IEC PAS 62185:2000

Thermal shock test method

This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.

General Information

• Status: Replaced
• Publication Date: 21-Aug-2000
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: WPUB - Publication withdrawn
• Start Date: 30-Jun-2002
• Completion Date: 01-Jul-2002

Relations

• Replaced By: IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 05-Sep-2023

Standards Content (Sample)

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2000-08
Thermal shock test method
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62185
C O MMI S S I O N
Copyright © 1995, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
THERMAL SHOCK TEST METHOD
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62185 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1458/PAS 47/1491/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1995, JEDEC; 2000, IEC

JESD22-A106-A
TEST METHOD A106-A
THERMAL SHOCK
(From Council Ballot JCB-94-51 formulated under the cognizance of
JC-14.1 Committee on Reliability Test Methods for Packaged
Devices)
CONTENTS
Page
1. PURPOSE
2. APPARATUS
3. PROCEDURE
4. SUMMARY
-ii-
Copyright © 1995, JEDEC; 2000, IEC

JESD22-A106-A
Page 1
TEST METHOD A106-A
THERMAL SHOCK
1. PURPOSE
This test is conducted to determine the resistance of a part to
sudden exposure to extreme changes in temperature and to the effect
of alternate exposures to these extremes.
1.1 Terms and Definitions
1.1.1 Load
The specimens under test and the fixtures holding those specimens
during test.
The maximum load shall be the maximum mass of specimens
and fixtures that can be placed in the working zone of the bath while
maintaining specified temperature and times.
1.1.2 Monitoring Sensor
The
...