IEC 62258-1:2005

Semiconductor die products - Part 1: Requirements for procurement and use

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

General Information

• Status: Published
• Publication Date: 29-Aug-2005
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: PT 62258 - TC 47/PT 62258
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Apr-2009

Relations

• Revised: IEC 62258-1:2009 - Semiconductor die products - Part 1: Procurement and use
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 62258-1
First edition
2005-08
Semiconductor die products –
Part 1:
Requirements for procurement and use

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INTERNATIONAL IEC
STANDARD 62258-1
First edition
2005-08
Semiconductor die products –
Part 1:
Requirements for procurement and use

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 62258-1  IEC:2005(E)
CONTENTS
FOREWORD.5

INTRODUCTION .7

1 Scope .8

2 Normative references.8

3 Terms and definitions.9

3.1 Basic definitions .9

3.2 General terminology.9
3.3 Semiconductor manufacturing and interconnection terminology .11
4 General requirements .12
4.1 General .12
4.2 Identity .13
4.3 Source.13
4.4 Function .13
4.5 Electrical and physical characteristics .13
4.6 Geometry.13
4.7 Connectivity.13
4.8 Documentation .13
4.9 Test and quality .13
4.10 Handling .13
4.11 Assembly.13
4.12 Thermal data .13
4.13 Models .14
5 Data exchange.14
6 Requirements for bare die with and without connection structures .14
6.1 Form of supply.14
6.2 Die name.14
6.3 Die version .14
6.4 Manufacturer .14
6.5 Type number .14
6.6 Function .14
6.7 Information source.14

6.8 Data version .14
6.9 Units of measurement.14
6.10 Geometric view.14
6.11 Die size .15
6.12 Die thickness .15
6.13 Geometric origin .15
6.14 Dimension tolerances .15
6.15 Pad count .15
6.16 Pad information .15
6.17 Signal type.15
6.18 Technology.15
6.19 Semiconductor material .15
6.20 Substrate material .15
6.21 Substrate connection .16

62258-1 IEC:2005(E) – 3 –
6.22 Passivation material.16

6.23 Pad metallization .16

6.24 Backside finish .16

6.25 Wafer size .16

6.26 Wafer thickness.16

6.27 Wafer map.16

6.28 Power dissipation.16

6.29 Operating temperature.16

6.30 Packing .16

6.31 Supplier.16

6.32 Bump material .16
6.33 Bump size.17
6.34 Bump height tolerance .17
6.35 Connection material.17
6.36 Die picture .17
6.37 Die fiducials.17
7 Minimally packaged devices .17
7.1 General .17
7.2 Terminal position .17
7.3 Terminal size .17
7.4 Number of terminals .18
7.5 Package size .18
7.6 Seated height .18
7.7 Encapsulation material.18
7.8 Terminal material.18
7.9 Package style code.18
8 Test, quality and reliability.18
8.1 General .18
8.2 Outgoing quality level.18
8.3 Electrical parameters specified .18
8.4 Compliance to standards .18
8.5 Additional device screening.19
8.6 Reliability.19
8.7 Product status .19
9 Requirements for handling and shipping.19

9.1 General .19
9.2 Specific requirements for bare die or wafers - Die version .20
9.3 Specific requirements for wafers - Product grading.20
9.4 Special item requirements.20
10 Requirements for storage.21
10.1 General .21
10.2 Storage duration and conditions .21
10.3 Long-term storage .21
11 Information related to assembly .21
11.1 General .21
11.2 Attach methods and materials .21
11.3 Bonding method and materials .22

– 4 – 62258-1  IEC:2005(E)
Annex A (informative) Terminology.23

A.
...