 2-83. del: Preskusi - Preskus tf: Preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje omočljivosti z uporabo spajkalne paste
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Standards Content (Sample)
SLOVENSKI STANDARD
01-oktober-2024
Okoljsko preskušanje - 2-83. del: Preskusi - Preskus tf: Preskus spajkanja
elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje
omočljivosti z uporabo spajkalne paste
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Essais d'environnement - Partie 2-83: Essais - Essai tf: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: prEN IEC 60068-2-83:2024
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
91/1968/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60068-2-83 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-08-30 2024-11-22
SUPERSEDES DOCUMENTS:
91/1910/CD, 91/1937/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
SC 23J,TC 40,TC 47,SC 47D,SC 48B,TC 51
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for Vote
(CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC c lauses.
(SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface
mounting devices (SMD) by the wetting balance method using solder paste
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
This document was revised according to 91/1937/CC and the result of the deliberations at the TC91/WG3 meeting in
June 2024.
Issuance of the CDV was agreed at the TC91/WG3 meeting in June 2024.
file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You may not copy
or "mirror" the file or printed version of the document, or any part of it, for any other purpose without permission in writi ng from
IEC.
91/1968/CDV - 2 - IEC CDV 60068-2-83 © IEC 2024
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Test . 8
4.1 General description . 8
4.2 Test methods . 8
5 Preconditioning . 8
6 Preparation . 8
6.1 Solder paste . 8
6.2 Test jig plate . 9
6.3 Specimen holder . 9
7 Quick heating method . 9
7.1 Equipment . 9
7.2 Test jig plate . 10
7.3 Preparation . 11
7.4 Test condition. 11
7.4.1 Test temperature. 11
7.4.2 Feed of solder paste and immersion condition . 12
7.4.3 Immersion and withdrawal conditions for test specimen . 12
7.5 Test procedure . 12
7.6 Presentation of the result . 13
7.7 Characterisation parameter examples . 14
8 Synchronous method . 14
8.1 Equipment . 14
8.2 Test jig plate . 15
8.3 Synchronous fixture . 15
8.4 Preparation . 15
8.5 Test condition. 15
8.5.1 Test temperature. 15
8.5.2 Feed of solder paste and immersion condition . 15
8.5.3 Immersion and withdrawal conditions for the test specimen . 15
8.6 Test procedure . 15
8.7 Presentation of the results . 16
8.8 Characterisation parameter examples . 16
9 Temperature profile method . 17
9.1 Equipment . 17
9.2 Test jig plate . 17
9.3 Preparation . 18
9.4 Test condition. 18
9.4.1 Test temperature. 18
9.4.2 Feed of solder paste and immersion condition . 18
9.4.3 Immersion and withdrawal conditions for test specimen . 19
IEC CDV 60068-2-83 © IEC 2024 - 3 - 91/1968/CDV
9.5 Test procedure . 19
9.6 Presentation of the result . 20
9.7 Characterisation parameter examples . 21
Annex A (normative) Equipment for the quick heating and synchronous method . 22
A.1 General . 22
A.2 Test equipment . 22
A.2.1 General . 22
A.2.2 Measuring system . 22
A.2.3 Heating system . 22
A.2.4 Lift system . 22
Annex B (informative) Reading of the output data and correction of the result in the quick
heating test . 23
B.1 General . 23
B.2 Reading of the output form in the quick heating test . 23
B.3 Correction to the typical data attained by the quick heating method . 24
Annex C (normative) Test equipment for the temperature profile method . 26
C.1 General . 26
C.2 Test equipment . 26
C.2.1 General . 26
C.2.2 Measuring system . 26
C.2.3 Heating system . 26
C.2.4 Lift system . 26
Annex D (informative) Reading of the output data and correction of the result in the
temperature profile test . 27
D.1 General . 27
D.2 Reading of the output form in the temperature profile test . 27
D.3 Correction to the typical data attained by the temperature profile method . 28
Annex E (informative) Caveats / Notes . 29
E.1 General . 29
E.2 Influences . 29
E.2.1 Solder paste . 29
E.2.2 Components. 29
E.3 Interpreting results – Examples . 30
E.3.1 Quick heating method . 30
E.3.2 Synchronous method . 31
E.3.3 Temperature profile method . 31
Bibliography . 33
Figure 1 – Example of the quick heating method test equipment . 10
Figure 2 – Example of test jig plate for quick heating and synchronous method . 11
Figure 3 – Example of the temperature profile . 11
Figure 4 – Example of applying solder paste to a test jig plate . 12
Figure 5 – Typical output shape of signal in the quick heating method . 14
Figure 6 – Example of synchronous method test equipment . 14
Figure 7 – Example of the synchronous fixture . 15
Figure 8 – Typical output shape of signal in the synchronous method . 16
91/1968/CDV - 4 - IEC CDV 60068-2-83 © IEC 2024
Figure 9 – Example of the system for temperature profile method test equipment. 17
Figure 10 – Example of the temperature profile . 18
Figure 11 – Example of applying solder paste to a test jig plate . 19
Figure 12 – Typical output shape of signal in the temperature profile method . 21
Figure B.1 – Typical wetting force changes in quick heating method . 24
Figure B.2 – Example of correction of the initial time of wettin
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